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1、Automotive CockpitSoCResearchReport,2024M Automotive Cockpit SoC Research:Automakers quicken their pace of buying SoCs,and thepenetration of domestic cockpit SoCs will soarMass production of local cockpit SoCs is accelerating,and thelocalization rate will reach up to 25%in 2030.Chinese electric vehi

2、cle makers are quickening their pace ofpurchasing domestic chips,so as to lessen their dependenceon imported chips.According to the informal goals,it isexpected that the overall penetration of homemade automotivechips will be increased to higher than 20%in 2025,and state-owned and private automakers

3、 will be encouraged to purchasedomestic chips.This is undoubtedly a great boon to Chinesecockpit SoC vendors.According to ResearchInChinas statistics,Chinas local cockpitSoCs took a just about 4.8%share of the Chinese passengercar market in 2023.Driven by policies and technologicalmaturity,it is con

4、ceivable that the penetration of domesticcockpit SoCs will further rise,up to 25%in 2030.At present,local cockpit SoC vendors are in the rapiddevelopmentphase,speedingupthelaunchandmassproduction of new products.Quite a few local cockpit SoCvendors such as SemiDrive,SiEngine,AutoChips and Huaweihave

5、 achieved large-scale mass production and covered muchmore passenger car SemiDrives X9 familySemiDrives X9 family of intelligent cockpit productscovers entry-level to flagship-level cockpit applicationscenarios,for example,cluster,IVI,cockpit domaincontrolandcockpit-parkingintegration,meetingdiverse

6、 needs,with shipments of over one millionpieces,rich mass production experience and matureecosystem.Automakers like SAIC,Chery,Changan,GAC,BAICandDongfengNissanallhavemass-producedmodelsequippedwithX9SoC.Manyleadingautomotive software ecosystem partners inside andoutside China,such as AliOS,QNX,Unit

7、y,Kanzi,QT,Tinnove and CalmCar,have completed adaptation onSemiDrive X9.Now SemiDrive is Chinas first and theonly chip company that has entered QNXs boardsupport package(BSP) Major Players Cockpit SOC ProductsIn 2023,SiEngine mass-produced Longying No.1 SoCs for Geely Lynk&Co 08/06 and other models.

8、With total shipments of 200,000units in 2023,the product was designated for more than 20 models.AC8015,AutoChips entry-level cockpit SoC,has been shipped 3 million units in total,while the companys mid-to-high-end cockpit SoCAC8025 has been designated by two international OEMs and will come into mas

9、s production in 2024.In line with the diversity of the automotive market,Chinese cockpit SoC companies also keep developing new products to adapt to thebooming cockpit market and meet customer demand.Just recently,SemiDrive launched X9H 2.0G,a new product in X9 SoC family.As an upgraded product of X

10、9H,X9H 2.0G is developedfor mainstream infotainment systems,and adopts a 16nm automotive-grade process,with the main frequency rising from 1.6GHz to2.0GHz,the CPU compute of 45KDMIPS and the GPU compute of 140GFLOPS,catering to the increasing computing powerrequirement of cockpit infotainment system

11、s and helping automakers further optimize cockpit experience.While improving the performance of Cortex-A,X9H 2.0G is equipped with more Cortex-R cores.It has 3 pairs of dual-core lockstepCortex-R5F,compared to X9H with 2 pairs.With a built-in high-performance HSM engine and an independent safety isl

12、and,it complieswith ASIL-B functional safety standards.More high-security lock-step Cortex-R cores allow for deployment of fast RVC/AVM,safedisplay and other functions.In addition,X9H 2.0G has a built-in lightweight NPU,which can accelerate AI applications such as voicerecognition and DMS SemiDrive

13、X9H 2.0GX9H2.0Gintegrateshigh-performanceVPUandsupports4Kvideoencoding/decoding.It integrates rich video input/output interfaces,includingMIPI DSI/CSI,Parallel CSI and LVDS.Also X9H 2.0G supports multiplememory interfaces(such as LPDDR4/4X,eMMC,QSPI and SDIO),high-speed interfaces(such as Gigabit Et

14、hernet,PCIe3.0,and USB3.0)thatsupport the TSN protocol,SPDIF and I2S audio interfaces,and generalperipheral interfaces(such as I2C,SPI,ADC and UART).It also enablesbody CAN FD network access.X9H 2.0G and other products in the X9 family maintain the hardware Pin-To-Pin compatibility and software comp

15、atibility,and can use SemiDrivesreference design and mass production experience to greatly reduce R&Dinvestment in switching and upgrading and accelerate the mass productionprocess.So far,X9H 2.0G has been designated by multiple OEMs,includingindependent and joint venture brands.The models involved

16、will bemass-produced and rolled out as soon as late As the competition in high-end cockpit SoCs becomes white-hot,the pattern changes from“one superpower and several powers”to“multiple powers”Qualcomm rules the roost in the high-end cockpit SoC market with the pattern of“onesuperpower and several po

17、wers”.Facing the intelligent cockpit market worth RMB100 billionand driven by introduction of vehicle AI foundation models and 3A games into cars,cockpitchip players such as Intel,NVIDIA,MediaTek,and AMD have also begun to make efforts toseize a larger market share.Starting from 2024,cockpit SoCs wi

18、ll see a new market melee,and the battle for the nexthegemon will officially kick off.MediaTek:partnered with NVIDIA to lay out 3nm cockpit SoCs to challenge Qualcommsdominance.In March 2024,MediaTek,which features the most cost-effective cockpit SoCs,together withNvidia,a dominant leader in intelli

19、gent diving SoC field,announced four new automotiveSoCs within its Dimensity Auto Cockpit portfolio:CX-1,CY-1,CM-1,and CV-1.Based on a3nm process(the most advanced for cockpit SoC),the SoCs integrate a state-of-the-artARM v9-A system and NVIDIAs next-gen GPU accelerated AI computing and NVIDIA RTXgr

20、aphics.The AI-enabled Dimensity Auto Cockpit platform runs large language models(LLMs)in the car.To help lower bill-of-material(BOM)costs,the Dimensity Auto Cockpit CX-1,CY-1,CM-1,and CV-1 chipsets are highly integrated with built-in multi-camera HDR ISPand audio DSP to enable multiple functions suc

21、h as AR HUD and electronic rearview mirrors.The Dimensity SoCs can reduce BOM cost,offer high computing power and low powerconsumption,and have flexible AI architecture and high scalability.They can cover severalvehicle segments from premium to entry-level.They are planned to be mass-produced andins

22、talled in vehicles in 2025.This is a new challenge posed by MediaTek and Nvidia to Qualcomm,so to speak.They willleverage MediaTeks market share and customer resources in the cockpit market andNvidias high-performance AI technology and brand to seize a share in the cockpit Intel SDV SoC FamilyIntel:

23、Driven by AI foundation models,Intel officiallyannounced its return to the cockpit market,and plans toput AI PCs on vehiclesAt CES 2024,Intel announced plans to drive thecompanys AI everywhere strategy into the automotivemarket,focusing on SoCs for intelligent cockpits,electricvehicle(EV)energy mana

24、gement and open automotivechip customization.Intel launched the first generation ofthe SDV SoC family.It is expected to restore the glory ofApollo Lake which prevailed in the high-end cockpitmarket.The product integrates Intels AI acceleration technology,supports 12 applications such as camera-based

25、 driverandoccupantmonitoring,electronicmirrors,high-definition video conference calls and PC games,and canrun in multiple operating systems simultaneously.Inorder to reduce the cost as much as possible,it seems tocompete with AMD V1000 series or Qualcomm SA8155.Geelys ZEEKR brand will be the first O

26、EM to use Intelsnew family of SDV SoCs in AMD RyzenTMEmbedded V2000AAMD:launchedV2000A,anew-generationhighperformanceautomotive product which outperforms Qualcomm 8295.AMD,the PC chip giant that entered the cockpit market through Tesla,also works on SoC.At the beginning of 2024,AMD introduced theRyz

27、enTMEmbedded V2000A Series processor.Built on 7nm processtechnology,Zen 2 cores and high-performance AMD Radeon Vega 7graphics,the AMD Ryzen Embedded V2000A Series processorprovides a new class of performance.It delivers high-definitiongraphics,with enhanced security features and automotive software

28、enablement through hypervisors in addition to support for AutomotiveGrade Linux and Android Automotive.The V2000A Series is designedfor gaming.For the cockpit market that more highlights entertainmentexperience,it is undoubtedly a high-end series with both highperformance and high cost performance.I

29、t will be first installed onSmart models.The CPU performance of V2000A is about 360-370kDMIPS,88%higher than the previous V1000 series,and much higher thanQualcomm SA8295P Qualcomm SA8295Qualcomm:with SA8295 widely used in vehicles,work to deploy the next-generation cockpit SoCsIt must be admitted t

30、hat with 8155 Qualcomm has become a king in thecockpit SoC market,too dominant to shake.Since October 2023,SA8295P,its fourth-generation cockpit SoC with a 5nm process,has been mass-produced and mounted on models like Jiyue 01,New Mercedes-Benz E-Class and Galaxy E8.As of March 2024,over 20 models h

31、ad beenannounced to be launched on market with Qualcomm SA8295.Meanwhile,Qualcomms fourth-generation SoC 8255 has also been production-ready,and it will first land on Neta L.In addition to automotive-grade products,Qualcomm is also a major supplierapplying consumer-grade chips to cockpits.BYD is a m

32、ajor customer of itsconsumer-grade cockpit chips.In 2023,BYD launched a new high-end brand named Yangwang.The firstmodel Yangwang U8 carries a 4nm 5G high-performance cockpit chipcustomized in cooperation with Qualcomm,presumed to be Snapdragon 8+Gen1(SM8475).The chip boasts 16GB RAM and LPDDR 5X me

33、mory,andalso integrates 5G baseband technology,with the fastest download rate of1G/second.It is 100%compatible with the Android ecosystem,and itsconfiguration is comparable to the top-class tablet PCs unveiled in 2022.Cockpit SoCs are being launched at an ever faster pace,close to theconsumer market

34、.To follow the trend towards cockpit-driving integration,in 2023 Qualcommunveiled Snapdragon Ride Flex family of SoCs,high-performance cockpit-driving integration products,all with a 4nm process and AI compute notlower than 2000TOPS.This family can act as a bridge between new and oldsolutions and re

35、duce the sunk costs of iteration for automakers.It isexpected to be mass-produced in Amid the needs for cost reduction,high computing power and high integration,chiplettechnology is often mentioned in the cockpit SoC marketIn the evolution of intelligent vehicles,automotive chips,especiallyhigh-comp

36、uteautomotiveSoCs,constantlymake breakthroughs in performance and cost.On the onehand,advanced processes are improving,with the greatpotential to catch up with consumer chips.On the otherhand,chiplettechnologycreatesnewpossibilities.As advanced processes iterate to 5nm and 3nm,MooresLaw gradually sl

37、ows down,and the development costs anddifficulty of advanced processes increase day by day.Yetnot all chip vendors can spread the high R&D coststhrough multiple large-scale application markets as Nvidiaand Qualcomm.In this regard,the semiconductor industryhas begun to expand new technology routes in

38、 an attemptto continue Moores Law,and the concept of chiplet wasthus proposed.In high-compute automotive SoC fields(such as cockpit),starting from 2023 multiple companies have said that theywill deploy the next generation of high-performance SoCsusing chiplet Amid the needs for cost reduction,high c

39、omputing power and high integration,chiplettechnology is often mentioned in the cockpit SoC marketAt the beginning of 2024,Intel launched the first SDV SoC familybuiltonchiplettechnology.ThroughIntelsUniversalChipletInterconnect Express,the third-party chiplet can be integrated intoIntels automotive

40、 products,breaking from the traditional model ofusing monolithic SoCs.Based on the chiplet architecture,Intel canprovide a customized computing platform,that is,the chipletdesigned by OEMs is integrated with Intels CPU,GPU and NPU tosatisfy the diversified computing power combinations of the OEMs.In

41、 terms of 3D packaging,Intel will work with InteruniversityMicroelectronicsCentre(IMEC)toensurethepackagingtechnologies meet the rigorous quality and reliability requirements ofthe automotive industry.Intels open chiplet platform strategy eliminates the risk of vendorlock-in for automakers and promo

42、tes competition and innovation inthe market,but it needs to convince automakers to adopt its SoCsto build a strong ecosystem and succeed in the automotive industry.In the 3nm automotive SoC design on which MediaTek and NVIDIA work together,the high-speed interconnect between the main chip and the GP

43、U chipletis realized using chiplet technology.In January 2024,12 Japanese automakers,components manufacturers and five semiconductor companies formed Advanced SoC Research for Automotive(ASRA),aiming to develop more efficient next-generation automotive SoCs using chiplet technology,build automotive

44、chiplet technology by 2028 and installSoCs in production vehicles in Table of Content(1)1 Overview of Automotive Cockpit SoCs 1.1 Performance Comparison between Cockpit SoCs1.1.1 Overview of Cockpit SoCs 1.1.2 Composition of Cockpit SoCs1.1.3 Design Process of Cockpit SoCs1.1.4 Development History o

45、f Cockpit SoCs1.1.5 Comparison between Main Cockpit SoCs(1)1.1.6 Comparison between Main Cockpit SoCs(2)1.1.7 Comparison between Main Cockpit SoCs(3)1.1.8 Comparison between Main Cockpit SoCs(4)1.1.9 Comparison between Main Cockpit SoCs(5)1.1.10 Comparison between Main Cockpit SoCs(6)1.1.11 Cockpit

46、SoC Ranking by CPU Compute(1)1.1.12 Cockpit SoC Ranking by CPU Compute(2)1.1.13 Cockpit SoC Ranking by CPU Compute(3)1.1.14 Cockpit SoC Ranking by CPU Compute(1)1.1.15 Cockpit SoC Ranking by CPU Compute(2)1.1.16 Cockpit SoC Ranking by NPU Compute1.1.17 Specifications of Cockpit SoC Memory1.1.18 Soft

47、ware Operating System Supported by Cockpit SoCs1.1.19 Display and Cameras Supported by Cockpit SoCs1.1.20 Automotive-grade Safety Certification of Cockpit SoCs1.1.21 Functional Safety Certification and Implementation Methods of Cockpit SoCs1.2 Summary of Cockpit SoC Market,2023-20241.2.1 Cockpit SoC

48、 Development Planning of Major Companies:Overseas1.2.2 Cockpit SoC Development Planning of Major Companies:China1.2.3 Development Features of Cockpit SoC Market,2023-2024(1)1.2.4 Development Features of Cockpit SoC Market,2023-2024(2)1.2.5 Development Features of Cockpit SoC Market,2023-2024(3)1.2.6

49、 Development Features of Cockpit SoC Market,2023-2024(4)2 Automotive Cockpit SoC Configuration and Strategy 2.1 Cockpit SoC Market Size2.1.1 Global Intelligent Cockpit SoC Penetration 2.1.2 Chinas Intelligent Cockpit SoC Penetration 2.1.3 Chinas Intelligent Cockpit SoC Market Size2.1.4 Intelligent C

50、ockpit SoC Installations in China,20222.1.5 Market Share of Intelligent Cockpit SoCs(by Supplier)in China,20222.1.6 Market Share of Intelligent Cockpit SoCs(by Chip Model)in China,20222.1.7 Levels of Intelligent Cockpit 2.2 Cockpit SoC Competitive Pattern 2.2.1 Overview of Cockpit SoC Competitive Pa

51、ttern 2.2.2 Market Pattern of Cockpit SoCs for Low-to-mid-end Models2.2.3 Cockpit SoC Market for Mid-to-high-end Models 2.2.4 Competitive Pattern of Foreign Cockpit SoC Vendors 2.2.5 Cockpit SoC Pattern of Chinese Companies2.2.6 Cockpit SoC Vendors Provide Hardware+Software Integrated Solutions2.2.7

52、 Consumer-grade Chips Are Used in IVI Systems2.2.8 The Cockpit SoC Supply of OEMs Is Still Mainly Based on the Tier1 Model2.2.9 The Automotive Cockpit SoC Supply Model Has Gradually Changed2.2.10 Cost Structure of Cockpit Domain Controllers 2.2.11 Cockpit SoC Shipment Price2.2.12 Cockpit SoC Applica

53、tion Trends of Major OEMs2.3 Intelligent Cockpit SoC Selection Strategy for Models by Price Range 2.3.1 Cockpit SoC Configuration Strategy for Models Priced at RMB500,000 and Above2.3.1.1 Intelligent Cockpit SoC Configuration of Models Priced at above RMB500,000 in China,20232.3.1.2 Intelligent Cock

54、pit SoC Selection for Main Models Priced at above RMB500,000 in China,2023-2024 2.3.2 Intelligent Cockpit SoC Configuration Strategy for Models Priced at RMB400,000-500,000 2.3.2.1 Intelligent Cockpit SoC Selection for Models Priced at RMB400,000-500,000 in China,2023-2024 Table of Content(2)2.3.2.2

55、 Intelligent Cockpit SoC Selection for Main Foreign Brand Models Priced at RMB400,000-500,000in China,2023-20242.3.2.3 Intelligent Cockpit SoC Selection for Main Independent Brand Models Priced at above RMB500,000 in China,2023-2024 2.3.3 Intelligent Cockpit SoC Configuration Strategy for Models Pri

56、ced at RMB350,000-400,000 2.3.3.1 Intelligent Cockpit SoC Selection for Models Priced at RMB350,000-400,000 in China,2023-2024 2.3.3.2 Intelligent Cockpit SoC Selection for Main Foreign Brand Models Priced at RMB350,000-400,000 in China,2023-2024 2.3.3.3 Intelligent Cockpit SoC Selection for Main In

57、dependent Brand Models Priced at RMB350,000-400,000 in China,2023-20242.3.4 Intelligent Cockpit SoC Configuration Strategy for Models Priced at RMB300,000-350,000 2.3.4.1 Intelligent Cockpit SoC Selection for Models Priced at RMB300,000-350,000 in China,2023-2024 2.3.4.2 Intelligent Cockpit SoC Sele

58、ction for Main Foreign Brand Models Priced at RMB300,000-350,000 in China,2023-2024 2.3.4.3 Intelligent Cockpit SoC Selection for Main Independent Brand Models Priced at RMB300,000-350,000 in China,2023-2024 2.3.5 Intelligent Cockpit SoC Configuration Strategy for Models Priced at RMB250,000-300,000

59、 2.3.5.1 Intelligent Cockpit SoC Selection for Models Priced at RMB250,000-300,000 in China,2023-2024 2.3.5.2 Intelligent Cockpit SoC Selection for Main Foreign Brand Models Priced at RMB250,000-300,000 in China,2023-2024 2.3.5.3 Intelligent Cockpit SoC Selection for Main Independent Brand Models Pr

60、iced at RMB250,000-300,000 in China,2023-2024 2.3.6 Intelligent Cockpit SoC Configuration Strategy for Models Priced at RMB150,000-250,000 2.3.6.1 Intelligent Cockpit SoC Selection for Models Priced at RMB150,000-250,000 in China,2023-2024 2.3.6.2 Intelligent Cockpit SoC Selection for Main Foreign B

61、rand Models Priced at RMB150,000-250,000 in China,2023-2024 2.3.6.3 Intelligent Cockpit SoC Selection for Main Independent Brand Models Priced at RMB150,000-250,000 in China,2023-2024(1)2.3.6.4 Intelligent Cockpit SoC Selection for Main Independent Brand Models Priced at RMB150,000-250,000 in China,

62、2023-2024(2)2.3.7 Intelligent Cockpit SoC Configuration Strategy for Models Priced at RMB150,000 and Below 2.3.7.1 Intelligent Cockpit SoC Selection for Models Priced at RMB150,000 and Below in China,2023-2024 2.3.7.2 Intelligent Cockpit SoC Selection for Main Foreign Brand Models Priced at RMB150,0

63、00 and Below in China,2023-2024 2.3.7.3 Intelligent Cockpit SoC Selection for Main Independent Brand Models Priced at RMB150,000 and Below in China,2023-2024(1)2.3.7.4 Intelligent Cockpit SoC Selection for Main Independent Brand Models Priced at RMB150,000 and Below in China,2023-2024(2)2.4 Cockpit

64、SoC Installation of Overseas Suppliers,2023-20242.4.1 Qualcomms Cockpit SoC Installation in Models and Trend,2023-20242.4.1.1 Chinas TOP20 Brands by Installation of Qualcomm Cockpit SoCs in L1+Intelligent Cockpit Vehicles,2023 2.4.1.2 Chinas TOP20 Models by Installation of Qualcomm Cockpit SoCs in L

65、1+Intelligent Cockpit Vehicles,2023 2.4.1.3 Distribution of Qualcomm Cockpit SoCs in Models by Price Range,20232.4.1.4 Models Announced to Adopt Qualcomms Next-generation Cockpit SoCs,20242.4.2 AMDs Cockpit SoC Installation in Models and Trend,2023-20242.4.3 Samsungs Cockpit SoC Installation in Mode

66、ls and Trend,2023- Table of Content(3)2.5 Cockpit SoC Installation and Trends of Chinese Suppliers,2023-20242.5.1 SemiDrives Cockpit SoC Installation in Models and Trend,2023-20242.5.2 Huaweis Cockpit SoC Installation in Models and Trend,2023-20242.5.3 MediaTeks Cockpit SoC Installation in Models an

67、d Trend,2023-20242.5.4 SiEngines Cockpit SoC Installation in Models and Trend,2023-2024 3 Key Development Trends of Automotive Cockpit SoCs3.1 Topic 1:Mass Production of Qualcomm 8295 Has Started,and Who Will Be the Next?3.1.1 What Do OEMs or Tier1 Suppliers Value Most When Choosing A Cockpit SoC?(1

68、)3.1.2 What Do OEMs or Tier1 Suppliers Value Most When Choosing A Cockpit SoC?(2)3.1.3 Logic behind Qualcomm Snapdragon 8155 Being Recognized3.1.4 Business Model Logic of Fourth-generation Qualcomm Snapdragon SA8295P 3.1.5 The Upgrading of High-end Cockpit Chips Accelerates,and Mass Production of Qu

69、alcomm Snapdragon 8295 Starts 3.1.6 What Can Qualcomm Snapdragon 8295 Bring to Intelligent Vehicles?3.1.7 Who are Laying out the Next-generation High-performance Cockpit SoCs?3.1.8 Possible Ways to Surpass Qualcomm3.2 Topic 2:Do Server/PC Solutions Buck the Next-generation Cockpit SoC?3.2.1 AMD VS Q

70、ualcomm 3.2.2“ARM+Android”VS“X86+Linux”3.2.3 Do Server/PC Solutions Buck the Next-generation Cockpit SoC?(1)3.2.4 Do Server/PC Solutions Buck the Next-generation Cockpit SoC?(2)3.2.5 Main Products with X86 Architecture in the Cockpit Field(1)3.2.6 Main Products with X86 Architecture in the Cockpit F

71、ield(1)3.2.7 Optimal Combination of X86 Architecture and Self-developed Linux Desktop System in the Cockpit Field 3.2.8 AMDs Cockpit Cases 3.2.9 X86 Architecture Cockpit Cases 3.3 Topic 3:Breakthroughs in Cockpit SoC Localization3.3.1 Local Cockpit SoC Companies Work to Develop New Products amid the

72、 Localization Trend3.3.2 Domestic Cockpit SoCs Are in the Phase of Mass Production and Deployment in Vehicles3.3.3 Barriers to Cockpit SoC Localization3.3 Ways to Cockpit SoC Localization3.3.5 The Pace of Localization Quickens in the Trend towards Cost Reduction and Efficiency Improvement3.3.6 Cases

73、 3.4 Topic 4:How Will Cockpit SoCs Develop in the Trend towards Cockpit-driving Integration 3.4.1 As EEA Evolves,Cockpit-driving Integration Is around the Corner 3.4.2 Main Layout Modes of Automotive Central Computing Platforms3.4.3 Vehicle Central Computing Platform Architecture Solution 13.4.4 Veh

74、icle Central Computing Platform Architecture Solution 23.4.5 Intelligent Cockpit Development Forms in the Trend towards Cockpit-driving Integration 3.4.6 Requirements for Chips in the Trend towards Cockpit-driving Integration3.4.7 Cockpit SoCs Are Moving towards Central Computing SoCs3.4.8 Challenge

75、s to Central Computing SoCs3.4.9 Progress in Cockpit-driving Integration Chips3.4.10 Main Cases3.5 Topic 5:Optional CPU,GPU and Other Modules for Next-generation Cockpit SoCs3.5.1 Must-Have Capabilities for Cockpit SoCs3.5.2 Cockpit SoC Processes Are Getting Ever Smaller,and 3nm Chips Have Been Rele

76、ased 3.5.3 Cockpit SoC Products Have Ever Requirements for CPU/GPU Compute(1)3.5.4 Cockpit SoC Products Have Ever Requirements for CPU/GPU Compute(2) Table of Content(4)3.5.5 Cockpit SoC Products Have Ever Requirements for CPU/GPU Compute(3)3.5.6 Maximum AI Compute Required by Cockpit SoCs3.5.7 How

77、Many Functions Can Cockpit SoC Products Support 3.5.8 Cockpit SoC Design Schematic Diagram and Architecture3.5.9 Main CPU Cores Adopted by Main Cockpit SoCs Currently 3.5.10 ARM Architecture CPU Core Used in Vehicles 3.5.11 Development of Qualcomm CPU Architecture and Cores Used in Cockpits 3.5.12 O

78、ptional CPU Cores for Next-generation Cockpit SoCs3.5.13 Main GPU Cores Used in Main Cockpit SoCs Currently 3.5.14 Main GPU Cores Used in Main Cockpit SoC Products 3.5.15 Optional CPU Cores for Next-generation Cockpit SoCs3.6 Topic 6:What Packaging Technologies Are Needed by Next-generation Cockpit

79、SoCs?3.6.1 High-performance Cockpit SoC Processes Become Ever More Advanced 3.6.2 Main Cockpit SoC Packaging Processes3.6.3 Evolution of Cockpit SoC Packaging Technology(1)3.6.4 Evolution of Cockpit SoC Packaging Technology(2)3.6.5 Evolution of Cockpit SoC Packaging Technology(3)3.6.6 The Evolution

80、of Advanced Processes and the Slowdown of Moores Era Facilitate Technological Innovation of Chiplets3.6.7 Chiplets Facilitate the Development of High-compute Automotive SoCs(1)3.6.8 Chiplets Facilitate the Development of High-compute Automotive SoCs(2)3.6.9 Cockpit SoC and Chiplet3.6.10 Chiplet Adva

81、ntages 3.6.11 Chiplet Challenges3.6.12 How Much Cost Can Chiplet Technology Reduce3.6.13 Advantages of Chiplet Used in Cockpit SoC3.6.14 Main Companies That Use Chiplets to Lay out Cockpit SoCs3.6.15 Chiplet Integration Case(1)3.6.16 Future Development Trends of Chiplet3.6.17 Conventional Packaging

82、VS Advanced Packaging3.6.18 Main Types of Advanced Packaging 3.6.19 Underlying Packaging Technologies Supporting Chiplets3.6.20 Mainstream Packaging Technologies of Chiplet3.6.21 Advanced Packaging Technology Ecosystem Has Been Built3.6.22 Main Companies Deploying Advanced Packaging 3.6.23 New Dynam

83、ics3.6.24 Cases of Deploying Companies 3.6.25 Die-to-Die Chip-level Interconnect Standards3.6.26 Other Interconnect Technologies3.7 Topic 7:Transformation in Development Models and Supply Models of Cockpit SoCs under the Impetus of Intelligence 3.7.1 Automotive Chip Development Process Transformatio

84、n3.7.2 Novel Automotive Chip Development Process3.7.3 Cockpit SoC Supply Model Transformation3.7.4 Changes in Cockpit SoC Supply Demand of OEMs3.7.5 Cases of Cockpit SoC Supply Model Transformation 4 Foreign Cockpit SoC Vendors4.1 NXP 4.1.1 Automotive Processor Roadmap4.1.2 Parameters of i.MX 95 4.1

85、.3 i.MX 95 Adopts the Self-developed NPU 4.1.4 i.MX 95 Can Be Used in the Low-to-mid-end Cockpit Field 4.1.5 i.MX 8 Applications Processor Family 4.1.6 Main Performance Indicators of i.MX 8 Family(1)4.1.7 Main Performance Indicators of i.MX 8 Family(2)4.1.8 i.MX8QM Software Stack Module 4.1.9 Typica

86、l Cockpit Application Solutions of i.MX4.1.10 i.MX 6 for the Low-to-mid-end Market 4.1.11 i.MX Partner Ecosystem4.1.12 Operating Systems Supported by i.MX Table of Content(5)4.1.13 AI Algorithms Supported by i.MX4.1.14 i.MX and Future Cockpit System4.1.15 i.MX and Future Cockpit System4.1.16 Latest

87、Cockpit Dynamics4.2 Texas Instruments 4.2.1 TI Cockpit Chip4.2.2 J64.2.3 Texas Instruments Has a Place in the Mid-end Cockpit Processor Market 4.2.4 Parameters of Jacinto 64.2.5 Cockpit Solutions and Partners of Jacinto 64.3 Renesas 4.3.1 Profile4.3.1 The Fifth-generation R-Car Planning4.3.2 Chip Bu

88、siness4.3.3 The Automotive Product Line Was Further Expanded through the Acquisition of Dialog 4.3.4 The Automotive Product Line Was Further Expanded through the Acquisition of Dialog4.3.6 High-end Integrated Cockpit Solutions in Cooperation with Dialog4.3.7 High-end Cockpit Solutions Featured with

89、Tactile Sensing in Cooperation with Dialog4.3.8 Chip Capacity Expansion Plan4.3.9 Automotive Market Segment:R-Car Series4.3.10 R-Car Series for Cockpit Processors4.3.11 Cockpit SoC Product Line4.3.12 Main Features of Cockpit SoCs4.3.13 R-Car Gen3e4.3.14 Digital Cluster with Integrated Driver ID on R

90、-CARE 3e4.3.15 Android Integrated Cockpit on R-Carm3e4.3.16 Integrated Non-virtualized Intelligent Cockpit Solution4.3.17 Low-Cost Digital Instrument Cluster Reference Design4.3.18 Cockpit Trends4.3.19 R-Car in Future Automotive Architectures4.3.20 EEA Strategy4.3.21 R-Car Software Development Kit(S

91、DK)4.3.22 Software Platform4.3.23 Software-as-a-Service Platform4.3.24 Virtual Development Environment 4.3.25 Integrated Development Environment 4.3.26 Dynamics4.4 Qualcomm 4.4.1 Profile4.4.2 Digital Chassis4.4.3 Development History of Cockpit SoCs4.4.4 The Evolving Snapdragon Cockpit Platform Integ

92、rates Rich Software Ecosystems4.4.5 Cockpit Platform Integrates Multiple Functions4.4.6 Scalable Software Ecosystem of Cockpit Platform4.4.7 4th Generation Snapdragon Cockpit Platform4.4.8 Common Software Architecture of 4th Generation Snapdragon Cockpit Platform4.4.9 Parameters of SA8295P4.4.10 4th

93、 Generation Snapdragon Cockpit Platform:QAM8255P4.4.11 3rd Generation Snapdragon Cockpit SoC4.4.12 3rd Generation Snapdragon Cockpit SoC4.4.13 Parameters of Snapdragon SA8195P4.4.14 1st and 2nd Generation Snapdragon Cockpit SoC4.4.15 Major Cockpit Platform Customers4.4.16 Snapdragon Ride Flex SoC(1)

94、4.4.17 Snapdragon Ride Flex SoC(2)4.4.18 Functional Safety Layout of Snapdragon Ride Flex SoC 4.4.19 Software Reference Architecture of Snapdragon Ride Flex SoC4.4.20 Central Computing Chip:SA87754.4.21 Software Reference Architecture of SA87754.4.22 Other Cockpit-related Chips:Industry-grade QCS855

95、0/QCM85504.4.23 Latest Cockpit D Table of Content(6)4.5 Intel 4.5.1 Cockpit Processor Layout4.5.2 First-generation SDV SoC4.5.3 Hardware Architecture of SDV SoC4.5.4 Software Architecture of SDV SoC4.5.5 SDV SoCs Efficiency Advantages In Hardware-based Physical Separation4.5.6 Launch of AI PC Proces

96、sors4.5.7 Chip Customization Service4.5.8 A3900 Processor4.6 Samsung 4.6.1 Cockpit Processors4.6.2 Cockpit Processor:V9204.6.3 Cockpit Processor:V94.6.4 Cockpit SoCs 4.6.5 Automotive SoC Roadmap4.6.6 Strategic Cooperation with SemiDrive4.7 NVIDIA 4.7.1 Revenue4.7.2 Deep Learning Processors4.7.3 Coop

97、eration with MediaTek to Create Intelligent Cockpit Chips and Lay out the High-end Market4.7.4 Automotive Central Computing Chips4.7.5 Deep Learning Processors:Orin4.7.6 Deep Learning Processors:Parker4.7.7 Mercedes-Benz MBUX Used NVIDIAs Chips4.8 Telechips4.8.1 Focus on Low-to-mid-end and LCD Clust

98、ers 4.8.2 Development History of Dolphin Cockpit Processor4.8.3 Cockpit Chip:Dolphin 54.8.4 Cockpit Chip:Dolphin 3 Series4.8.5 Cockpit Chip:Dolphin+Series4.8.6 Major Customers4.8.7 Cockpit Application Solutions4.8.8 Dolphin 3 Intelligent Cockpit Solution4.8.9 iGentAIs Intelligent Cockpit Platform So

99、lution Based on Dolphin 34.8.10 iGentAIs Intelligent Cockpit Solution Based on Dolphin 54.8.11 Cockpit Dynamics4.9 AMD4.9.1 Automotive Processor Layout4.9.2 Automotive Digital Cockpit Chip Layout Roadmap4.9.3 The Latest Cockpit Chip:V2000A4.9.4 The Latest Cockpit Chip:V2000A4.9.5 Application Cases o

100、f V2000A4.9.2 The Cockpits of Teslas Full Range of Models Will Use AMD Processors4.9.7 Embedded V1000 Series4.9.8 Embedded V2000 Series4.9.9 Major Automotive Intelligent Cockpit Customers5 Chinese Cockpit SoC Vendors 5.1 SemiDrive5.1.1 Profile5.1.2 X9 Cockpit Series Products 5.1.3 Cockpit Chips:X95.

101、1.4 Block Diagram of X9 Series Application Solution5.1.5 Released the Latest Cockpit Product X9H 2.0G 5.1.6 Block Diagram of X9H 2.0G Reference Solution 5.1.7 X9SP All-scenario Cockpit Processors5.1.8 Flagship Cockpit Processor:X9U 5.1.9 Block Diagram of X9U Application Solution Table of Content(7)5

102、.1.10 The Second-generation Central Computer Architecture5.1.11 Cockpit-Parking Integrated System5.1.12 Cockpit-driving Integrated Controllers Based on SemiDrives Chips 5.1.13 Domestic Centralized Central Computing Units Based on SemiDrives Chips5.1.14 Cooperation Models(1)5.1.15 Cooperation Models(

103、2)5.1.16 Overseas Business Layout5.1.17 Application and Mass Production5.1.18 Application and Mass Production:Cockpit Customers5.1.19 Dynamics5.2 MediaTek5.2.1 Cockpit Chip Development5.2.2 Launch of Dimensity Auto Platform5.2.2 Launch of Dimensity Auto Cockpit Platform5.2.4 Cooperation with NVIDIA

104、in Creating Intelligent Cockpit Chips and Laying out the High-end Market 5.2.5 Released the Latest Dimensity Cockpit Chip5.2.6 Released the Latest Dimensity Cockpit Chip 5.2.7 MT86665.2.8 MT86755.2.9 MT8675 Chip Platform Virtualized Intelligent Cockpit Solution5.2.10 MT27155.2.11 MT2715 Cockpit Doma

105、in Controller Solution Based on Virtualized Isolation5.2.12 MT2715-based Cockpit System Architecture5.2.13 MT27125.2.14 Cooperation with ECARX5.2.15 Cockpit Development Planning5.3 Huawei Hisilicon5.3.1 Cockpit Chip:Kirin 710A5.3.2 Cockpit Chip:Kirin 990A5.4 AutoChips5.4.1 Cockpit SoC5.4.2 Cockpit S

106、oC Product Matrix5.4.3 Cockpit Processors:AC80255.4.4 Example of Cockpit Design Architecture Based on AC80255.4.5 Cockpit Processors:AC80155.4.6 Cockpit Processor System Architecture5.4.7 Integrated Light Cockpit Solution(1)5.4.8 Integrated Light Cockpit Solution(2)5.4.9 Architecture of Integrated L

107、ight Cockpit Solution5.4.10 SoC Software and Hardware Integrated Cockpit Solution5.4.11 Cockpit Chip Development Planning5.4.12 Partners&Customers5.5 SiEngine Technology 5.5.1 Profile5.5.2 Development History5.5.3 Intelligent Cockpit Chips:Longying No.1 5.5.4 Key Parameters of Intelligent Cockpit Ch

108、ips5.5.5 Cockpit Chip Software and Hardware Reference Design Platform5.5.6 Development Planning5.5.7 High-end Cockpit Solutions5.5.8 Flagship Cockpit Solutions5.5.9 Single-chip Cockpit-parking integration Solutions5.5.10 Cockpit-driving Integration Solutions5.5.11 Cooperation with ECARX and FAW to D

109、evelop an Intelligent Cockpit Platform based on Longying No.1 5.6 Rockchip5.6.1 Profile5.6.2 Development History5.6.3 Automotive Solution Application-Passenger Car S Table of Content(8)5.6.4 Automotive Solution Application-Commercial Vehicle Series5.6.5 Automotive Solution Application-Commercial Veh

110、icle Series5.6.6 Advantages of Self-developed IP5.6.7 RK3588M-“One-chip+Multi-screen”Solution 5.6.8 RK3588M-“One-chip+Multi-screen”Solution5.6.9 RK3568M-Center Console+AVM Integration Solution5.6.10 RK3358M-Full LCD Cluster and Center Console 5.6.11 RK3308M-Automotive Audio and Voice Solutions5.6.12

111、 RV11-DVR Solutions5.6.13 Localized Cockpit Solutions(1)5.6.14 Localized Cockpit Solutions(2)5.7 UNISoC5.7.1 Profile5.7.2 Intelligent Cockpit Chip:A78705.7.3 Intelligent Cockpit Chip:A78625.7.4 Software and Hardware Platform-based Products Can Adapt to a Variety of User Scenarios5.7.5 Intelligent Co

112、ckpit Domain Controller Platform5.8 Allwinner Technology 5.8.1 Automotive Market Layout5.8.2 Development History of Automotive SoCs 5.8.3 Cockpit Processors:T75.8.4 T7 Solution Architecture5.8.5 Cockpit Processors:T55.8.6 SoC Development Route5.8.7 Major Automotive SoC Customers6 Cockpit SoC Applica

113、tion Trends of OEMs6.1 BYD6.1.1 Cockpit Chip Planning6.1.2 New DiLink Cockpit Platform6.1.3 Cockpit-driving Integration Layout6.1.4 Development History of Cockpit SoCs6.1.5 Use Qualcomm 5G Solution Chips for Effective Cost Reduction6.1.6 Overseas Models Will Be Equipped with Qualcomm 8155 Cockpit So

114、lution 6.1.7 Cockpit SoC Distribution by Brand6.1.8 Cockpit SoCs of Dynasty Series6.1.9 Cockpit SoCs of Ocean Series6.1.10 Cockpit SoCs of Yangwang Brand 6.1.11 Cockpit SoCs of Denza Brand6.1.12 Cockpit SoCs of Fangchengbao6.1.13 Xuanji Architecture6.2 Tesla Cockpit SoC6.2.1 Intelligent Cockpit Hard

115、ware Iteration(1)6.2.2 Intelligent Cockpit Hardware Iteration(2)6.2.3 HW 4.0 Cockpit Domain6.2.4 System Architecture of MCU3.0 Infotainment Control Unit6.2.5 Hardware Configuration of MCU3.0 Infotainment Control Unit6.3 BMW Cockpit SoC6.3.1 Cockpit SoC Evolution6.3.2 IDC23(1)6.3.3 IDC23(2)6.3.4 IDC2

116、3 VS MGU226.3.5 MGU226.3.6 MGU216.3.7 MGU6.3.8 Cooperation with Qualcomm in Cockpit,Intelligent Driving and Other Technical F Table of Content(9)6.4 Mercedes-Benz Cockpit SoC6.4.1 Evolution of Cockpit Chips6.4.2 CIVIC Cockpit Hardware(1)6.4.3 CIVIC Cockpit Hardware(2)6.4.4 NGT76.4.5 Third-generation

117、 MBUX6.4.6 Second-generation MBUX6.4.7 First-generation MBUX6.4.8 NTG6 with Dual Architecture6.5 Volkswagen Cockpit SoC6.5.1 Cockpit SoC6.5.2 ICAS3 Cockpit6.5.3 ID.4 Cockpit6.5.4 CNS 3.0 Architecture6.5.5 Cooperation Dynamics(1)6.5.6 Cooperation Dynamics(2)6.6 Audi Cockpit SoC6.6.1 Intelligent Cockp

118、it SoC Evolution6.6.2 MIB with Dual System Architecture6.6.3 MMI System Architecture6.7 GM Cockpit SoC6.7.1 Intelligent Cockpit SoC6.7.2 Chip Layout6.7.3 Planning6.8 Ford Cockpit SoC6.8.1 SYNC Chip Evolution6.8.2 The Next-generation Cockpit System Is Planned to Adopt Android Automotive System and NX

119、P SoC6.8.3 SYNC+Chip Evolution6.8.5 Cockpit SoCs of Main Models6.8.2 New-generation Automotive Domain Controller6.8.6 SYNC4.0 Hardware6.8.7 Chip Layout Planning6.9 Volvo Cockpit SoC6.9.1 Cockpit SoC6.9.2 Cockpit of XC90 BEV6.9.3 Volvo and Qualcomm Cooperated to Deploy Intelligent Cockpits6.9.4 Cockp

120、it of EX90 SUV BEV6.10 Toyota Cockpit SoC6.10.1 Toyota Cockpit SoC6.10.2 Dismantling of Tundra Cockpit 6.10.3 Intelligent Cockpit of GAC Toyota T-SMART6.10.4 Intelligent Cockpit of FAW Toyota Space6.10.5 Chip Layout6.11 Hyundai Cockpit SoC6.11.1 Cockpit SoC6.11.2 The Cockpit System Will Use Samsungs

121、 Chips6.11.3 SDx Strategy 6.12 Nissan Renault6.12.1 Cockpit of Nissan Flagship EV Ariya6.12.2 Dismantling of Cockpit of Renault Mgane E-Tech Electric 6.13 Great Wall Motor Cockpit SoC6.13.1 Intelligent Cockpit SoC Layout6.13.2 Intelligent Cockpit SoC Configuration of Major Brands 6.13.3 Coffee Intel

122、ligence 2.0-Intelligent C Table of Content(10)6.13.4 Intelligent Cockpit Domain Layout Planning of Nobo Automotive Systems6.13.5 Intelligent Cockpit Domain Products of Nobo Automotive Systems6.13.6 Coffee OS-Intelligent Cockpit Planning6.14 GAC Cockpit SoC6.14.1 Intelligent Cockpit Layout6.14.2 High

123、-performance Immersed Cockpit:ADiGO PARK Metaverse6.14.3 Cockpit SoCs of Main Models6.14.6 Computing Unit SoC of GAC AION X-Soul Architecture6.15 Changan Cockpit SoC6.15.1 Intelligent Cockpit SoC6.15.2 Changan UNIBrain6.15.3 Super Digital Platform Architecture6.15.4 Intelligent Cockpit SoC of Main M

124、odels6.16 SAIC Cockpit SoC6.16.1 Intelligent Cockpit SoC6.16.2 Latest-generation Galaxy Intelligent Cockpit Solution of SAIC Z-ONE6.16.3 Z-ONEs Cockpit-driving Integrated HPC6.16.4 Z-ONEs Intelligent Cockpit Computing Platform:ZCM6.16.5 Z-ONE Galaxy?Cockpit-driving Integrated Computing Platform 6.16

125、.6 Mass Production of the First Cross-domain Fusion Central Brain 6.16.8 IM AI Cockpit 6.16.7 Ecosystem Partners6.16.9 Intelligent Cockpit SoC Configuration of Main Models6.17 Geely Cockpit SoC6.17.1 Cockpit SoC6.17.2 Cockpit SoC Configuration of ZEEKR6.17.3 Cockpit SoC Configuration of Lynk&Co6.17.

126、4 Cockpit SoC Configuration of Other Brand Models6.17.5 Cockpit Chip Layout6.17.6 Smart,ECARX and Immersive Intelligent Cockpit6.17.7 Cockpit SoC Planning in Smart Geely 20256.18 BAIC Cockpit SoC6.18.1 Passenger Car Cockpit SoC6.18.2 Cooperation between BAIC BluePark and Huawei6.19 Hongqi Cockpit So

127、C6.19.1 Cockpit SoC6.19.2 Chip Application Planning6.19.3 Intelligent Cockpit Platform Chip6.19.4 Cockpit-driving Integration Chip and Flag Intelligent Architecture6.19.5 Cockpit SoCs of Main Models6.20 Chery Cockpit SoC6.20.1 Cockpit SoC Configuration of Major Brands and Models6.20.2 Lion Intellige

128、nt Cockpit6.20.3 Lion Ecosystem6.20.4 Intelligent Cockpit SoC of EXEED STELLAR 6.20.5 AutoChips and Chery Built A Joint Laboratory for Automotive Chips6.21 Dongfeng Voyah Cockpit SoC6.21.1 Cockpit SoC6.21.2 Cockpit of Voyah Passion 6.21.3 Cockpit of Voyah Dreamer6.21.4 Cockpit SoCs of Dongfengs Othe

129、r Brands6.22 Li Auto Cockpit SoC6.22.1 Cockpit SoC Evolution6.22.2 MEGA Cockpit6.22.3 Cockpit of L Table of Content(11)6.23 NIO Cockpit SoC6.23.1 Cockpit SoC6.23.2 Cockpit System Evolution(1)6.23.3 Cockpit System Evolution(2)6.23.4 Central Computing Platform(ADAM)6.24 Xpeng Cockpit SoC6.24.1 Cockpit

130、 SoC6.24.2 Intelligent Cockpit System Iteration6.24.3 Dynamics in Cooperation6.25 Leapmotor Cockpit SoC6.25.1 Cockpit SoC6.25.2 Self-developed Intelligent Cockpit 3.0(1)6.25.3 Self-developed Intelligent Cockpit 3.0(2)6.25.4 Mid and High-end Cockpit Solutions6.25.5 Released the First Cockpit-driving-

131、parking Integration System6.26 Hozon Cockpit SoC6.26.1 Cockpit SoC of Neta Auto6.26.2 Intelligent Cockpit Based on Neta Shanhai Platform 2.0 6.26.3 Neta and Autolink World Jointly Lay out the Latest Cockpit Domain Controller and Cockpit-Driving Integration Domain Controller6.26.4 Neta Launched Haozhi Intelligent Vehicle Central Supercomputing Platform6.26.5 Neta and Jingwei Hirain Cooperated on Central Domain C ContactBeijing HeadquartersTEL:13718845418Email:Chengdu BranchTEL:028-68738514FAX:028-86930659Website:ResearchInChinaWeChat:Zuosiqiche