Data Center Modular Hardware System Specification (DC-MHS) the overview.pdf

1、The Data Center Modular Hardware System specifications have been a smash in the OCP community with great collaboration from industry leaders leading the development of these specifications(AMD,Ampere,Dell,Google,HPE,Intel,Jabil,Meta,Microsoft,and NVIDIA).In this session,the audience will learn the w

2、ho,what,when,where,and why of DC-MHS and at the same time getting an update on progress of each specification.Data Center Modular Hardware System(DC-MHS)Dirk Blevins Sr.Platform Architect,Sr.Principal Engineer Intel CorporationRob Nance Director of Technology Jabil Data Center Modular Hardware Syste

3、m(DC-MHS)SUSTAINABLE SCALABLE COMPUTATIONAL INFRASTRUCTURESERVEROpen Compute Project(OCP)Data Center Modular Hardware System(DC-MHS)SpecificationAccelerate sustainability:Lower carbon footprintRecyclable elements over generationsInventory efficiencyCommon Modular Building Blocks used to create multi

4、ple platforms:Reduce design costFaster time to market Economies of scale Greater design flexibility Enable innovationShort Depth EDGEOCP HyperscaleEnterpriseM-HPMM-FLWM-DNOM-XIOM-CRPSM-PICM-PESTIOCP DC-SCM r2.0OCP NIC r3.0M-SDNOM-SIFM-PnPDC-MHS Building BlocksDC-MHSHPMM-PnPRelatedOCPSpecsM-CRPSM-SIF

5、M-PICM-XIO/M-PESTiBase Building BlocksModular Plug and PlayDC-HPM(Host Processor Module)LeveragedModular Common Redundant Power SupplyeXtended I/O Connectivity&Peripheral Sideband Tunneling InterfacePlatform Infrastructure ConnectivityModular-Shared InFrastructureInitial1.0 SpecificationsReleasedM-S

6、IFSpec 0.3M-SIF Spec 0.75Q2 23Q3 23Q4 23Q1 24Q2 24M-SDNO Spec 0.3M-PIC Spec 1.04M-CRPS 1.04Q1 23Q3 24M-SDNO Spec 0.7M-SIFSpec 0.5M-DNO Spec 1.01M-PESTI Spec 1.1Future Evaluations:Embedded DC-SCMOCP NIC D-SFFEdge-MHSData Center Secure Control ModuleNetwork Interface CardHPMs are comprised of 3 catego

7、ries:Modular Full Width(M-FLW)Modular Density Optimized(M-DNO)Modular Scalable Density Optimized(M-SDNO)Intel DC-MHS M-FLW&M-DNO Reference SystemsIntel Full DC-MHS Reference SystemsEntire Suite of DC-MHS Coverage From Intel!M-FLW,M-DNO,M-XIOM-PESTI,M-PIC,M-CRPSValidated and Powered on Last Year!Addi

8、tional DC-MHS Systems Coming!M-FLW T1Deer CreekM-DNO T2Garden CityMeta Design for DNO SupportMeta is designing in M-SDNO support in our next gen chassisMetas interest in modular hardwareQuick evaluation and enablement of new technology Flexible configurations for various workloads Leverage availabil

9、ity from the broad ecosystemAccelerate time to productionIntroduction to“Scalable DNO”(M-SDNO)M-SDNO SpecificationDoes not use TypesDefines HPM Class A,B,C,DAll HPM Classes have:Consistent width and feature setAllow for variable lengthDefines Minimum and maximum lengthsDefines Common Chassis Interva

10、ls(CCI)Like a PCI CEM slot,an HPM with length CCI can be used in a chassis designed to the CCI0.7 MSDNO DraftV0.7 R1.0 Released Available Now!Minimal information on Class CSupersedes“Directional”0.3 document including Types 5,6 and 7New M-SDNO Form Factor“Classes”Class BClass A Applies to 19”and 21”

11、Infrastructure Optimal for larger 1S designs Adds 3rd Riser Location Custom Zone for E1 boot Applies to 19”and 21”Infrastructure Optimal for smaller 1S designs Adds 2nd Riser Location No Custom Zone M-DNO 2/3 compliant except for bottom side“Zone 2”KOZs Not intended for 19”infrastructure Optimal for

12、 1S or 2S“Spread”designs Layout supports 2x Type 5 overlayed at 262mm pitch Up to 6 risers supported Larger platform custom zones Not intended for 21”infrastructure Optimal for 1S or 2S“Spread”designs Layout supports 2x Type 2 overlayed at 213mm pitch Up to 4 risers supported Large platform custom z

13、one WidthFull Width19”21”Class CClass DM-SDNO HPM ScalabilityIntentProvide more flexibility by decoupling HPM outline from chassis dimensionsPrevent chassis proliferation with interoperable solutionsShorter HPMs work in any chassis that supports longer HPMsApproachFixed FeaturesAre dimensioned to th

14、e Common DatumNever move when HPM outline changesFloating FeaturesAre dimensioned to board edgesMove with the board edges as the edge changes relative to the datumM-SDNO HPM InteroperabilityHPM Class Compatibility Goals21”Class Overlay ExampleExample 19”Chassis185mm by 73.5mm 185mm by 60mm 265mm by

15、73.5mmM-CRPS Form Factors185mm by 60mm can be installed in a 185mm by 73.5mm bay with fillers on the sides M-CRPS Base Specification 1.02 RC1 released15+combined M-CRPS power supplies are in development by different partners.Design Specifications status:3200W 185mm by 73.5mm Titanium2400W 185mm by 7

16、3.5mm Titanium 1500W 185mm by 60mm Titanium 1100W 185mm by 60mm Titanium 800W 185mm by 60mm Titanium&Platinum 700W 185mm by 60mm Titanium600W 185mm by 60mm Titanium&PlatinumStandard test setup is work in progress.https:/ above figure is meant to depict common configurations;it is not an exhaustive l

17、ist of all possible and not possible combinations.M-PICThe Primary Control Panel Vision:Covers the maximum number of control panel features proposed.Provides flexible sidebands for control and management.Uses 12V power for control panel.Includes a SPI interface.Includes USB2 from DC-SCM.The Control

18、Panel Quantity Vision:Provides control panel flexibility by defining a 2nd connector.Ensures control panel pinouts are electrically safe.BackplanePeripheralHPMFan BoardPeripheral12V PICPWR ConnectorPCIe RiserPeripheral12V Power SourceSupply PinsReturn PinsChannel A Sideband12V PICPWR ExampleChannel

19、B SidebandThe 12V Power Architecture Vision:Provides 12V when any PSU output is enabledProvides flexible sidebands for control&managementDefines 12V PICPWR connectors with 2 channels12V PICPWR is keyed differently than 12VHPWRAllows for power ingress or egress.Moves power gating from HPM to peripher

20、alsDefines connector for(PDB2HPM)analog monitoringThe 48V Power Architecture Vision:48V support for Open Rack V3&48VHPWR AICs.Will define Topologies and connectors.Feedback on 48V usage is appreciated.Defines and standardizes connectors/interfaces/guidance needed to interface HPMs to platform and ch

21、assis infrastructure elements and subsystems.M-PIC defines connectors and interfacesM-PIC defines common connectors M-PIC provides interface guidanceM-PIC defines connectors and interfaces:M-PICM-PIC defines common connectors Intrusion Switch Header-M-PIC defines a 3-pin positive latching header wit

22、h a cable presence.Internal USB3 Host connector M-PIC specifies a USB3.1 vertical Type C connector.M-PIC welcomes feedback regarding Type A vs Type C and usage cases(e.g.,debug vs a product requirement).Coin Cell Battery Holder M-PIC defines the RTC battery holder sized for CR2032.M-PIC defines inte

23、rface guidanceCabled Boot Storage Peripheral(optional)is enabled by adoption of M-XIO x4 and a 12V PICPWR connection.DC-SCM Revision 2.0 is adopted for its improved features and for OCP alignment.Smart NIC Management ConnectivityM-PIC supports the option to interface using BMC USB2.0 host signals fr

24、om HPM through M-XIO to peripherals(x8 cable or wider).BMCDC-SCMHPMHub(s)for fanoutM-XIOM-XIOUSB2(BMC).DC-SCIM-PnP Big PictureTODAYBase Specs 1.XPlug&Code 2.0HW Design SpecsPlug&Play Lite 2.5Baseline Plug&Play 3.0Interop FrameworkDesign SpecsPHASE 1:FULL CUSTOMPHASE 2PHASE 2.5PHASE 3.0PHASE 4.0Inter

25、opRealization Design SpecsTBDCommon mechanicals+connectors,HW I/F Options;Safe HPM Type Detect;No DC-SCM HW re-use guarantee w/o HW co-designTrue SCM-to-HPM-to-Peripheral HW interop&HPM plumbing for all product requirements:Common PCB;BOM+code may vary)Improved abilities to power on/boot/discoverAbi

26、lity to fully discover&configure platform enablement domainM-SIF(Come and see us in the next session for more details)48V Sub-WorkstreamFuture M-HPM AdditionsSub-Workstream defining 48V power distributionHPM team supporting and providing feedback on implications to HPM designersWorkstream targeting

27、improved interoperability related to shared-infrastructure enclosures that contain multiple-nodes and/or serviceable sledsM-HPM team actively engaged in discussionsSupport for M-SIF interfaces will be added to M-HPM form factors once M-SIF reaches V1.0Call to Action Get Involved!DC-MHS Website:https

28、:/www.opencompute.org/projects/dc-mhsDC-MHS WIKI:https:/www.opencompute.org/wiki/Server/DC-MHS Training NoteBottom of WIKI has several useful training videos and presentations that are highly recommended.Public Email List SubscriptionEmail to:https:/ocp-all.groups.io/g/OCP-DC-MHSSubscribe at:OCP-DC-MHS+subscribeOCP-All.groups.ioPublic MeetingsMonthly meetings reoccur 3rd WED 8am PT monthly.Meeting logistics provided on DC-MHS Home Page Call Calendar.Meeting recordings posted to WIKI.Thank you!