1、CHIPS,NODES AND WAFERSA TAXONOMY FOR SEMICONDUCTOR DATA COLLECTIONAugust 2024 2 CHIPS,NODES AND WAFERS:A TAXONOMY FOR SEMICONDUCTOR DATA COLLECTION OECD 2024 This paper was approved and declassified by written procedure by the Digital Policy Committee(DPC)and the Committee on Industry,Innovation and

2、 Entrepreneurship(CIIE)on 26 July 2024 and prepared for publication by the OECD Secretariat.Note to Delegations:This document is also available on O.N.E.Members&Partners under the reference code:DSTI/DPC/CIIE(2024)1/FINAL This document,as well as any data and map included herein,are without prejudic

3、e to the status of or sovereignty over any territory,to the delimitation of international frontiers and boundaries and to the name of any territory,city or area.Cover image:HAKINMHAN/S OECD 2024 The use of this work,whether digital or print,is governed by the Terms and Conditions to be found at:http

4、s:/www.oecd.org/termsandconditions CHIPS,NODES AND WAFERS:A TAXONOMY FOR SEMICONDUCTOR DATA COLLECTION 3 OECD 2024 Foreword The semiconductor value chain is susceptible to disruptions that pose a considerable risk for modern economies.Better data are essential for policy makers to identify bottlenec

5、ks,monitor the balance between demand and supply of specific semiconductor types,and manage disruptions.This paper sets out a common taxonomy for semiconductor types and production facilities,to facilitate harmonised data collection and sharing.The taxonomy distinguishes semiconductor products into

6、four broad categories “logic”,“memory”,“analog”and“others”and sub-categories based on their prevalence and specific functions.Semiconductor production facilities are classified according to the technology used and ability to produce different types of semiconductors,the installed production capacity

7、,as well as other relevant plant(and firm)characteristics.This taxonomy will be the basis for a semiconductor production database and will be revised in the future,keeping up with developments in semiconductor technology.This paper was written by Chiraag Shah,Charles-douard Van de Put and Filipe Sil

8、va,under the direction of Audrey Plonk,Guy Lalanne and Verena Weber.The authors gratefully acknowledge feedback provided by the Semiconductor Informal Exchange Network participants as well as Angela Attrey,Gallia Daor,Gregory LaRocca,David Kanter,Jan-Peter Kleinhans,Tobias Proettel,Lea Samek,Sara Ro

9、maniega Sancho and Andy Sellars on the draft taxonomy and earlier versions of this document.The authors also thank Anasa Gonalves and Shai Somek for their support.4 CHIPS,NODES AND WAFERS:A TAXONOMY FOR SEMICONDUCTOR DATA COLLECTION OECD 2024 Table of contents Foreword 3 Executive summary 6 Introduc

10、tion 7 1 Scope for the taxonomy and semiconductor production database 8 A primer on the semiconductor value chain 8 Goals and policy questions 10 Principles for a semiconductor production database 12 2 Semiconductor manufacturing:Process,technologies and products 14 Main types of technologies 14 Typ

11、es of semiconductors 17 3 Existing taxonomies for semiconductors 20 SEMI 20 World Semiconductor Trade Statistics(WSTS)20 Compound Semiconductor Applications(CSA)Catapult 22 IEEE Taxonomy of Emerging Memory Devices 22 Other taxonomies 23 4 Proposed taxonomy for semiconductors 25 Building the evidence

12、 base:a taxonomy for a semiconductor production database 25 A taxonomy for semiconductor types 30 5 Future work 32 References 33 Annex A.HS codes relevant to semiconductors 36 Endnotes 37 CHIPS,NODES AND WAFERS:A TAXONOMY FOR SEMICONDUCTOR DATA COLLECTION 5 OECD 2024 FIGURES Figure 1.Semiconductor p

13、roduction stages 8 Figure 2.Share of semiconductor and primary value added demand,2018 10 Figure 3.Transistor types:Planar vs FinFETs vs.GAAFETs 16 Figure 4.Memory types of semiconductors 19 Figure 5.Catapult semiconductor taxonomy 22 Figure 6.IEEEs memory taxonomy 23 Figure 7.OECDs proposed semicon

14、ductor production taxonomy 27 Figure 8.Capability in chips fabs 27 Figure 9.Aggregated and detailed taxonomy for semiconductor types 30 TABLES Table 1.Summary of WSTS categorisation and product definitions 21 Table 2.Semiconductor production database variables and definitions 28 Table 3.Attributes o

15、f transistor type and process technologies 29 Table A A.1.HS codes relevant to semiconductor products 36 6 CHIPS,NODES AND WAFERS:A TAXONOMY FOR SEMICONDUCTOR DATA COLLECTION OECD 2024 Executive summary Semiconductors power modern economies and are integral to a myriad of advanced industrial product

16、s.Semiconductors are present in smartphones,computers,cars,home appliances,medical equipment,LED lights,or lasers,just to name a few.They encompass a diverse range of complex components,from advanced logic semiconductors enabling advanced computing and memory semiconductors for data storage,to basic

17、 sensors used in temperature measurement.Semiconductor manufacturing can be extremely complex,for example requiring advanced lithography machines to print on features measured in nanometres and cleanrooms with strict control over airborne particles.In spite of its critical importance,the semiconduct

18、or value chain is susceptible to disruptions.The semiconductor value chain is highly segmented into production stages taking place in different geographies,but with each stage often characterised by high geographical concentration.This poses a considerable risk for modern economies.Enhancing the res

19、ilience of the semiconductor value chain,requires evidence-based policy making.Better data are essential for policy makers to identify bottlenecks,monitor the balance between demand and supply of specific semiconductor types,and manage disruptions in value chains.The OECD Semiconductor Informal Exch

20、ange Network(hereafter the Network),convened in June 2023,brings together senior government officials to facilitate transparency and information exchange on semiconductor value chains.Informed by its exchanges and in view of different semiconductor taxonomies used across different economies,this pap

21、er sets out a common taxonomy for semiconductor types and production facilities(plants),to facilitate harmonised data collection and sharing.The taxonomy was developed by the Network and distinguishes semiconductor products into four broad categories “logic”,“memory”,“analog”and“others”and sub-categ

22、ories based on their prevalence,specific functions and end-uses.Semiconductor production facilities are classified according to the technology used and ability to produce different types of semiconductors(capability),as well as the installed production capacity.It also includes information on geogra

23、phic,demographic and other relevant plant(and firm)characteristics.This taxonomy will be the basis for a semiconductor production database.The taxonomy may therefore need to be revised in the future,keeping up with developments in semiconductor technology.Future extensions to the taxonomy could incl

24、ude,conditional on data availability,additional information on semiconductor firms,on end uses for semiconductors,or on semiconductor substitutability.CHIPS,NODES AND WAFERS:A TAXONOMY FOR SEMICONDUCTOR DATA COLLECTION 7 OECD 2024 Introduction The work of the OECD Semiconductor Informal Exchange Net

25、work(hereafter the Network)0F1 pointed to the importance of developing a taxonomy for types of semiconductors and production facilities(plants)to allow for harmonised data collection and sharing.A harmonised approach to data collection supports the objectives of the Network to increase the understan

26、ding about semiconductors and help members move towards more resilient semiconductor value chains.This paper provides the common semiconductor taxonomy developed by Network and lays down future work based on semiconductor production data.The complexity and distributed nature of the semiconductor val

27、ue chain is one of the key challenges to improving transparency and understanding.Developing a taxonomy for classifying semiconductor data that enables data integration and covers all stages of the production process is both important but also a challenging and resource-intensive endeavour.Therefore

28、,the Network is pursuing a two-pronged approach to the work on semiconductor data:i)conduct analyses focused on semiconductor fabrication/front-end manufacturing stage;ii)map the semiconductor ecosystem,including key upstream and downstream activities in the semiconductor value chain.This paper prov

29、ides a taxonomy for front-end manufacturing,laying the basis for analytical work on facilities,processes and products from this stage.Experience from the recent 2020-2022 semiconductor shortages and related analysis suggest that this stage can be an important bottleneck in the value chain(Haramboure

30、 et al.,20231).Nevertheless,other segments in the value chain can also present bottlenecks,notably when the supply of certain inputs is found to be highly concentrated.After describing the scope and objectives for the chips and fabs taxonomy and the semiconductor production database(Section 1),this

31、paper provides an overview of the semiconductor production process(Section 2),including the key inputs,technologies,chip types,and the end-use markets to help inform the taxonomy.Section 3 outlines different approaches to classifying semiconductor production facilities and products.Section 4 present

32、s the Networks proposed taxonomy for classifying semiconductor product types(chips)1F2 and plants(fabs),and the elements of a semiconductor production database to support the Networks objectives described previously in Section 1.Information on statistical classifications relevant to the semiconducto

33、r industry is provided in Annex A.8 CHIPS,NODES AND WAFERS:A TAXONOMY FOR SEMICONDUCTOR DATA COLLECTION OECD 2024 This section briefly defines the semiconductor value chain.It then explains the purpose of the chips and plants taxonomy and the principles for a semiconductor production database.A prim

34、er on the semiconductor value chain The semiconductor value chain consists of three core stages described in Figure 1:Design:This stage includes setting the requirements of the chip,designing its architecture,and validating its design on a test bench.Fabrication:Building on a wafer of semiconductor

35、material(typically silicon,see Section 2 for other materials),this stage consists in printing(or“etching”)the integrated circuit designed in the previous stage on the wafer.Occurring at a wafer fabrication plant(“fabs”),fabrication relies on many complex advanced manufacturing processes using manufa

36、cturing equipment and chemicals.Assembly,Test and Packaging(ATP):This stage involves slicing the wafers into individual chips,packaging the chips into frames or resin shells,and testing them.Figure 1.Semiconductor production stages Source:Haramboure,A.et al.(2023),“Vulnerabilities in the semiconduct

37、or supply chain”,OECD Science,Technology and Industry Working Papers,No.2023/05,OECD Publishing,Paris,https:/doi.org/10.1787/6bed616f-en.1 Scope for the taxonomy and semiconductor production database CHIPS,NODES AND WAFERS:A TAXONOMY FOR SEMICONDUCTOR DATA COLLECTION 9 OECD 2024 Semiconductor firms

38、have different business models.Integrated Device Manufacturers(IDMs)integrate all three core production stages while other firms specialise in a single stage,as part of out-sourcing and specialisation strategies.For example,“contract foundries”(also known as“pure-play foundries”)specialise in the fa

39、brication of chips(front-end)designed by other firms.“fabless”firms focus only on chip design.Similarly,Outsourced Semiconductor Assembly and Test(OSAT)firms focus only on the third and last production stage(back-end).2F3 The core semiconductor value chain relies on critical upstream inputs,includin

40、g:specialised software(Electronic-Design Automation,EDA),intellectual property necessary to design processor architecture,raw materials(e.g.silicon,rare earth minerals,platinum group metals,gallium,germanium),chemicals and gases,and capital equipment(deposition and lithography tools,metrology,and in

41、spection equipment)see Haramboure et al.(20231);Kleinhans and Baisakova(20202)for further details.The Emerging Technology Observatorys Semiconductor Supply Chain Explorer(ETO,20223)provides an interactive overview of the essential inputs involved at each stage of the chip manufacturing process.3F4 S

42、teps in the front-end manufacturing/semiconductor fabrication process Key steps in the fabrication process for chips include the following(Timings,20214):1.Deposition:Depositing thin films of conducting,isolating or semiconducting materials on a silicon wafer.2.Photoresist coating:Covering the wafer

43、 with a light-sensitive coating.3.Lithography:A photolithography tool passes light through a photomask to draw patterns into the silicon wafers,creating the tiny circuits that comprise semiconductors.4.Etching:Removing the degraded photoresist to reveal the intended pattern,using either gases(dry et

44、ching)or chemicals(wet etching).5.Doping:Introducing impurities into the semiconductor crystal to deliberately change its conductivity.This can be achieved by diffusion(inducing the movement of impure atoms from areas of high concentration to low concentration)or ion implantation(bombarding the sili

45、con wafer with positive or negative ions to create transistors).Advanced packaging blurs the line between front-and back-end manufacturing The introduction of advanced packaging techniques,such as heterogeneous integration and silicon stacking,allows for multiple integrated circuits(IC)in the same p

46、ackage,enhancing chip performance beyond traditional geometric scaling.The trend for increasing integration within a single chip package(as an alternative to multiple chips on a circuit board)is also driven by product cost engineering(Bailey,20245).The advanced packaging market is dominated by fan-o

47、ut wafer-level packaging with about 60 percent market share(Burkacky,Kim and Yeom,20236),but newer technologies include 2.5-D or 3-D stacking,integrated fan-out(InFO),and system-on-chip technologies,enabling the stacking of chips or wafers vertically with an interposer connecting the stacked chips(B

48、urkacky,Kim and Yeom,20236).There are several categories of 2.5-D and 3-D stacking,based on the kind of interposer used,and different manufacturers use different interposer technologies(Patel,20227;Burkacky,Kim and Yeom,20236).TSMC leads the market with their chip-on-wafer-on-substrate(CoWoS)technol

49、ogy,which is the most popular packaging technology for advanced logic chips,including those used in artificial intelligence(AI)applications.10 CHIPS,NODES AND WAFERS:A TAXONOMY FOR SEMICONDUCTOR DATA COLLECTION OECD 2024 Advanced packaging is relevant to front-end manufacturing because the interpose

50、r must be fabricated,which can be done in-house by foundries(Patel,Xie and Wong,20238),in addition to OSAT firms.Recent developments in technology also include 3D integration,which consists in bonding directly the chips at the front-end stage(e.g.copper-to-copper bonding).3D-integration also require

51、s a specific design of the bonded chips.Developments in low-temperature bonding and ultra-thin device layer stacking are examples of a fast-moving technological frontier for 3D-ICs.End-uses for semiconductors Semiconductors are a critical input into production in a wide range of industries.For examp

52、le,in telecommunication equipment or motor vehicles,the value of semiconductors embodied is about as important as energy costs(Figure 2).Figure 2.Share of semiconductor and primary value added demand,2018 Note:The semiconductors share of value added to final products in each industry is shown in blu

53、e,with the red dot indicating the value added of primary energy(includes coal,oil and gas)in that industry for comparison purposes.The sample is restricted to the 20 leading purchase economies.For instance,semiconductors represent 1.5%of the value added in motor vehicles,only slightly less than prim

54、ary energy(2%).Source:Haramboure,A.et al.(2023),“Vulnerabilities in the semiconductor supply chain”,OECD Science,Technology and Industry Working Papers,No.2023/05,OECD Publishing,Paris,https:/doi.org/10.1787/6bed616f-en.Generally,most analysis of semiconductor demand focuses on six main end-use mark

55、ets:computing/data processing,consumer goods,communications,automotive,industrial goods,government/military.4F5 Computers and other consumer electronics account for most of the demand for all semiconductors.Electrical equipment,followed by the automotive sector,other transport equipment,industrial m

56、achinery,as well as telecommunications are key chips using sectors.The production of medical devices is also an important using sector(OECD,20199).Goals and policy questions By focusing on improving transparency and information sharing on front-end manufacturing,the taxonomy presented in this paper

57、provides the basis for a database underpinning analyses to address the following key questions.CHIPS,NODES AND WAFERS:A TAXONOMY FOR SEMICONDUCTOR DATA COLLECTION 11 OECD 2024 Where are the production facilities for front-end manufacturing located?Analysis under this workstream would draw on fab dat

58、a to help shed light in which countries semiconductor production capacity is located.Answers to this question would contribute to understand the extent of market concentration and thus identify potential bottlenecks.Moreover,data on the location of front-end manufacturing facilities currently being

59、planned or underway could provide insights on whether recent policy efforts(e.g.policy strategies and instruments)are helping diversify semiconductor production and reduce the risks of bottlenecks in the future.How is the balance between semiconductor demand and supply expected to evolve?These data

60、could also help identify segments where installed capacity is growing faster than demand,and therefore creating risks of excess capacity and unnecessary redundancies,based on the availability of demand data.This analysis would help policy makers understand in which types of chips investments should

61、be encouraged,with a view building a more resilient overall value chain.Building on front-end manufacturing capacity information and semiconductor demand developments and forecasts,the analysis could help monitor industry cycles and anticipate shortages and gluts.Furthermore,the taxonomy will facili

62、tate distinguishing between different semiconductor product types(Section 4),with the level of product type granularity depending on the availability of both production capacity and demand data at the same level of granularity.What is the potential for substitution?It is important to understand if a

63、nd where production is substitutable between fabs in order to build more resilient value chains.Addressing this question would help better understand the degree of flexibility in front-end chip manufacturing to cope with supply-demand imbalances for certain chips,including in the event of localised

64、disruptions and other shocks.Comprehending substitutability is critical when planning for managing worst-case disruption scenarios.There are two important dimensions to substitutability:Chip substitutability refers to whether one specific chip in an end-product can be substituted by another to perfo

65、rm the same functions with a minimal loss in performance.Fab substitutability refers to whether the production of one chip can be switched to another plant,and if so,the range of chips that can be produced with the same available fab equipment and facilities(or with minor tweaks).Chips substitutabil

66、ity Substitutability across chips i.e.whether a specific chip can be replaced by a different chip for performing the same functions in an end-use product is dependent on their use in downstream industries and products.Substituting one chip for another is not straightforward and often requires re-des

67、igning the system either the printed circuit board(PCB)and/or re-writing software.In addition,trust in suppliers and security concerns are key considerations for downstream industry users that might also limit the ability to substitute specific chips(Sperling,202210).Substitutability might be less c

68、hallenging for simpler chips,for mature chip types and for uses where software has evolved at a slower pace,and future work could consider whether there are readily available substitutes within certain types of simpler and mature chip types.Part of the analyses on substitutability 12 CHIPS,NODES AND

69、 WAFERS:A TAXONOMY FOR SEMICONDUCTOR DATA COLLECTION OECD 2024 would also need to take into account the dependence on critical semiconductors of certain applications and industries.Moreover,chip performance(and that of the end-use product)would need to consider efficiency,capacity and capability,for

70、 example building on well-established standard performance tests and benchmarks.5F6 However,a detailed analysis based for example on metrics on chemical resistance and operating temperature range would be deemed too technical and outside the scope of this Workstream.Fab substitutability Whereas unde

71、rstanding chip substitutability would provide insights on alternative sources of chips in the event of a value chain disruption,the key to managing disruptions is substitutability across fabs,including information on where potential substitute fabs are located.While part of the analyses required to

72、understanding fab substitutability relate to technological capacity,economic considerations also play an important role.Economic considerations include,for example,capital investments required,lead time to change production lines and production costs of the relevant fabs.Principles for a semiconduct

73、or production database This section presents a set of proposed principles for developing the semiconductors production database.These principles reflect a prioritisation that would help attain the objectives outlined above.Trust.The taxonomy,any data sharing activities and resulting databases develo

74、ped in the context of the Network should build on co-operation and trust amongst governments and stakeholders in the semiconductor industry to ensure that data and related analyses meet shared goals.Respecting constraints associated with sharing granular industry data would be particularly important

75、 to building trust with stakeholders.Availability.The taxonomy should reflect available data.Areas for which data are not available are not included.Areas for which data availability is very limited are identified as such and,as in any database,there may be numerous missing values.Data analyses are

76、only possible insofar as data are available.Any data collection efforts should complement and rely on,rather than duplicate,existing data efforts by governments,industry and other stakeholders.Comparability.Comparison across classifications used in different economies and jurisdictions should be as

77、simple and easy as possible.A taxonomy should also be consistent over time,thus allowing for analysis that can build on historical data.Tractability.Semiconductor manufacturing processes are highly complex.The taxonomy should strive to simplify as much as possible to obtain a tractable taxonomy,noti

78、ng that this may lead to nuanced differences in semiconductor manufacturing processes and products being obscured.Adaptability.The taxonomy should be able to adapt as semiconductor production processes and products evolve,keeping abreast of innovation and limiting the needs for revisions of the taxo

79、nomy,but without prejudice to the above principle of comparability(through time).6F7 Granularity.Allow for the highest level of disaggregation possible with available data.More granular data offers additional information and allows for more detailed analysis,noting that a higher level of granularity

80、 might increase complexity.Input from the Network during its second meeting on 19-20 September 2023 highlighted the importance of ensuring that policy makers can draw meaningful insights from the data.This suggests that availability and tractability should be prioritised over granularity.Granularity

81、 should not hinder efforts to build trust and ensure the longstanding engagement of stakeholders.Granularity can be increased in further versions of the taxonomy,if needed and upon availability of the corresponding data and sufficient resources.CHIPS,NODES AND WAFERS:A TAXONOMY FOR SEMICONDUCTOR DAT

82、A COLLECTION 13 OECD 2024 These principles may be reviewed in the future to ensure that they remain applicable in practice and well-suited for the objectives of the Network e.g.granularity might become more relevant with the development of the resulting semiconductor production database.The relative

83、 importance of the different principles may also change depending on how critical different chips are e.g.when analysing more critical/vulnerable and non-substitutable chips it might be worth considering putting more weight on granularity and adaptability.14 CHIPS,NODES AND WAFERS:A TAXONOMY FOR SEM

84、ICONDUCTOR DATA COLLECTION OECD 2024 Explaining the key steps,process and technologies in the front-end manufacturing stage is critical to developing a useful taxonomy that provides transparency on production capability and capacity.The review contained in this section is the basis for the taxonomy

85、laid out in Section 4.Main types of technologies Technology is key to the semiconductor production process.Machines and equipment used in photolithography determine a manufacturers fabrication capabilities,specifically the minimum node size attainable(OECD,20199).7F8 Additionally,advances materials

86、science and semiconductor materials,in the technology of circuit elements(e.g.transistors)and in chip packaging increasingly determine chip performance(Singh,Sargent and Sutter,202311;OECD,20199).Semiconductor materials Semiconductor materials refers to materials with semiconductor properties that s

87、erve as the base upon which microelectronic devices are built,with some chips combining different thin slices of semiconductor materials.Semiconductor materials are often classified in three categories see Section 0 and Sellars(202312):silicon,compounds and emerging materials.Typically,the layers of

88、 the semiconductor material are grown on a substrate through deposition(e.g.epitaxy for more complex materials focused on crystal orientation)to prepare the wafers that serve as the basis for printing the desired circuit.Each semiconductor material lends itself to specific applications.Typically,sil

89、icon semiconductors run software,while compound semiconductors,comprising other elements from the periodic table,provide specialist functions for sensors and power management.New emerging materials are being developed to provide additional functions such as user displays.A typical electronic product

90、 may comprise silicon(70-80%),compound(10-20%)and emerging(10%)semiconductors(Sellars,202312).The most common material used to make semiconductor wafers is silicon(Si),which is highly abundant and thus possible to scale.Eighty percent of the worlds semiconductors use silicon(U.K.Compound Semiconduct

91、or Applications Catapult,202313).The remaining 20%use compound semiconductors,which combine two or more elements,for example gallium arsenide(GaAs),gallium nitride(GaN),indium-phosphide(InP)and silicon carbide(SiC).Compound semiconductors are more complex to manufacture than silicon ones,but outperf

92、orm silicon for some applications(U.K.Compound Semiconductor Applications Catapult,202313):Power.For example,SiC has higher breakdown voltages than traditional power chips,which is needed to extend the range of electric vehicles;2 Semiconductor manufacturing:Process,technologies and products CHIPS,N

93、ODES AND WAFERS:A TAXONOMY FOR SEMICONDUCTOR DATA COLLECTION 15 OECD 2024 Speed.For example,GaN can conduct electrons more efficiently than silicon,needed for increased speeds and lower latency for 5G mobile communication;Light.For example,Groups III-V and II-VI compounds offer superior photonics ne

94、eded for optic fibre communications.Germanium is also an important substrate material used in optoelectronic devices,such as solar cells.Equipment Each of the different production steps outlined in Section 1 use specific equipment,which is customised and calibrated according to a customers needs(Sin

95、gh,Sargent and Sutter,2023,p.1511).Lithography equipment is the key piece of machinery that has determined the advancement in semiconductor technology.Today,leading-edge chips(10 nm)use extreme-ultraviolet(EUV)photolithography technology,requiring equipment currently only manufactured by ASML in the

96、 Netherlands.Other types of lithography technology include deep-ultraviolet photolithography(DUV)for wafer fabrication.Technologies such as electron-beam,laser,and ion beam lithography are used in the production of photomasks(layers).While these technologies are still needed for leading-edge chips,w

97、ithout EUV they are currently incapable or ill-suited to mass production of chips with the lowest node sizes(Khan,Mann and Peterson,202114).In front-end manufacturing,other types of machinery and systems are required for oxidation,physical and chemical vapour deposition and ion implantation,etching

98、and cleaning,diffusion,process control,wafer handling,planarisation(i.e.smoothing out wafer surfaces),and metrology.In particular,chemical vapour deposition is a key stage in the chip fabrication process that requires complex tools that can be differentiated,for example epitaxy reactors and atomic l

99、ayer deposition(a highly controlled deposition technique that deposits one atomic layer at a time)tools(ETO,20223).Metrology equipment such as optical tools and advanced etching(e.g.atomic layer etching)may also be important differentiators for advanced chips.The adoption of advanced packaging techn

100、ologies in advanced chips has required front-end fabs to offer services necessary for this process.For example,TSMC may fabricate chips with electroplating for interposers in advanced packaging,and thus needs to incorporate necessary back-end equipment into its fabs(Shilov,202315).Transistor types a

101、nd process technologies Transistor types,with their different purposes and use cases,and the evolution in transistor architectures and materials are key parameters that drive Moores Law and thus continued advancement in chips technology.These are therefore important considerations for developing the

102、 proposed semiconductor taxonomy.A transistor is the basic component in semiconductor manufacturing,used for switching or amplifying electricity.Most chips today contain billions of transistors.Transistor dimensions determine speed(typically MHz or GHz),voltage and current,and the number of transist

103、ors on the chip(Sellars,202312).Transistor performance is evaluated on the maximum amount of current able to flow through it when switched on,the amount of current leakage when off,and the speed at which it switches on and off(Hofman,202216).Reducing the transistor size allows manufacturers to incre

104、ase transistor concentration on chips,thereby delivering a performance boost and power consumption reduction at lower device area and cost commonly referred to as PPAC(power,performance,area,cost)scaling(Draeger,202017).16 CHIPS,NODES AND WAFERS:A TAXONOMY FOR SEMICONDUCTOR DATA COLLECTION OECD 2024

105、 There are two basic families of transistors:Field-Effect Transistors(FET)and Bipolar Transistors (Hofman,202216;Cadence,202218;Cadence,202119).Field-Effect Transistors(FET)operate by carrying either a positive or a negative current(i.e.unipolar)through two junctions(a source and a drain)with a thir

106、d junction used for control(the gate).They can have distinct configurations that are constructed differently and have differing scalability,including junction-gate(JFETs),metal-semiconductor(MESFET),planar metal-oxide-semiconductor(planar MOSFETs),vertical fin(FinFETs),and gate-all-around(GAAFETs)se

107、e Figure 3.Figure 3.Transistor types:Planar vs FinFETs vs.GAAFETs Source:Draeger,N.(202017),FinFETs Give Way to Gate-All-Around,Lam Research,https:/ are the simplest form of FET and are used as electronically controlled switches,voltage-controlled resistors,and as amplifiers.They are formed of a sou

108、rce,a drain,and the gate is in contact with a highly doped semiconductor layer.MESFETs operate identically to JFETs but have a different channel.The gate is in direct contact with the semiconductor substrate,without the highly doped semiconductor layer used in JFETs.It remains difficult to fabricate

109、 circuits containing a large number of MESFETs.Nevertheless,the MESFET is still the dominant active device for power amplifiers and switching circuits in the microwave spectrum.Planar MOSFETs have a two-dimensional structure and a single gate controlling the source-drain channel.They were the first

110、transistor configuration to be suitable for mass production and miniaturisation in the 1950s and 60s,giving rise to Moores Law.8F9 Floating gate MOSFETs are commonly used in non-volatile memory chips because of their ability to trap and store an electrical charge on the floating gate for extended pe

111、riods of time,without a connection to a power supply.Complementary metal-oxide-semiconductors(CMOS),first invented in the 1960s,combine several MOSFETs of different polarities and performs the basic binary operations that form the basis of any logic chip.CMOS is now the preferred process technology

112、for digital integrated circuits and accommodates different types of transistor architectures(planar or not).Continued scaling of CMOS devices has been made possible with the development and adoption of new materials(e.g.Low-K/High-K dielectrics)that improve transistor performance and process technol

113、ogy innovations such as Fully-Depleted-or Partially-Depleted-Silicon-on-Insulator(FDSOI&PDSOI)that improve the flow of electrons between source-drain over conventional bulk planar technology(IEEE,202220;Liu and Wu,200321).However,dimensional CHIPS,NODES AND WAFERS:A TAXONOMY FOR SEMICONDUCTOR DATA C

114、OLLECTION 17 OECD 2024 scaling will eventually approach fundamental limits,and new beyond-CMOS technologies will be needed for the new era of computing(IEEE,202220).FinFETs were the next major breakthrough in transistor design,when it was discovered that raising the channel above the plane of the si

115、licon and surrounding the channel with a 3D gate made it possible to exert more control over the flow of current(Figure 3 above).FinFETs are three-dimensional structures with vertical fins forming a drain and source,and a gate that surrounds three sides of the channel.Compared to planar MOSFETs,this

116、 has the advantages of having less current leakage as the length of the gate shrinks(i.e.the node size decreases),a lower gate voltage needed to operate the transistor,and faster switching times.FinFETs vertical geometry enables easier fabrication of multi-gate devices(where there are multiple gates

117、 on a single transistor that can be controlled by a single gate electrode or independent gate electrodes)9F10 and for more transistors to be incorporated onto a single chip,sustaining Moores Law(Cadence,202119).However,FinFETs are currently reaching the limit of how high fins can go and how many fin

118、s can be placed side by side to boost current-carrying capacity without suffering from electrical challenges.GAAFETs are considered the next evolution of FETs.They use stacked nanosheets so that the gate surrounds the channel on all four sides,further reducing leakage and increasing drive current.GA

119、AFETs exhibit high potential for further downsizing transistors while offering better capabilities.Bipolar Transistors consist of two mutually connected Positive(P)-Negative(N)junctions(forming either NPN or PNP configuration)with three connections(the emitter,base and collector),and are capable of

120、carrying both positive and negative electric signals.Although bipolar junction transistors(BJTs)are cheaper to manufacture and can offer greater current output,which makes them popular for amplifier circuits,they are larger in size and less widely used than FETs.FET and BJTs can be combined for exam

121、ple,BiCMOS is a process technology that combines the high-speed analogue capability of bipolar and the low-power,high-packing density of CMOS.Integrated circuits that combine different types of transistors can benefit from the advantages of each transistor type but can be more complex and expensive

122、to produce.Insulated-gate bipolar transistors(IGBT)differ from BiCMOS in that they are a single transistor that features a functional integration of MOS and bipolar physics and have wide application in power electronics systems(Baliga,202322).Transistor types and process technologies continue to evo

123、lve rapidly,driven by a quest for more performance and lower costs,trying to keep up with“Moores Law”.There are several examples amongst technologies currently being deployed such as backside power delivery10F11 or recent discoveries that might take years to develop and deploy commercially such as q

124、uantum-interference transistors.11F12 Types of semiconductors The semiconductor industry produces a wide variety of chips designed for precise functions.Different types of chips are typically produced in separate facilities,and often by specialised firms using unique manufacturing processes.Generall

125、y,there are considered to be four main types of semiconductors:logic,memory,analog and others(Haramboure et al.,20231;Kleinhans and Baisakova,20202;Singh,Sargent and Sutter,202311).Logic Logic chips process binary information and include microprocessors(e.g.central processing units,CPUs and graphics

126、 processing units,GPUs),microcontrollers(MCUs)and connectivity chips.18 CHIPS,NODES AND WAFERS:A TAXONOMY FOR SEMICONDUCTOR DATA COLLECTION OECD 2024 Amongst logic chips,Programmable Logic Devices(PLDs)are integrated circuits that can be configured by the user to perform different functions.PLDs dif

127、fer in the placement of programmable connections and can be differentiated based on the complexity of their architecture.One group is Field Programmable Logic Devices(FPLD),which are integrated circuits that assist in the execution of digital systems and are suited for simpler applications(Advanced

128、Micro Devices,202123).A more complex but flexible group is the Field Programmable Gate Array(FPGA),a generic chip based around a matrix of configurable logic blocks(e.g.MCUs,digital signal processors,DSPs,etc.)connected via programmable interconnects that can be reprogrammed or reconfigured to desir

129、ed application or functionality requirements after manufacturing(Advanced Micro Devices,n.d.24).FPGAs can be distinguished from Application-Specific Integrated Circuits(ASICs),which are custom manufactured for specific compute tasks.The most advanced generations of logic chips are produced using lea

130、ding-edge processes and technologies.Node sizes range from the most advanced 3nm node to mature generation nodes over 250nm.The UK Compound Semiconductor Applications Catapults taxonomy(c.f.Section 3 below)references the evolution of logic chips from MCUs to DSPs a specialised version of an MCU opti

131、mised to process digital signals such as voice or video),to GPUs(optimised DSPs designed to process high resolution video signals),and then to intelligent processing units(IPUs a specialised version of a GPU optimised to run AI computation).The IEEEs 2022 International Roadmap for Devices and System

132、s(IRDS),the foundational plan for the semiconductor industry regarding the development of electronic devices and systems,forecasts that logic devices will scale to less than 1nm by the 2030s using GAAFET and 3-D integration/vertical stacking of circuits(IEEE,202220).Memory Memory chips store data.Di

133、fferent types of memory chips serve different functions and are separated by their ability to retain data without power(Figure 4).For example,Dynamic Random-Access Memory(DRAM)and Static Random-Access Memory(SRAM)are volatile memory technologies,meaning they only temporarily store information while

134、switched on,making them suitable for short-term storage.DRAM is more power intensive,slower,but cheaper than SRAM.In contrast,non-volatile memory retains data even after the system is switched off,making it suitable for long-term storage.Flash memory is considered the baseline non-volatile memory be

135、cause it is highly mature.There are two main types of flash memory Not And(NAND)and Not Or(NOR),that differ in their architectures and cell size.It is easier to increase the storage capacity of NAND flash and it is faster in writing and erasing data,while NOR flash is faster at reading data(Samsung,

136、201325).Other types of non-volatile memory are Read-Only Memory(ROM)and Non-Volatile Random-Access Memory(NVRAM).CHIPS,NODES AND WAFERS:A TAXONOMY FOR SEMICONDUCTOR DATA COLLECTION 19 OECD 2024 Figure 4.Memory types of semiconductors Source:Bigelow and Jones(202326),NAND Flash Memory,TechTarget,http

137、s:/ are prototypical and emerging non-volatile memory technologies that are expected to have speed,density and power advantages over flash memory(IEEE,202220)(see also Figure 6).Advanced memory technology uses a 3-D approach to vertically stacking layers of memory cells built with floating gate MOSF

138、ETs produced using more mature process nodes.Today flash memory chips are packing close to 200 memory cell layers,and are forecasted by certain manufacturers to be over 1000 layers by 2030(IEEE,202220).Memory chips typically have node sizes between 10nm and 50nm.Analog Analog chips convert and modif

139、y signals from the physical world with continuous parameters(e.g.temperature,speed,pressure,etc.)into digital signals,and power management functions.Designed for specific tasks in specific markets,they usually do not rely on shrinking node sizes.Others Other types of chips include for example“discre

140、te”chips which typically perform a single electrical function(e.g.diodes,rectifiers,thyristors)and are produced using mature-node technology,as well as optoelectronics(e.g.LEDs),sensors and actuators.20 CHIPS,NODES AND WAFERS:A TAXONOMY FOR SEMICONDUCTOR DATA COLLECTION OECD 2024 Different entities

141、have adopted different approaches and methodologies for classifying semiconductor data,largely reflecting the purposes of,and limitations of data availability.SEMI SEMI is the global industry association representing the microelectronics manufacturing and design supply chain.Its members include comp

142、anies at all stages of the semiconductor value chain.SEMIs World Fab Forecast tracks front-end(fab)spending,construction,capacity,and technology trends at the level of an individual fab,covering over more than 1 450 facilities worldwide.Published quarterly,information is compiled from various indust

143、ry sources,including publicly available information,and verified with industry contacts.Key parameters of semiconductor fabrication facilities tracked by SEMI include(SEMI,202327):Fab owner Fab location Status(under construction,operational,upgrading)Wafer capacity Clean room size and class Fab prod

144、uct types,based on the top-two product types produced in the fab(e.g.Analog/Linear,Discrete/Opto,Logic/MCU,Memory/Flash)Fab technology(e.g.CMOS,FinFET,EUV,system-on-a-chip,Low-K)Geometry,or the minimum feature size the fab is capable of producing,as reported by the company.World Semiconductor Trade

145、Statistics(WSTS)WSTS is an industry-led organisation with the purpose of collecting and publishing semiconductor trade net shipments and forecasts for the global semiconductor industry.Statistics are compiled based on confidential billings data submitted by companies responding to a monthly market s

146、urvey.Reported data include all aggregated monthly net billings between semiconductor manufacturers and their end customers,according to customer shipment location(i.e.chips consumption).Shipment data is aggregated at the level of five macro regions of the world market(WSTS,202228).Production data a

147、re not collected at the fab-level and firm-level data are not available to maintain the confidentiality of the collection process.3 Existing taxonomies for semiconductors CHIPS,NODES AND WAFERS:A TAXONOMY FOR SEMICONDUCTOR DATA COLLECTION 21 OECD 2024 The WSTS Product Classification 2023(summarised

148、in Table 1)is the methodology describing the classifications and definitions of semiconductor products used by WSTS in its data reporting.It is perhaps the most comprehensive and detailed taxonomy publicly available.The classification is reviewed on a regular basis,while ensuring that data are compa

149、rable across time.Table 1.Summary of WSTS categorisation and product definitions Product Type(category)Product Type(detailed)Definition Discretes General purpose signal and switching diodes,zener diodes,transient protection diodes,and radiofrequency and microwave diodes.Optoelectronics Includes disp

150、lays,lamps,couplers,and other opto-sensing and emitting semiconductor devices.Sensors and Actuators Semiconductor devices whose electrical properties are designed to correlate to temperature,pressure,displacement,velocity,acceleration,stress,strain or any other physical,chemical or biological proper

151、ty.Integrated circuits(ICs)Circuits combining digital and analog techniques are classified into digital circuits or analog circuits according to the chip area devoted to the respective technique.Analog-General Purpose Analog-Application-Specific Analog The essential function of the device is to proc

152、ess analog signals(signal that is continuously varying over time).General Purpose Analog is further sub-divided into specific functional sub-categories of Amplifiers,Signal Conversion,Interface,and Power Management ICs,according to their primary or dominant function.Application-Specific Analog is su

153、b-divided by the specific end application/market for which the device is designed for(e.g.Consumer,Computer,Communications,Automotive,Industrial&Others).MOS Micro All MOS and BiMOS logic ICs that are microcomputer related(e.g.MPU,MCU and DSP).Total Logic(MOS&Bipolar)All non-Micro MOS Logic ICs and B

154、ipolar Logic ICs.Includes sub-categories:Digital Bipolar,MOS General Purpose Logic,MOS Gate Arrays,MOS Standard Cells and Field Programmable Logic,MOS Display Drivers,MOS Touch Screen Controller,and MOS Special Purpose Logic.MOS Memory All monolithic Memory devices made with NMOS,PMOS or CMOS,or any

155、 combination of MOS technologies.Includes sub-categories of DRAM,SRAM,Mask Programmable ROM,and Flash Memory.Source:WSTS(2022),WSTS Product Classification 2023,World Semiconductor Trade Statistics.22 CHIPS,NODES AND WAFERS:A TAXONOMY FOR SEMICONDUCTOR DATA COLLECTION OECD 2024 Compound Semiconductor

156、 Applications(CSA)Catapult The United Kingdoms(UK)Compound Semiconductor Applications(CSA)Catapult was established in 2018 by Innovate UK to help the UK become a global leader in compound semiconductors through collaboration with both large companies and start-ups to develop and commercialise new ap

157、plications.CSA Catapult is the UKs authority on compound semiconductor applications and commercialisation.The CSA Catapult developed a semiconductor taxonomy,shared with the Semiconductor Informal Exchange Network by the UK.12F13 This taxonomy segments semiconductors by substrate material(silicon,co

158、mpound,emerging)and then function(e.g.analog,digital,discrete,power,photonics,sensors,etc.)(Figure 5).The CSA Catapult taxonomy distinguishes between analog integrated,digital integrated and discrete categories of chips.It then identifies sub-categories within chip types.Figure 5.Catapult semiconduc

159、tor taxonomy Source:Sellars,A.(2023),Semiconductor Primer,Internal Working Document,Catapult Semiconductor Applications.It is worth noting that for digital integrated circuits these sub-categories are logic,processors and memory semiconductors.Logic chips and processors are distinguished on the basi

160、s that the former are programmable or customisable using software while processors have fixed,general purposes/functionality.Chip types under the logic sub-category are further divided into FPGA,Field Programmable Logic Device(FPLD),and ASIC.Chip types under the processor sub-category are MCUs,DSPs,

161、GPUs and IPUs.IEEE Taxonomy of Emerging Memory Devices The IEEE categorises current and emerging memory technologies(Figure 6).IEEEs taxonomy distinguishes between volatile and non-volatile memory technologies(see Section 2,above).For non-volatile memories it further distinguishes between baseline,m

162、ature flash technologies,prototypical CHIPS,NODES AND WAFERS:A TAXONOMY FOR SEMICONDUCTOR DATA COLLECTION 23 OECD 2024 technologies that are commercially available but for niche applications,and emerging technologies that have significant potential benefits if various scientific and technological hu

163、rdles can be overcome.Figure 6.IEEEs memory taxonomy Source:IEEE(202220),International Roadmap for Devices and Systems(IRDS)2022 Edition,https:/irds.ieee.org/editions/2022.2022,IEEE Other taxonomies The United States CHIPS Program Office is implementing the CHIPS and Science Act.In its Notice of Fun

164、ding Opportunity for the CHIPS Incentives Program,the CHIPS Program Office uses a categorisation system for commercial fabrication facilities based on the maturity of their processes,in addition to a distinction based on product type or the service provided.13F14 Categories include:Leading-edge faci

165、lities for logic or memory chips that utilise the most advanced front-end fabrication processes,which achieve the highest transistor and power performance.For logic chips,this currently includes facilities that produce semiconductors at high volumes using EUV lithography tools.For memory chips,this

166、currently includes facilities capable of producing 3-D NAND flash chips with 200 layers and above,and/or DRAM chips with a half-pitch of 13nm and below.Current generation facilities that produce semiconductors that are not leading edge,up to 28nm process technologies,and include logic,analog,radio f

167、requency,and mixed-signal devices.Mature-node facilities that fabricate generations of:(a)logic and analog chips that are not based on FinFET,post-FinFET transistor architectures,or any other sub-28nm transistor architectures;(b)discrete semiconductor devices such as diodes and transistors;(c)optoel

168、ectronics and optical semiconductors;and(d)sensors.24 CHIPS,NODES AND WAFERS:A TAXONOMY FOR SEMICONDUCTOR DATA COLLECTION OECD 2024 The United States Department of Commerce,in its 2021 Notice of Request for Public Comments on Risks in the Semiconductor Supply Chain also includes a categorisation of

169、semiconductor product capabilities,distinguishing technology nodes(in nanometres),semiconductor material types,and device types.14F15 In the recent European chips survey report(EC,2022,p.1129),the European Commission(EC)distinguishes amongst different types of chips,including logic and microprocesso

170、rs,memory chips,analog chips,discrete chips,optoelectronics,and sensors,as well as chips designs that allow for the combination of different functions system-on-a-chip(SoC).15F16 This report also distinguishes seven different classes of node sizes from 5-7nm to node sizes larger than 280 nm.The busi

171、ness model was also deemed relevant information to help map the semiconductor value chain.The World Customs Organisations Harmonised System(HS)codes also classifies semiconductor products under two 4-digit labels(see Annex A).However,the product classification might be too aggregated for the purpose

172、s of the Network.CHIPS,NODES AND WAFERS:A TAXONOMY FOR SEMICONDUCTOR DATA COLLECTION 25 OECD 2024 The OECDs proposed common taxonomy for semiconductor product types and production facilities aims to provide policy makers with useful,disaggregated information for the purposes of improving understandi

173、ng of the semiconductor value chain and helping identify alternative sources for the different types of semiconductors in the event of disruptions.The taxonomy for semiconductors proposed in this document builds on existing taxonomies described in Section 3 as well as several underlying principles d

174、escribed in Section 1.The proposed taxonomy applies only to semiconductor products and fabrication/foundry manufacturing processes detailed in defined in Section 2.It excludes the Design and ATP stages described as part of the semiconductor value chain in Section 1,as well as other upstream or downs

175、tream activities.Work on the Design and ATP production stages,as well as on key upstream and downstream activities that present bottlenecks in the value chain(e.g.specialised equipment and select raw materials)will be explored in more detail in the future.This section summarises the taxonomy at the

176、fab-level,describing plant information,capabilities and capacities.Capabilities includes technical information on e.g.process technologies,transistor types and chip types.While the subsection containing Figure 9 corresponds to a chips taxonomy per se,the framework laid out in this section is much br

177、oader and covers the relevant fab-level information.Building the evidence base:a taxonomy for a semiconductor production database Building the evidence base for semiconductors requires comparable data on semiconductor types as well as their production facilities/fabs.Understanding semiconductor valu

178、e chain bottlenecks,vulnerabilities and substitutability requires information on what the different fabs are capable of producing,which is determined by a number of fab characteristics.The key characteristics of semiconductor fabs that could help determine how production/supply can adjust to disrupt

179、ions include:General Company/Plant information.As identified in recent OECD work(Haramboure et al.,20231),semiconductor manufacturing is geographically concentrated and horizontally differentiated,meaning the location of the plant,the company producing the chips,and the home economy of this company

180、is important information when considering substitutability.The operational status of fabs(including whether it is being retooled/upgrading)is important to understanding both current as well as future production location and capacity.Fab ownership and general information on the company that owns the

181、fab,such as the business model i.e.whether the plant belongs to an IDM or operates as a foundry will be included.Company financials,as well as other relevant company-level variables that might be available,would be important dimensions to consider in future analyses.16F17 4 Proposed taxonomy for sem

182、iconductors 26 CHIPS,NODES AND WAFERS:A TAXONOMY FOR SEMICONDUCTOR DATA COLLECTION OECD 2024 Capability.This refers to what an individual semiconductor fab/production facility is capable of producing,in terms of chip type(see the subsection below for a detailed classification of chip types),process

183、technology,equipment and tools,transistor type,substrate,wafer size and feature size.These variables are key to identifying potential substitutability.The feature size,which differs for logic(node)and memory chips(DRAM memory in terms of half-pitch measured in nanometres and NAND measured in stacked

184、 layers of memory cells and bits per cell)is a proxy for the technological advancement or maturity of the chips the fab is capable of producing.Certain chip types(e.g.analog and sensors)also use semiconductor materials other than silicon.Information on the types of end-products that build on the chi

185、ps that a plant can produce(chip uses),will be included if available.Further work on this in collaboration with the Network and stakeholders could help shed further light on semiconductor uses and the potential for downstream disruptions.17F18 Capacity.The production capacity of the facility based o

186、n the equipment capacity of a fab,typically measured in terms of wafer starts per month.The actual number of wafers being processed at any given time(i.e.yield)may change depending upon business conditions,product development and testing needs,maintenance schedules and product change overs.Availabil

187、ity of fab-level data on yield rates and capacity utilisation over time appears to be a challenge.The size of the clean room,the engineered space free of airborne particulates,is also a proxy for production capacity as a larger clean room can accommodate larger and more equipment.Based on the charac

188、teristics outlined above,Figure 7 summarises the main elements that could be envisaged in a semiconductor production taxonomy.The most challenging elements to reflect in the taxonomy are the technological elements under“Capability”given that they interact in sometimes complex ways.Figure 8 below ill

189、ustrates how the different elements interact to produce chips at different levels of technological content and maturity,distinguishing between leading-edge and mature chips in this particular illustration.The Network discussed whether it would be worth to have an explicit distinction between Leading

190、-Edge and Mature chips.On the one hand,making such distinction explicit would provide additional clarity and provide for an easier identification of these chips,thus allowing for more detailed analysis(possibly including trends).On the other hand,such a distinction would considerably increase comple

191、xity,could result in heightened data availability challenges and be prone to regular updates as semiconductor technologies advance very rapidly.It is suggested that the taxonomy remains flexible to allow for different approaches to distinguishing leading-edge from mature chips based on the different

192、 elements outlined in Figure 8.CHIPS,NODES AND WAFERS:A TAXONOMY FOR SEMICONDUCTOR DATA COLLECTION 27 OECD 2024 Figure 7.OECDs proposed semiconductor production taxonomy Note:Please note that the attributes under each variable are examples,pending confirmation of data availability,notably for transi

193、stor type and Process Technologies.More details about these attributes are available in Table 3.Figure 8.Capability in chips fabs The semiconductor production taxonomy will serve as the basis for developing a database of semiconductor production facilities and their characteristics to support analys

194、es on value chain disruptions.Based on the elements described above and conditional on any changes proposed by the network,and most importantly data availability,the semiconductor production database would strive to include as much data as possible to populate the database variables listed in Table

195、2.28 CHIPS,NODES AND WAFERS:A TAXONOMY FOR SEMICONDUCTOR DATA COLLECTION OECD 2024 Additional types of information might be considered in the future,including for example company financial information,workforce and human capital,and perhaps information on the environmental footprint(e.g.energy use,w

196、aste,water use)and on downstream dependencies(fab customers and geographies).Inclusion of such extensions would require first and foremost the availability of those data,and then an assessment of the feasibility of combining such data with the semiconductor production database.Table 2.Semiconductor

197、production database variables and definitions Category Variable Description of the categories General company and plant information Location The location of the plant(city,state/region,and economy).Owner The name of the company that has a majority shareholding in the plant.Owner headquarters The eco

198、nomy where the majority shareholder company headquarters are located.Ultimate Owner Any available information on the ultimate parent companys name.Ultimate Owner headquarters Any available information on the ultimate parent companys headquarters.Status Whether the plant is operating,in planning stag

199、es,under construction or upgrading/expanding.(Start)Year The year in which the fab began(or is expected to begin)volume production.Business Model Whether the plant is a pure-play foundry or part of an IDMs operations.R&D centres that could produce chips for commercial purposes may also be identified

200、 in the database and the nature of such types of plants recorded in this variable.Capability Chip type aggregated Whether the plant produces lC-Logic,IC-Memory,IC-Analog,Other chips see Figure 9.Chip type detailed The sub-category of chip type within the five aggregate categories(e.g.MCUs,GPUs,IPUs,

201、FPGA,etc.in the logic chip category)see Figure 9.Wafer size(mm)The maximum size(diameter)of the silicon wafers that the plant is setup for,which determines the number of chips per wafer,the cost per chip,and the number of chips that can be fabricated per annum.Standard wafer sizes are 50mm,100mm,150

202、mm,200mm 300mm and 450mm.Feature size The minimum feature size possible on each layer of the chips produced in nanometres OR for flash memory,the number of stacked layers or bits per cell.Transistor type The type(s)of transistors the fab is capable of producing.See Table 3 for details.Process Techno

203、logies Process technologies include material technologies and innovations that are made within the 2-D/planar architecture to tackle CMOS scalability challenges and include e.g.Fully-Depleted Silicon on Insulator and High-K materials for insulators.This variable also includes innovations such as 3D

204、integration.Information on the most advanced tools or equipment in the fab(e.g.EUV lithography,epitaxy reactors or optical tools)is also included in this variable.These indicate whether the fab is capable of producing leading-edge,current generation or mature generation chips.Please note that the at

205、tributes of this variable are not mutually exclusive for an individual plant.See Table 3 for details.CHIPS,NODES AND WAFERS:A TAXONOMY FOR SEMICONDUCTOR DATA COLLECTION 29 OECD 2024 Semiconductor material The material on which integrated circuits are deposited,including additional layers of material

206、s added to the wafer substrate(e.g.Si,SiC,SiGe,Ge,GaAs,GaN,Ga2O3,GaSb,InAs,InP,InSb,BP,II-VI compounds,SOI etc.).Chip uses Information on the types of end-products that use the chips that a plant can produce will be included if available.Identifying specific semiconductor uses can be particularly ch

207、allenging and will require further work in collaboration with the Network and stakeholders.Capacity Wafer capacity Theoretical maximum capacity.Maximum number of wafers(in wafers per month)that could be started if the fab were fully equipped as defined in the fab design specifications and if the equ

208、ipment were fully utilised(i.e.the maximum planned or design capacity of the fab).This variable could be complemented by a standardised measure to take into account different wafer sizes,e.g.200mm-equivalent wafers per month,as well as the information available from the Wafer Size variable described

209、 above.Clean room size(square feet)A proxy for the fabs maximum output,since clean room size correlates to wafer output.Newly constructed fabs might have lower initial production capacity due to the gradual buildout of tooling.Table 3.Attributes of transistor type and process technologies Variable A

210、ttributes Description Transistor type JFET/MESFET Junction-gate(JFET)is the simplest form of Field-Effect Transistors(FET).FET operate by carrying either a positive or a negative current(i.e.unipolar)through two junctions(a source and a drain)with a third junction used for control(the gate),which is

211、 in contact with a highly doped semiconductor layer.Metal-Semiconductor FETs are similar to JFETs,except that the gate is in direct contact with the semiconductor substrate,without the highly doped semiconductor layer used in JFETs.Planar MOSFET Planar metal-oxide semiconductor FETs(MOSFETs)include

212、all transistors with a two-dimensional structure and a single gate controlling the source-drain channel.FinFET Vertical fin FETs(FinFETs)are three-dimensional structures with vertical fins forming a drain and source,and a gate that surrounds three sides of the channel,allowing for less current leaka

213、ge,lower gate voltage needs and faster switching times.GAAFET Gate-all-around FETs(GAAFETs)use stacked nanosheets so that the gate surrounds the channel on all four sides,further reducing leakage and increasing drive current.BJT Bipolar junction transistors(BJTs)are capable of carrying both positive

214、 and negative electric signals.These are larger in size and can be used e.g.for power control.BiCMOS Combines the high-speed analog capability of bipolar transistors and the low-power,high-packing density of CMOS.IGBT Insulated-gate bipolar transistors(IGBT)are a single transistor combining the prop

215、erties of MOSFET and BJT,commonly used for power applications.Process Technologies FDSOI/PDSOI Fully-Depleted-and Partially-Depleted-Silicon-on-Insulator(FDSOI and PDSOI,respectively)improve the flow of electrons between source-drain compared to conventional bulk technology.30 CHIPS,NODES AND WAFERS

216、:A TAXONOMY FOR SEMICONDUCTOR DATA COLLECTION OECD 2024 (different attributes are not mutually exclusive)Low/High-K dielectrics Use of new materials with Low-K/High-K dielectrics to increase performance,notably for high-density integrated circuits.Advanced Lithography Indication of whether the fab u

217、ses differentiated advanced lithography tools.For example,extreme-ultraviolet(EUV)photolithography technology,requiring highly specialised equipment.Other types of lithography technology include deep-ultraviolet photolithography(DUV),electron-beam,laser,and ion beam lithography.Advanced Etching Indi

218、cation of whether the fab uses differentiated advanced etching tools(e.g.atomic layer etching)Advanced Deposition Indication of whether the fab uses differentiated advanced deposition tools(e.g.certain epitaxy reactors;atomic layer deposition)3D integration Possibility to bond different chips direct

219、ly at the front-end fab without an interposer(e.g.copper-to-copper bonding).Note:Please note that the attributes under each variable are pending confirmation of data availability.A taxonomy for semiconductor types The proposed classification of types of semiconductors is illustrated in Figure 9.Buil

220、ding on the existing taxonomies described in Section 3 and informed by the fab characteristics described above,the OECD proposes to distinguish semiconductors in four major categories according to their type:Logic integrated circuits(IC),Memory IC,Analog IC and Others,which are described in Section

221、2.Figure 9.Aggregated and detailed taxonomy for semiconductor types Logic semiconductors are listed in terms of their scaling and power evolution from CPUs to IPUs.ASICs and Programmable Logic Devices(FPLDs and FPGAs)are also included.CHIPS,NODES AND WAFERS:A TAXONOMY FOR SEMICONDUCTOR DATA COLLECTI

222、ON 31 OECD 2024 Memory semiconductors are further distinguished according to whether they are volatile(DRAM,SRAM)or non-volatile(Flash NAND,NOR,ROM,NVRAM).Analog semiconductors are distinguished according to their dominant function.Other types of semiconductors include Optoelectronics,Sensors,as wel

223、l as discrete semiconductors such as diodes or rectifiers.The following types of chips are also covered by the taxonomy:System-on-a-Chip(SoC):integrated circuit designs that combine many or all high-level function elements(e.g.CPU,DSP,memory)on a single chip from a single monolithic die.“Chiplets”:R

224、ecent integrated circuit designs build on independent,but interoperable portions of the circuit that carry out one(or more)different functions that can be combined in a modular way.A chiplet product would be considered as a single chip composed of multiple dies packaged together.While these chip typ

225、es are increasingly important and adding a specific category in the proposed chip taxonomy would help clearly identify them,this could increase the taxonomys complexity because it would likely require specifying sub-categories of SoCs and Chiplets according to their end-uses that could overlap with

226、those of the simpler chips described in Figure 9.It is therefore proposed that these types of chips are treated as packaging of individual chip types defined in this taxonomy,while not explicitly creating a category for SoCs nor Chiplets.Nevertheless,the Secretariat will try to identify fabs that pr

227、oduce SoCs or Chiplets(IDMs or foundries producing chips with the relevant interposers)as part of the OECD semiconductor production database,whenever possible.32 CHIPS,NODES AND WAFERS:A TAXONOMY FOR SEMICONDUCTOR DATA COLLECTION OECD 2024 The Network will continue working on semiconductor productio

228、n data with a view to populate the fields in the proposed taxonomy and build a semiconductor production database.This taxonomy and the framework for the resulting semiconductor production database may be revised in the future,as deemed necessary by the Network.Areas of future development may include

229、,for example and conditional on available data,new technological developments,additional information on semiconductor firms,information on end uses for semiconductors,or additional information about substitutability.5 Future work CHIPS,NODES AND WAFERS:A TAXONOMY FOR SEMICONDUCTOR DATA COLLECTION 33

230、 OECD 2024 References Advanced Micro Devices(2021),What is the difference between CPLDs and FPGAs?,Advanced Micro Devices,https:/ on 11 September 2023).23 Advanced Micro Devices(n.d.),What is an FPGA?,Advanced Micro Devices,https:/ on 11 September 2023).24 Bailey,B.(2024),“2.5D Integration:Big Chip

231、Or Small PCB?”,SemiconductorEngineering,https:/ on 11 April 2024).5 Baliga,B.(2023),The IGBT Device,William Andrew Publishing,https:/doi.org/10.1016/C2012-0-02174-6.22 Bigelow,S.and M.Jones(2023),NAND Flash Memory,TechTarget,https:/ on 4 September 2023).26 Bourzac,K.(2024),“Transistor Takes Advantag

232、e of Quantum Interference”,IEEE,https:/spectrum.ieee.org/quantum-interference-transistor(accessed on 11 April 2024).33 Burkacky,O.,T.Kim and I.Yeom(2023),“Advanced chip packaging:How manufacturers can play to win”,McKinsey,https:/ on 1 September 2023).6 Cadence(2022),“Comparing FinFETs vs.GAAFETs”,C

233、adence System Analysis,https:/resources.system- on 4 September 2023).18 Cadence(2021),“Using FinFETs vs.MOSFETs for IC Design”,in Cadence,Cadence System Analysis,https:/resources.system- on 4 September 2023).19 Draeger,N.(2020),FinFETs Give Way to Gate-All-Around,Lam Research,https:/ EC(2022),Europe

234、an Chips Survey Report,European Commission,https:/digital-strategy.ec.europa.eu/en/library/european-chips-survey(accessed on 5 September 2023).29 34 CHIPS,NODES AND WAFERS:A TAXONOMY FOR SEMICONDUCTOR DATA COLLECTION OECD 2024 ETO(2022),Semiconductor Supply Chain Explorer,Emerging Technology Observa

235、tory,https:/chipexplorer.eto.tech/(accessed on 4 September 2023).3 Haramboure,A.et al.(2023),“Vulnerabilities in the semiconductor supply chain”,OECD Science,Technology and Industry Working Papers,No.2023/05,OECD Publishing,Paris,https:/doi.org/10.1787/6bed616f-en.1 Hofman,S.(2022),What is a gate-al

236、l-around transistor?And how will it change the semiconductor industry?,ASML,https:/ Horiguchi,N.and E.Beyne(2022),“Backside power delivery”,IMEC,https:/www.imec- on 11 April 2024).31 IEEE(2022),“The International Roadmap for Devices and Systems:2022”,Institute of Electrical and Electronics Engineers

237、,https:/irds.ieee.org/editions/2022(accessed on 4 September 2023).20 Khan,S.,A.Mann and D.Peterson(2021),The Semiconductor Supply Chain:Assessing National Competitiveness,Center for Security and Emerging Technology,https:/doi.org/10.51593/20190016.14 Kleinhans,J.and N.Baisakova(2020),The global semi

238、conductor value chain A technology primer for policy makers,Stiftung Neue Verantwortung,https:/www.stiftung-nv.de/sites/default/files/the_global_semiconductor_value_chain.pdf(accessed on 1 September 2023).2 Liu,R.and T.Wu(2003),“Application of High K dielectrics in CMOS technology and emerging new t

239、echnology”,The Electrochemical Society,https:/www.electrochem.org/dl/ma/203/pdfs/0912.pdf(accessed on 4 September 2023).21 OECD(2023),“Semiconductor informal exchange network:Concept note”,Internal working document,No.DSTI/CDEP/CIIE(2023)1/REV1,OECD,https:/one.oecd.org/document/DSTI/CDEP/CIIE(2023)1

240、/REV1/en/pdf(accessed on 4 September 2023).34 OECD(2019),“Measuring distortions in international markets:The semiconductor value chain”,OECD Trade Policy Papers,No.234,OECD Publishing,Paris,https:/doi.org/10.1787/8fe4491d-en.9 Patel,D.(2022),“Advanced Packaging Part 2-Review Of Options/Use From Inte

241、l,TSMC,Samsung,AMD,ASE,Sony,Micron,SKHynix,YMTC,Tesla,and Nvidia”,Semianalysis.7 Patel,D.,M.Xie and G.Wong(2023),“AI Expansion-Supply Chain Analysis For CoWoS And HBM”,Semianalysis.8 Peters,L.(2024),“Backside Power Delivery Gears Up For 2nm Devices”,SemiconductorEngineering,https:/ on 11 April 2024)

242、.32 CHIPS,NODES AND WAFERS:A TAXONOMY FOR SEMICONDUCTOR DATA COLLECTION 35 OECD 2024 Samsung(2013),Semiconductor Glossary NOR Flash Memory,Samsung,https:/ Sellars,A.(2023),“Semiconductor Primer”,Internal Working Document,Catapult Compound Semiconductor Applications.12 SEMI(2023),World Fab Watch,http

243、s:/www.semi.org/en/products-services/market-data/world-fab-watch(accessed on 4 September 2023).27 Semiconductor Industry Association(2019),Semiconductors&the Future of the Harmonized System,Semiconductor Industry Association.30 Shilov,A.(2023),TSMC Accelerates Expansion of Advanced Packaging Facilit

244、ies:Report,Toms Hardware.15 Singh,M.,J.Sargent and K.Sutter(2023),“Semiconductors and the semiconductor industry”,Congressional Research Service,Washington DC,https:/crsreports.congress.gov/product/pdf/r/r47508(accessed on 4 September 2023).11 Sperling,E.(2022),“Chip Substitutions Raising Security C

245、oncerns”,SemiconductorEngineering,https:/ on 11 April 2024).10 Timings,J.(2021),“Six crucial steps in semiconductor manufacturing”,ASML,https:/ on 4 September 2023).4 U.K.Compound Semiconductor Applications Catapult(2023),What Are Compound Semiconductors?,https:/csa.catapult.org.uk/what-are-compound

246、-semiconductors/(accessed on 4 September 2023).13 WSTS(2022),“WSTS Product Classification 2023”,World Semiconductor Trade Statistics.28 36 CHIPS,NODES AND WAFERS:A TAXONOMY FOR SEMICONDUCTOR DATA COLLECTION OECD 2024 Annex A.HS codes relevant to semiconductors The Harmonised System(HS)is an internat

247、ional system to classify goods developed by the World Customs Organisation(WCO)and is used as the basis for customs tariffs,the collection of international trade statistics,as well as other trade related policies and analyses.18F19 The table below identifies the key HS codes for chips.19F20 The sele

248、ction of the codes is based on the Semiconductor Industry Association criteria,which classifies semiconductors under two HS headings,8541 or 8542,with 8541 sub-divided into eight categories and 8542 sub-divided into five categories at the 6-digit subheading level(Semiconductor Industry Association,2

249、01930).The paper underlying Workstream 2 contains a wider list of HS codes describing the main inputs,raw materials and machines relevant for the semiconductor supply chain.Table A A.1.HS codes relevant to semiconductor products Source:UN Comtrade database(available at:https:/comtradeplus.un.org/)an

250、d based on level Semiconductor Industry Association(201930).HS code Label 854110 Electrical apparatus;diodes,other than photosensitive or light emitting diodes 854121 Electrical apparatus;transistors,(other than photosensitive),with a dissipation rate of less than 1W 854129 Electrical apparatus;tran

251、sistors,(other than photosensitive),with a dissipation rate of 1W or more 854130 Electrical apparatus;thyristors,diacs and triacs,other than photosensitive devices 854160 Crystals;mounted piezo-electric 854190 Electrical apparatus;parts for diodes,transistors and similar semiconductor devices and ph

252、otosensitive semiconductor devices 854231 Electronic integrated circuits;processors and controllers,whether or not combined with memories,converters,logic circuits,amplifiers,clock and timing circuits,or other circuits 854232 Electronic integrated circuits;memories 854233 Electronic integrated circu

253、its;amplifiers 854239 Electronic integrated circuits;n.e.c.in heading no.8542 854290 Parts of electronic integrated circuits 852351 Solid-state,non-volatile data storage devices for recording data from an external source flash memory cards or flash electronic storage cards 852352 Cards incorporating

254、 one or more electronic integrated circuits smart cards”,852359 Semiconductor media,unrecorded,for the recording of sound or of other phenomena.853290 Parts of electrical pre-set capacitors,fixed,variable or adjustable,n.e.s 853390 Parts of electrical resistors CHIPS,NODES AND WAFERS:A TAXONOMY FOR

255、SEMICONDUCTOR DATA COLLECTION 37 OECD 2024 Endnotes 1 For additional information about the OECD Semiconductor Informal Exchange Network,please visit:https:/www.oecd.org/en/networks/semiconductor-informal-exchange-network.html 2 This document uses the terms semiconductor and chip interchangeably.3 Ot

256、her strategies include a combination of business models(e.g.the recent decision by Intel to offer foundry services)or a focus on cost optimisation focusing on other-than-leading edge nodes(“Fab-Lite”)4 Available at:https:/chipexplorer.eto.tech/5 For example,see Tech Insights End-Use Database,OMDIAs

257、Semiconductor Silicon Demand Forecast Tool,and the World Semiconductor Trade Statistics Product Classification 2023(WSTS,202228).6 The Embedded Microprocessor Benchmark Consortium or the Standard Performance Evaluation Corporation are just examples of organisations providing such performance tests a

258、nd benchmarks.7 Technological evolution can be particularly important for technical components of the taxonomy.For example,the use of ranges instead of precise values for“feature size”could help account for some degree of technological evolution.However,the thresholds of such ranges would still requ

259、ire updates.As such,it is proposed that the data are recorded in precise values whenever possible.Data may nevertheless be shared in ranges to preserve confidentiality.8“Node”generally represents the size of key electronics on chips measured in metric length;the size of these features has now reache

260、d the scale of nanometres(US Congressional Research Service,2023).For logic chips,node size has historically been a measurement of transistor gate length,while for DRAM memory chips,node size is the measurement of half the distance between adjacent memory cells(half-pitch).9 Moores Law posits that t

261、he number of transistors on a semiconductor chip doubles every 18 months while the cost of that chip is halved.Smaller chips with more densely packed transistors allow the production of smaller,more powerful electronic devices.10 For additional information on multi-gate devices:https:/ Backside powe

262、r delivery means that the power is delivered through the back side of the wafer(instead of the front),decoupling the power delivery network in the back from the signal network in the front 38 CHIPS,NODES AND WAFERS:A TAXONOMY FOR SEMICONDUCTOR DATA COLLECTION OECD 2024 (Horiguchi and Beyne,202231).T

263、his technology has the potential to reduce power losses in 2nm node logic chips by 30%(Peters,202432).12 Scientists have recently developed transistor using a single-molecule zinc porphyrin channel between two graphene source and drain electrodes,relying on quantum interference technology(Bourzac,20

264、2433).This technology could allow for lower voltages and increased efficiency.13 See the OECD Chips Network Community Page Production Data 14 The CHIPS Incentives Program Commercial Fabrication Facilities Notice of Funding Opportunity can be found here.Examples of the distinction based on product ty

265、pe include logic chips for leading-edge facilities,radio frequency chips for mature node or 2.5-D stacking for advanced packaging processes.15 Details available at https:/www.bis.doc.gov/semiconductorFRN2021.16 The European Commission,supported by the European Semiconductors Expert Group,developed a

266、 preliminary classification system with five categories of chip types:1)logic,2)memory,3)analog,4)optics,and 5)discrete.This information was reported by the European Commission participant to the first meeting of the Network on 30 June 2023.17 Examples of interesting dimensions to consider would inc

267、lude human capital/workforce and utility service inputs(e.g.water and electricity),even if such information would be particularly challenging to obtain.Similarly,it would be important to identify major customers(companies and geographies)of the production facilities to better understand supply chain

268、s and transportation dependencies,even if such data are likely highly sensitive and confidential.18 Understanding end-product chip uses is also important with regards to inventories of chips and chip inputs and the product life cycle.For example,the lifecycle of consumer goods might be shorter than

269、chips used for automation.Inventories are also an important consideration for critical products(e.g.medical devices).19 Details on HS codes available at:https:/www.wcoomd.org/en/topics/nomenclature/overview/what-is-the-harmonized-system.aspx 20 The United Nations International Standard Industrial Cl

270、assification(ISIC)is the international reference classification for economic activity.This classification is used to collect and report data on economic activity from different economies.The four-digit ISIC code for the manufacture of electronic components and boards is 2610.Details on ISIC codes can be found at:https:/unstats.un.org/unsd/classifications/Econ/isic