ACS Door HX Sub-Project Update.pdf

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1、Advanced Cooling Solutions(ACS)Door HX Sub-Project UpdatesSustainability:Cooling EnvironmentsACS Door HX Sub-Project UpdatesJuan Carlos Cacho Alonso,Thermal Engineer,Rittalcacho-alonso.jrittal.deDoor HX Sub-ProjectGoalsContribute documentation and products to inform the wider community of solutionsL

2、ower the barrier of liquid cooling adoptionHarmonize with partner sub-projects/projects on definitions,references and standardsIn-scope activitiesOperating conditions and parametersMetrology of heat extraction performance Requirements specific to different rack architectures:Open Rack,EIA310,etc.Def

3、inition of different solutions Data centers equipped with facility water Free air cooled data centersRecent Contributions-Air-Assisted Liquid CoolingExtends life of air-cooled facilities and adds optionality for data center ownersRecent Contributions-RPU Specification4RU chassis designed to fit in 1

4、9 rackAdapter frame for Open Rack V2 and V3DC and AC input variantsN+1 redundancy for all moving parts is a must Consumes 5%of rack IT power(including liquid-to air HX)Controls and monitors the liquid-to-air HXStandardized controls and reporting interface for rack level/DCIMLink to specificationRPU=

5、Reservoir and pumping unitRecent Contributions-White PaperEVALUATING THE LIMITS OF DOOR HEAT EXCHANGER SOLUTIONS OPTIMIZED FOR OPEN RACK V3This whitepaper demonstrates the enhanced performance of a water-cooled rear doorheat exchanger(Door HX)optimized for Open Rack V3(ORv3)versus an equivalent off-

6、the-Shelf counterpart.1.A substantial improvement of Door HX performance is possible and desirable for ORv3.2.Increasing the water supply temperature up to 27C is possible and desirable,especially if liquid cooling with cold plates is used.3.These results support the Open Rack specification for futu

7、re applications.Recent Contributions-White PaperIn the white paper we demonstrate that heat exchangers can be improved by:increasing the heat load per rackby reducing the temperature approach between the fluidsOngoing Efforts-Enabling Density in MDCsEnable MDC capacities greater than 300kW with 30+k

8、W ITE load per rackHybrid cooling(D2C cold plates+Door HX)promotes energy-efficient cooling and heat reusePotential to leverage ORV3 frame,power and cooling infrastructureCDU UPSCDURackDoor HXRackDoor HXRackDoor HXRackDoor HXRackDoor HXRackDoor HXRackDoor HXRackDoor HXRackDoor HXRackDoor HXRackDoor

9、HXRackDoor HXAirflowAirflowAirflowAirflowFront aisleRear aislePlan view of an example layout(white space only)MDC=Modular data centerEfforts Being DiscussedReference design(w/ACF)Megawatt deployments of Door HX;facility considerations of the sameFacility Door HX Frame design,interfacing with ORV3,in

10、tegration/sourcing at-scale,etc.Comparing Door HX coil types/options Al/Cu tube-fin&Al microchannel-Pros/cons of each Sustainability/life cycle assessment for hybrid cooling With ACS Cold Plate sub-project;currently on holdACF=Advanced Cooling Facilities Open to input;get involved using the QR codes

11、/links Biweekly calls on Thursdays at 9 AM PST Where to find additional information:Where to buy:https:/www.opencompute.org/productsProject Wiki with latest specification:https:/www.opencompute.org/wiki/Cooling_Environments_Advanced_Cooling_Solutions_Door_Heat_ExchangerMailing list:https:/ocp-all.groups.io/g/OCP-ACS-Door-Heat-ExchangerCall to ActionDoor HX WikiMailing ListThank you!