汽車內飾 IMSE：從技術構思到批量生產準備.pdf

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1、1/TactoTek 2024From Technology Ideation to Serial ReadinessStuttgart,November 14th2024Dr.Thomas Vetter2/TactoTek 2024Conventional electronics rely on multi-layer construction that imposes severe constraints:Separate structural,mechanical and electrical pieces create unnecessary material and energy u

2、seDevices become heavy and large in sizeFlat,rigid and large PCBs dictates formEnvironmentally harmful PCB production requiredIMSEdesign&functional differentiation with minimal use of environmentally harmful materials and processes:One thin,light-weight and visually appealing functional partSingle e

3、fficient process with minimal wasteMinimal or no requirement for PCBsHigh efficiency in lighting electronicsElectronics Construction Today Limits EcoDesign3/TactoTek 2024IMSE Disruption DissectedConventionalFlatMulti-structuralComplexvalue chainsAdditiveCurvedMono-structuralSimplifiedvalue chainsIMS

4、ESubtractive4/TactoTek 20241.Printing of decorations and electronics3.Forming 3D shape with components2.Surface Mounting of components on 2D filmIMSEManufacturing Process4.Injection molding5/TactoTek 2024IMSE TECHNOLOGY JOURNEY FROM IDEATION TO SERIES READINESSOEM Product Development Process&GatesMo

5、nths to SOPIdeationDesignPredevelopmentSeries DevelopmentProductionTec ConceptProduction PreparationToolingIdeation PhaseTec ValidationProof of Concept(PoC)Design PhaseTec Validation OEMTCO Competitive AnalysisPre DevelopmentTec Validation OEM6/TactoTek 2024IMSEValidation OEMValidation TestingMBN103

6、06 tests successfully completed:-K-05 Thermal Shock,-K-09 Damp Heat Cyclic with frost and-K-14 Damp Heat Steady StateThe parameter tests conducted at temperature extremes(-40C,+23C,+85C,and+105C)and operating voltage extremes(+9VDC,+13.5VDC,and+16VDC)Evaluated application includes in-molded micro co

7、ntrollers(SIP)and Osram smart RGBisParameter tests before and after the tests demonstrate that the design and processing recipe for IMSE parts,including SiP components,meets Mercedes requirements.IMSE material stack has been validated by OEM!MBN10306:K-01 High-Low Temperature Storage-40C +105CMBN103

8、06:P-03 Parameter test(9-pont,large)MBN10306:K-05 Temperature Shock(Na)100+200 cycles-40C +105CMBN10306:K-14 Humid Heat Constant 1.056h MBN10306:K_09 Humid Heat Cycle(Damp Heat with frost 10 cycles)MBN10306:P-03 Parameter test(9-point,large)OEM Test Results7/TactoTek 2024Mercedes Benz DP Active Ambi

9、ent Light Concept RequestContend of StudyConcept Study for Connected light application in door panel on BR 223Layout,packaging and power simulation study on an existing MB active ambient light lines in BR223 door panel(820 mm)Business Case simulation on TCO(Total Cost of Ownership)for global program

10、 assumptions Targets Luminance 2.500 cd/m2,3 mm wide light lineDynamic ambient RGB light function with 15mm LED pitchTotal Electrical Power Consumption 0,1W/RGB-LEDPackage space 10mm8/TactoTek 2024A:Functional film with printed electronicsB:Optical in mold light channel with clear PC resinC:PC-ABS b

11、ack molded light reflection&blocking with fixing D:In molded center connectorConventional ElectronicsApproximately 20 components are assembled into a module.Luminance:1,500 cd/cm 15mm pitchPower consumption:3 x 25mA x 5V=375 mW per RGB LEDAssembly depth:35mmThe assembly process is costly due to the

12、inclusion of 3 structural plastic parts,7 wired PCB boards,wiring,a light guide,and a diffuser.FGIMSE Smart molded StructureA single solid 2K molded part serves as the light source(no A-surface).No squeak and rattleLuminance:3,000 cd/cm with RGBi LEDs 15mm pitch Power consumption:3 x 5mA x 5V=75mW p

13、er RGBi LED 10 x higher light efficiency compared to conventional solutions Assembly depth:9mm No assembly required Significant weight reduction Highly sustainable due to mono-material design(PC-based)CBADActive Ambient Dynamic Light Line Concept Comparison Conventional vs.IMSE Reference of conventi

14、onal solutionConcept based on In Mold Structural Electronics-IMSE LEDABCEDA:HousingB:7 PCB boards withC:8 RGB-LEDs and 2 Melexisdrivers per boardD:Light guideE.DifusorF:Wire connectionsG:Decorative front panel35 mm9 mm9/TactoTek 2024IMSESpecificationConventionalVolume Data(LMC)BOM&ProcessBOM&Process

15、Production Investments Tooling Concept&CostEngineering CostConceptCreationProduction Investments Tooling Concept&CostEngineering CostIMSEScenario AnalysisConventionalOperationalCashflowPriceCBDCMPriceCBDCMIRRNPVEBITKPIsIRRNPVEBITKPIsBusiness Case Benchmark Study:ContentInput:SupplierInput:TactoTekBe

16、nchmark Results10/TactoTek 20242028202920302031203220332034203520362037Q1Q2Q3Q4Q1Q2Q3Q4Q1Q2Q3Q4Q1Q2Q3Q4Q1Q2Q3Q4Q1Q2Q3Q4Q1Q2Q3Q4Q1Q2Q3Q4Q1Q2Q3Q4Q1Q2Q3Q4SOP S-Class0100,000200,000300,000400,000500,000600,00005010012559890848178602S-ClassTotalApplication Overview000 vehicle production units/yearSource:

17、LMC/Global Data April 2024;Estimated LT volumesProduction Volumes for Business Case AnalysisBR224/S-Class000 cumulated production LT VolumeApplication#AppsLEDs/App#LEDsMio.LEDsBR 224(S-Class)559.964DP Connected Light454216103560.00011/TactoTek 2024IMSE Production Process Functions Film Production Un

18、windScreen PrintingICTBuffer/FeederIR-Soldering&UV CuringBufferElectrical TestMarking TestRewindUnwindSlitingElectrical TestGlob Trop JettingSingulationCuring UVBad Marking TestCuring Thermal UVPick&PlaceJettingScreen Printing-LineSMT-LineAll components are off-the-shelf industrial systems used for

19、the production of printed electronics.Property of db-matikProperty of db-matikCapacityInvestment530 Tsd.Mio.films p.a.(3 shifts)CapacityInvestment930 Tsd.Mio.films p.a.(3 shifts)1 lines including:6 Jetting1E-TestingCutting2 lines Including:ICTAOIBatch oven1Jetting designed for 480 films p.a.(3 shift

20、s)12/TactoTek 2024Business Case AnalysisBOMDetailed break down of material cost of IMSE stackProduct costing detailsMaterial overheads,scrap,admin&general overheads,mark-upTooling conceptTooling calculation for injection molding,high pressure forming and cuttingLEK Engineering costSerial development

21、 cost(concept,engineering until serial releas,launch support)Equipment investmentRequired roduction set-up for full vertial integration to meet project volume demandsDirect production costMiniFactory costing providing:Production labor,process cost&amortization of investmentsLaunch costEstimated on t

22、he basis of similar production set-upsQuick savingValues according to industry standardsLTAsValues according to industry standardsParameterDescription202520262027202820292030203120322033203420352036Cumulated Cashflow by ScenariosDetailed Cost Break Down(CBD)Lifetime Sales including LTAsLifetime EBIT

23、Return on investment(IRR)Net Present Value(NPV)SalesProfitDepreciation of assests&engineeringIMSE technology costOther direct production costProduction overheadLaborOther direct costMaterial ScrapDirect material trim&deco processComponents purchased partsDirect Material costSG&AScenario 1Norm Scenar

24、ioSzenario 2Cost Break Down(CBD)Output exampleResults of Scenario AnaysisFinancial KPIsMax cash outCum total cashIRRNPVLT SalesLT EBITDetailed valuation analysis can be provided upon request13/TactoTek 2024SummaryIMSE Technology has the potential to revolutionize future electronics production by off

25、ering:A business case study on a current use case demonstrated:Appealing functional parts,without almost no design restrictions-fully integrated-thin-lightweight-high performanceEfficient production process with minimal wasteMinimal use of environmentally harmful materials-little to no need for trad

26、itional PCBsValidated technology that meets automotive standards for series production10 x greater light efficiency compared to conventional solutions75%improved package spaceSignificant weight reductionHigh sustainability due to mono-material designImproved commercial competitivenessTACTOTEK.COMStart Building Smarter Surfaces for a Smarter FutureBOOK A DEMO