AI在測試領域：突破挑戰探索新方法.pdf

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1、Executive ConferenceArtificialArtificialIntelligenceIntelligenceexplore the power of AI to transform semiconductor design&manufacturingMarc JacobsMarc JacobsFabless SolutionsAI for TestAI for TestChallenges&ApproachesChallenges&ApproachesThis presentation and discussions resulting from it may includ

2、e future product features or fixes,or the expected timing of future releases.This information is intended only to highlight areas of possible future development and current prioritizations.Nothing in this presentation or the discussions stemming from it are a commitment to any future release,new pro

3、duct features or fixes,or the timing of any releases.Actual future releases may or may not include these product features or fixes,and changes to any roadmap or timeline are at the sole discretion of PDF Solutions,Inc.and may be made without any requirement for updating.For information on current pr

4、ioritizations and intended future features or fixes,contact .PDF Solutions,Exensio,CV,Cimetrix,the PDF Solutions logo,and the Cimetrix logo are registered trademarks of PDF Solutions,Inc.or its subsidiaries.All other trademarks cited in this document are the property of their respective owners.Exens

5、io visualizations Powered by TIBCO.2024 PDF Solutions,Inc.or its subsidiaries.All rights reserved.Challenges&Challenges&ApproachesApproachesCopyright PDF Solutions 2024Market:System Quality,Cost,DifferentiationMarket:System Quality,Cost,DifferentiationAdaptive TestingAdaptive TestingChiplet Matching

6、/Characterized KGD(cKGD)*/System BinningChiplet Matching/Characterized KGD(cKGD)*/System BinningPredictive BurnPredictive Burn-in/Binning/Systemin/Binning/System-level Testlevel TestSystemSystemWaferWaferChipletChiplet*Source:*Source:Intel,ERI Summit 2023Copyright PDF Solutions 2024InfrastructureInf

7、rastructure AI InfrastructureAI Infrastructure AI InfrastructureAI InfrastructureWafer Wafer Sort/CPSort/CPFacilityFacilityClass Class Test/Final Test/Final TestTestFacilityFacilityModelsData Feed Forward(DFF)Class Test/FT ResultsSort/CP ResultsBig Data StorageBig Data StorageTesting Data FlowAI Inf

8、rastructure FlowPDF AI Training EnginePDF AI Training EngineBring Your Own Model(BYOM)Bring Your Own Model(BYOM)ororMany Many ATEATEMany Many ATEATEMany Many ATEsATEsMany Many ATEATEMany Many ATEATEMany Many ATEsATEs1 12 23 34 4Copyright PDF Solutions 2024Remaining ChallengesRemaining ChallengesTrac

9、eabilityTraceability through a complex and through a complex and distributed supply chaindistributed supply chainLearning from Learning from small amount small amount of dataof dataLearning Learning across factories and designsacross factories and designsBalancingBalancing AI/ML AI/ML withwith human

10、 knowledgehuman knowledgeMing ZhangMing ZhangDr.Ming Zhang is currently VP of Fabless Solutions at PDF Solutions,a leading provider of end-to-end analytics for semiconductors.He was formerly Distinguished Architect at Synopsys,driving chiplet technology strategy and new EDA market development.Prior

11、to Synopsys,he was founding CEO of a Silicon Valley chiplet startup,zGlue.His experience at Intel and at the Samsung foundry focused on manufacturing process/circuit modeling and robust chip design.He holds a Ph.D.in EE and M.S.in MEMS from UIUC,and a B.S.in Physics from Peking University.Ming is pa

12、ssionate about catalyzing agility,customizability,and security of future semiconductors.He stays connected with frontier technologies and markets while advising global VCs and startups.VP of Fabless SolutionsVP of Fabless SolutionsMICHAEL CAMPBELL MICHAEL CAMPBELL JEAN PHILIPPE FRICKERJEAN PHILIPPE

13、FRICKERAZIZ M.SAFAAZIZ M.SAFAMING ZHANGMING ZHANGSenior Vice President of Engineering Founder and Chief System ArchitectVP and GM Analytics and AutomationVP of Fabless SolutionsAI FOR TEST,AI FOR TEST,CHALLENGES AND CHALLENGES AND APPROACHESAPPROACHESMichael Campbell Michael Campbell Michael Campbel

14、l is the Senior Vice President of Engineering at QUALCOMM CDMA Technologies,overseeing QCT Product and Test,Test Automation,Failure Analysis,and yield since joining in 1996.He established the FA department and has led various teams,including Design Automation and Quality.Michael has also set up Desi

15、gn and Test facilities in several countries.Currently,he focuses on integrating machine learning into PTE and FA processes.Before QUALCOMM,he worked at Mostek,INMOS,and Honeywell,and he holds a BSEE&CE from Clarkson University.Senior Vice President of Engineering Senior Vice President of Engineering

16、 Jean Philippe FrickerJean Philippe FrickerJean-Philippe(J.P.)is Chief System Architect at Cerebras Systems.Before co-founding Cerebras,J.P.was Senior Hardware Architect at rack-scale flash array startup DSSD(acquired by EMC).Prior to DSSD,J.P.was Lead System Architect at SeaMicro where he designed

17、three generations of fabric-based computer systems.Earlier in his career,J.P.was Director of Hardware Engineering at Alcatel-Lucent and Director of Hardware Engineering at Riverstone Networks.He holds an MS in Electrical Engineering from EPFL cole Polytechnique Fdrale de Lausanne,Switzerland,and has

18、 authored 41 patents.Founder and Chief System ArchitectFounder and Chief System ArchitectAziz M.Safa is Intel Corporations Chief Data Officer and Vice President of Information Technology.He oversees data management,governance,compliance,and internal analytics services,along with business platforms f

19、or Finance,HR,Supply Chain,and Sales and Marketing.His role includes IT platform architecture,engineering,big data,and business intelligence.Since joining Intel in 1993,Safa has held various roles,including general manager of IT enterprise solutions and director for factory automation systems.He ear

20、ned an Intel Achievement Award for his work in automation and has a background as a software engineer at Advanced Micro Devices Inc.Safa holds bachelors and masters degrees in computer science from Texas State University.Aziz M.SafaAziz M.SafaVP and GM Analytics and AutomationVP and GM Analytics and

21、 AutomationKEN BUTLERKEN BUTLERMARC HUTNERMARC HUTNERMARC JACOBSMARC JACOBSELI ROTHELI ROTHMING ZHANGMING ZHANGSenior Director of Applications Marketing Director Product ManagementSenior Director,Fabless SolutionsProduct ManagerVP of Fabless SolutionsAI FOR TEST:AI FOR TEST:CHALLENGES CHALLENGES AND

22、 AND APPROACHESAPPROACHESKen ButlerKen ButlerKen Butler is a Senior Director of Applications Marketing in the Advantest Cloud Solutions(ACS)data analytics platform group at Advantest.Prior to that,he worked for more than 36 years at Texas Instruments in DFT and test generation,semiconductor reliabil

23、ity,analog product and test engineering,and data analytics.Ken has a BS from Oklahoma State University and an MS and PhD from the University of Texas at Austin,all in electrical engineering.He is a Fellow of the IEEE,a Golden Core member of the IEEE Computer Society,and a Senior Member of the ACM.Se

24、nior Director of Applications Marketing Senior Director of Applications Marketing Marc HutnerMarc HutnerMarc Hutner has been innovating in the areas of Design,Test,DFT and Data Analytics for more than 20 years.In June of 2023,he joined Tessent as the Product Management Director of Silicon Learning e

25、nabling how silicon data is applied to yield improvement and silicon debug.Previously,he worked for proteanTecs as Sr Director of product Marketing and Teradyne as a system/silicon architect.A recognized thought leader for design and test at conferences,publications,podcasts,and industry roadmaps.Ma

26、rc has a Bachelor of Computer Engineering(B.Eng)from McGill University in Montreal Canada and a Master of Science in Engineering Management(M.Sc.EM)from Tufts University in Boston MA.Director Product ManagementDirector Product ManagementMarc Jacobs has over 35 years experience in the semiconductor i

27、ndustry and has deep experience in New Product Development,Cost Reduction,and Quality Improvement.Before joining PDF Solutions in 2022,Marc was responsible for Operations Engineering at a large California based fabless company.He has managed product engineering,Test Engineering and packaging across

28、multiple businesses.Senior Director,Fabless SolutionsSenior Director,Fabless SolutionsMarc JacobsMarc JacobsEli RothEli RothEli Roth is the Product Manager for Smart Manufacturing at Teradyne,where he is responsible for product strategy and roadmap for Teradynes Archimedes Analytics Platform.Prior to Teradyne,he was the Director of Engineering at Advanced Energy.He holds a degree in Computer Engineering from Iowa State University.Product ManagerProduct ManagerThank YouThank You