Immersion Community Update.pdf

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1、Cooling Environments-ImmersionImmersion Community UpdateCE-ImmersionRolf Brink,PromersionRolf.BImmersion Community UpdateLeading OpenCompute Immersion Community(2018)Founder and Industry Expert at Promersion(2022),independent consulting,innovation and collaborationAsperitas founder&Board member(2013

2、 2023)Focus on advancing the Immersion Cooling Industry through collaboration,supporting strategic positioning of clients,and engagement in the broader ecosystemRolf Brink/PromersionRolf.Bwww.P09:00-Community introduction,scope,activities,participation by Rolf Brink(Promersion),also on behalf of Joh

3、n Bean(GRC)09:25-Materials and Fluids by Peter Cooper(Submer)Also on behalf of Punith Shivaprasad(Shell)09:30-Immersion TCO Modelling by David Gyulnazaryan(independent)on behalf of Eduard Roytman(Intel)and Allison Boen(independent)09:35-IT equipment warranty by Raul Alvarez(Independent)on behalf of

4、Rich Lappenbusch(SuperMicro)and Michael Cordle(Seagate)09:40-OAI collaboration update by Andy Young(Asperitas)on behalf of Cheng Chen(Meta)and Jessica Gullbrand(Intel)09:45-Hardware Management for Liquid Cooling by Harry Soin(AEI)on behalf of Michael Jones(Vertiv)10:00 Immersion Cooling Hurdles by D

5、avid Gyulnazaryan and Raul Alvarez10:20 Power Distribution in immersion cooling by Harry Soin(AEI)and Oriol Chavanel(Submer)10:40 Immersion Fluid Specification by Rolf Brink(Promersion)and Peter Cooper(Submer)on behalf of Jessica Gullbrand(Intel)11:00 Signal Integrity in immersion by Andy Young(Aspe

6、ritas),also on behalf of Kai Wang(Intel)11:30 Immersion Requirements by Rolf Brink(Promersion),also on behalf of Rick Margerison(Rosseau group)Agenda Morning sessionCE-ImmersionRolf Brink,PromersionTechnology and project introductionImmersion technology introductionLiquid cooling:Uses liquid to extr

7、act heat from components without using air as a mediumImmersion cooling:Fully submerging IT equipment in a dielectric liquidDielectric liquid:Thermally conductive,but electrically insulatingLiquid directly absorbs heat from electronic componentsImmersion cooling key pointsSingle phase:Low-volatile f

8、luids with high evaporation points and high stabilityFluid is circulated through IT equipment and(water cooled)heat exchanger for heat rejection to the facility cooling circuitCirculation method can be driven by mechanical means(pumps)or natural convection flowTwo phase:High volatile fluids with low

9、 boiling pointsFluid evaporates(boils)at low temperature where the evaporation process itself is responsible for cooling of components and a(water cooled)condenser for the heat transfer to the facility cooling circuit.Circulation is achieved by phase-change,causing the gas to move due to buoyancy ef

10、fects,while the condenser facilitates the condensation of fluid and return flow.Immersion typesImplementation typesOpen BathTank-style systems“Open”refers to the“Open-to-air”interface of the fluid(no relation to a lid)Both single and dual-phase tanks are“Open Bath”,despite potential sealing capabili

11、tiesMultiple pieces of IT equipment in a shared bathEnclosed ChassisAlso referred to as clamshell sledsSealed chassis,containing single piece of IT equipment and fluidRack based,resembling typical air-cooled equipmentBoth single and dual phase can be implemented in Enclosed ChassisHybridCombinations

12、 of rack-based and open bath have been tried but currently not active in the industryMode innovation is expected which may not fit in Open Bath or Enclosed Chassis definitionExamples of Immersion SystemsImmersion advantagesUPS-40%GenSet-40%no coolersno chillerspumps-95%High gradetemperatureCombinedH

13、eat Computeno fansno bearingsno chillerrefrigerantsextended lifetimeno evaporative coolingCAPEX:20-35%OPEX:40-50%TCO:30-40%Separating facts from fictionDatacentre operators are experts in availability,not prepared to take risks with“convincing”marketing pitches.Driving a global transitionhttps:/ ind

14、ustry collaboration is key to provide the industry with unbiased facts and data to back it up!Knowledge sharingBest practice sharingReproducible data sharingInvolvement and backing by OEMsInvolvement of facility engineeringInvolvement of hyperscale end usersThis requires sharing,collaboration,adopti

15、on,publication,communication and investmentImmersion leadershipImmersionInactive:Design Guidelines for IT equipmentRolf Brink(Promersion)Hardware Management for Liquid CoolingMick Jones(Vertiv)Material CompatibilityPunith Shivaprasad(Shell)Peter Cooper(Submer)Immersion RequirementsRolf Brink(Promers

16、ion)Rick Margerison(Rosseau Group)Power Distribution in ImmersionHarry Soin(AEI)Oriol Chavanel(Submer)Immersion Cooling HurdlesDavid GyulnazaryanRaul AlvarezOAI(server project collaboration)Rolf Brink(Promersion)Cheng Chen(Meta)TCO Modelling for ImmersionEduard Roytman(Intel)Allison Boen(Alcatex)War

17、ranty Guidelines for Immersed ITRich Lappenbusch(SuperMicro)Michael Cordle(Seagate)Signal IntegrityKai Wang(Intel)Andy Young(Asperitas)Rolf Brink(Promersion)John Bean(GRC)IEC Industry LiaisonRolf Brink(Promersion)John Bean(GRC)ASHRAE TC 9.9 harmonizationJohn Bean(GRC)Immersion is the largest project

18、 in OCP with 300+active members and 9 active workstreams!Immersion is the largest project in OCP with 300+active members and 9 active workstreams!SCAN TO JOINCooling EnvironmentsPL:Don Mitchell&Sean SivapalanDoor Heat ExchangersLead:John Fernandez(Facebook)ImmersionLeads:Rolf Brink(Promersion)&John

19、Bean(GRC)Cold PlateLead:Jordan Johnson(Intel)ACFJohn Menoche(Vertiv)&John Gross(J.M.Gross Engineering)Heat ReuseCosimo Pecchioli(Alfa Laval)&Jaime Comella(Cloud&Heat)Actively supporting the industryImmersion Hurdles Workstream Active identification of hurdles and downsides to immersion Creation of b

20、ase collateral,identify the real issue Identification of required efforts to resolve Preparation of new workstream requirementsNew workstream creation Workstream proposal creation with community Call for workstream leadership volunteers and assignment Call schedule publication Leadership onboarding

21、and workstream kick-offHurdle resolution Community engagement Inventory of existing work and knowledge Community driven creation of new materials to address topic Publication of workSCAN TO JOINImmersion HurdlesStep 1:Scoping baseline Proposal documents DONE(November 2022)Brief presentation outline

22、of:Workstream scopeType of work and expertise requiredClear description of deliverablesStep 2:Workstream advancement DONE(December 2022)Workstream leadership sign-off by Project LeadershipWorkstream creationCall schedule creationStep 3:Project participation call DONE(January 2022)Participation reque

23、sts sent out by Workstream and Project LeadsAll calls kicked off Jan/FebYoungest workstreams kicked off in FebruaryHurdles IncubatorTCO Modelling for ImmersionEduard Roytman(Intel)Allison Boen(Alcatex)Warranty Guidelines for Immersed ITRich Lappenbusch(SuperMicro)Michael Cordle(Seagate)Signal Integr

24、ityKai Wang(Intel)Andy Young(Asperitas)All project information can be found on Immersion Wikihttps:/www.opencompute.org/wiki/Cooling_Environments/ImmersionComplete contributions overviewImmersion Requirements Qualification processImmersion Project and workstreams overviewCall schedules and GoToMeeti

25、ng informationWorkstream leadershipAccess to all previous calls of project and workstreamsPresentation materialsMeeting recordings per workstreamImmersion Wiki page updateImmersion Wiki for all detailed information and join linksWeekly calls on Mondays-Wednesdays2023 Immersion call schedulePTCETCST1

26、st Monday1st Tuesday1st Wednesday2nd Monday2nd Tuesday2nd Wednesday07:00-08:00 16:00-17:00 22:00-23:00Power Distribution in ImmersionImmersion Steering GroupMaterial CompatibilityImmersion cooling hurdles08:00-09:00 17:00-18:00 23:00-00:00 Signal IntegrityACFHardware ManagementIT Warranty in Immersi

27、onHeat ReuseTCO ModellingPTCETCST3rd Monday3rd Tuesday3rd Wednesday4th Monday4th Tuesday4th Wednesday07:00-08:00 16:00-17:00 22:00-23:00Community callImmersion Req addendumMaterial CompatibilityOAI Collaboration08:00-09:00 17:00-18:00 23:00-00:00 reserved SIACFHardware ManagementReserved IT Warranty

28、Heat ReuseTCO ModellingInvitation onlyOpen to communityBlocked by affiliated projectImmersion Wiki for all detailed information and join linksThe amount of workstreams is preventing general topics in monthly callsDemand for better balance between workstream debriefs and relevant industry topicsStart

29、ing in May 2023Alternating bi-monthly content rotationMonth 1:Full workstream content(8 min each)Month 2:Other topics(20 min each)Major workstream developmentsIndustry developmentsContributor contentRe-structuring monthly progress debriefsDetails to be announcedContent requested,please contact Rolf.

30、Band J2023 Immersion Project draft scheduleMay 16 topic:optimizationNotable project materials/announcementsCE-Heat Reuse project overviewImmersion optimization(External content)Jun 20 project updateProject announcementsAll workstream updatesJuly 18 topic:IndustryNotable project materials/announcemen

31、tsCE-Advanced Cooling Facilities project overviewIndustry insights(External content)August 15 project updateProject announcementsAll workstream updatesSeptember 19 topic:Case studiesNotable project materials/announcementsCE-Cold Plate project overviewCase Studies(External content)October 17Global Su

32、mmitNovember 21 topic:TBDNotable project materials/announcementsCE-Door Heat Exchangers project overviewTBD(External Content)December 19 project updateProject announcementsAll workstream updatesNew work products now published on https:/www.opencompute.org/contributions:Material Compatibility in Imme

33、rsion Cooling by Materials workstreamBase Specification for Immersion Fluids by IntelWarm Liquid Cooled Cloud Facilities by MicrosoftLinks to recent publicationsCE-ImmersionCall schedule:Each 2ndand 4thTuesday7:00-8:00am PT/9:00-10:00am CT/16.00-17.00 CEThttps:/ and MaterialsPresented by:Peter Coope

34、r,new workstream lead Workstream leadership:Punith Shivaprasad,Shell,Peter Cooper,Submer,Peter.CSCAN TO JOIN Materials and Fluids2022 Achievements White Paper Publications:Material Compatibility in Immersion CoolingBase Specification for Immersion FluidsScoping of work underway for 2023 workstream e

35、fforts:Continuation of ongoing work on individual IT component level material compatibility testingInvolving cable manufacturers on sharing their expertise on material compatibility and signal integrity using different immersion cooling fluids Optical fiber cables,and connectors testing for Material

36、 Compatibility Server level or system level testing for material compatibility and long-term reliabilityWork products and 2023 focusSCAN TO JOIN Materials and FluidsMaterial Compatibility in ImmersionImmersion Fluid Base SpecificationOther topics including:Auto Ignition Temperature fluid suppliers s

37、haring some data for immersion fluids and recommendations changes to workstream on specification requirements Fluid manufacturer sharing results on acidity specs limits for various hydrocarbons Harmonization with IEC and ULDevelop cleaning procedure for servers when swapping immersion cooling fluids

38、 with different chemistries Accelerated aging testing of immersion fluids 2023 focusScoping of work underway for 2023 workstream efforts(Contd.):SCAN TO JOIN Materials and FluidsCE-ImmersionCall schedule:Each 2ndand 4thWednesday8:00-9:00am PT/10:00-11:00am CT/17.00-18.00 CEThttps:/ TCO ModellingPres

39、ented by:David Gyulnazaryan,workstream co-lead HurdlesWorkstream leadership:Allison Boen,Independent,Allison.BEduard Roytman,Intel,Eduard.RSCAN TO JOIN TCO ModellingConnect.Collaborate.Accelerate.Immersion TCO-Regional Summit 2023 updateOur goal is to help educate industry on immersion cooling and h

40、elp with open,broadly applicable TCO tool to help understand the benefits and tradeoffs vs air cooling.New workstream,kicked-off in January 2023.Now meeting twice a month.High level of community engagement and contribution.Near term focus on learning,definitions and reviews of initial contributionsT

41、wo notable contributions were presented in Wednesday,March 22 callOpen license TCO model contribution by Rolf Brink(Promersion)and AsperitasReference to Liquid Cooling TCO handbook by Rich Lappenbusch and The Green Gridwork in progress to obtain clearance to be used under OCP T&C.Additional proposal

42、s for contributions were voiced,such as Green Revolution Cooling and Submer.Goal is to present intermediate results in Global Summit in San Jose,CA in October 2023.CE-ImmersionCall schedule:Each 2ndMonday8:00-9:00am PT/10:00-11:00am CT/17.00-18.00 CEThttps:/ Equipment Warranty in ImmersionPresented

43、by:Raul Alvarez,workstream co-lead HurdlesWorkstream leadership:Rich Lappenbusch,SuperMicro,Rich.LMichael Cordle,Seagate,Michael.CSCAN TO JOIN IT WarrantyWorkstream ScopeIn context of OCP Immersion Fluid specificationIT equipment(ITE)and components and its cooling systems onlyHighlighting what exist

44、ing standard warranty norms are for air cooling and immersion cooling with differences called outStrategy OverviewDefine what is normal for ITE warranties is and establish warranty“best practices”Document existing extended and optional warranties by component in tablesSolicit input from the heat gen

45、erating product leaders and their manufacturersDocument where gaps in coverage,maturity and customer assurance existDocument and share our final deliverable later this yearWarranty GuidelinesWarranty collection and analysis underway1.top 10 global motherboard manufacturers2.top 10 global central pro

46、cessor manufacturers3.top 10 global memory manufacturers4.top 10 global drive manufacturers5.top 10 global network interface chip and card manufacturers6.top 10 global power supply manufacturers7.top 10 global graphics processor manufacturers8.top 10 global network processor manufacturers9.top 10 gl

47、obal integrated circuit manufacturers10.Warranty Schedule DevManufacturer Trade NameManufacturer Legal NameManufacturer DUNSManufacturer Part#Product SKUProduct Type and SubtypeStandard Warranty BeginsStandard Warranty Duration YearsStandard Warranty Duration MonthsStandard Warranty Duration DaysSta

48、ndard Warranty URL locationStandard Warranty limitationsStandard Warranty inclusionsStandard Warranty Country USAExtended Warranty BeginsExtended Warranty Duration YearsExtended Warranty Duration MonthsExtended Warranty Duration DaysExtended Warranty URL locationExtended Warranty limitationsExtended

49、 Warranty inclusions Extended Warranty Advisory Cost as USD Extended Warranty Advisory Cost as PercentageCoolitCoolit Systems Inc.nonenoneSystem date on invoiceUSA#3%SupermicroSUPER MICRO COMPUTER,INC.#nonenoneSystem date on invoice0001 0012 0365 https:/ socket pins,chipsets,processorsadvance part r

50、eplacement within 30 days of startUSAdate on invoice0003 0036 1095 https:/ socket pins,chipsets,processorsadvance part replacement within 30 days of start#3%GRCGreen Revolution Cooling,Inc.nonenoneSystem date on invoiceUSA#3%SubmerSubmer Tecnologies,S.L.nonenoneSystem date on invoiceUSA#3%AsperitasA

51、ecorsis BV nonenoneSystem date on invoiceUSA#3%LiquidCoolLiquidCool SolutionsnonenoneSystem date on invoiceUSA#3%LiquidStackLiquidStack Holding B.V.nonenoneSystem date on invoiceUSA#3%WiwynnWiwynn CorporationnonenoneSystem date on invoiceUSA#3%IceotopeIceotope Technologies LimitednonenoneSystem date

52、 on invoiceUSA#3%3M3M Company00-617-3082nonenoneSystem date on invoiceUSA#3%SolvaySolvay SA13-086-8656nonenoneSystem date on invoiceUSA#3%ElectroCoolEngineered FluidsnonenoneSystem date on invoiceUSA#3%ShellShellnonenoneSystem date on invoiceUSA#3%OpticoolDSI Ventures,Inc.nonenoneSystem date on invo

53、iceUSA#3%TMGCoreTMGcore,Inc nonenoneSystem date on invoiceUSA#3%CargillCargill,Incorporated.00-624-9189nonenoneSystem date on invoiceUSA#3%ChemoursThe Chemours Company07-947-9503nonenoneSystem date on invoiceUSA#3%ULUL LLC#nonenoneSystem date on invoiceUSA#3%LubrizolLubrizol CorporationnonenoneSyste

54、m date on invoiceUSA#3%AlibabaAlibaba China Technology Co LtdnonenoneSystem date on invoiceUSA#3%ByteDanceBytedance Ltd nonenoneSystem date on invoiceUSA#3%DellPowerEdge C6520date on invoiceIntelIntel Corporation047897855nonenoneSystem date on invoiceIBMINTERNATIONAL BUSINESS MACHINES CORPORATION#no

55、nenoneSystem date on invoiceFocused on ranked heat generation componentsDocumenting public info as isUsing UN commodity categories and namesWarranty Schedules CategoriesHeatRankCommodity Name_UNCommodity_UN1Central processing unit CPU processors432015031Graphics or video accelerator cards432014011Hi

56、gh end computer servers432115021Computer servers432115011Barebone computer432115202Memory module cards432014022Network interface cards432014042Video capture boards432015313Motherboards432015133Hard disk drives432018033Daughterboards432015073Network switches432226123Radio frequency data communication

57、 equipment432217213Radio core equipment432217043Video networking equipment432226193Coprocessor432015604Brushless coolant pump401515754Solid state drive SSD432018304Peripheral component interconnect PCI card432014114Storage device controller432018344Hard disk arrays432018024Optical network transmit c

58、ards432014064Optical network receive cards432014054Time synchronized generator43221724CE-ImmersionCall schedule:Closed group,invitation onlyOAI CollaborationPresented by:Andy Young,workstream lead Signal IntegrityWorkstream leadership:Rolf Brink,Promersion,Rolf.BJessica Gullbrand,Intel,Jessica.GChen

59、g Chen,Meta,ChengCWhat does OAI Group doQ2,2019Q2,2019Q42018Q42018Q22020Q22020Q12022Q12022Q12023 Q12023 OAM Concept25G-NRZPCIe G3OAM v1.0UBB v0.428G-NRZPCIe G4OAM v1.1UBB v1.056G-PAM4PCIe G4OAM v1.5UBB v1.5112G-PAM4PCIe G5OAM v2.0UBB v2.0EXP v1.0112G-PAM4PCIe G5/G6450WAir Cooled700W(450W)Air Cooled7

60、00W(450W)Air/Liquid Cooled700WAir/Liquid Cooled1000WAir/Liquid Cooled(Immersion study WIP)Build Stronger Eco-System for OAI users/integrators/suppliersOAMUBBSystemHigh SpeedPowerCoolingToolFormed a closed group to focus on in-depth evaluation of OAI products in immersion cooling.Cooling PerformanceS

61、hared understanding on performance/temperature gradientsSingle phase immersionTwo phase immersionBuild consensus on efficiency and sustainability gainsMaterial Compatibility&ReliabilityCommodity Components OAM,Exp Card,Optics,etc.Thermal/Mechanical parts TIM,Metal,PCB,Adhesives,etc.Based on OCP flui

62、d specificationSignal Integrity Evaluation112G PAM4,PCIe Gen 5/6 Overall ScopeCurrent Focus Thermal Perf&EfficiencyCompleted problem definition in terms ofFacilities cooling boundary conditions(aligned with ASHRAE FWS ranges and assumed dt on water-side)Chassis space-claim constraints(keep-outs and

63、working zones)TTV module defined(OAM V1)and TDP levels(L/M/H)Decisionsaccount for energy usage(PUE)at rack/tank scale(including intermediate pumps)account for temperature delta(dt)at rack/tank scale(including intermediate heat exchangers)CE-ImmersionCall schedule:Each 1stand 3rdWednesday8:00-9:00am

64、PT/10:00-11:00am CT/17.00-18.00 CEThttps:/ ManagementPresented by:Harry Soin,workstream co-lead Power DistributionWorkstream leadership:Mick Jones,Vertiv,Mick.JSCAN TO JOIN HW MMTDefine a unified schema under DMTF Redfish for management of all OCP Liquid Cooling Equipment:CDUsImmersion;Tank and Encl

65、osed ChassisCold Plate;BMCs,aggregation and control loopsRear Door HXFacilities;FWS,valves,inline sensors,etcHeat Re-use;Tanks/Reservoirs,Heat Exchangers,Pumps,etcCreate mockup(examples)of the expected output from the compliant management interfaces and management systemsCreate/extend Interoperabili

66、ty ProfilesPurposev0.95 Work in progress of Redfish schema released.Refer to https:/www.dmtf.org/sites/default/files/standards/documents/DSP2064_0.9WIP90.pdfV1.0 will be released in next Redfish Release80%coverage of all resources and relationships discussedV1+rollout of missing schema and iteration

67、s based on v1.0 releaseSustaining mode is expected 6-9 months on after second release of Redfish bundle.After v2.095%coverage of discussed items(more esoteric or low priority items will be pushed to sustaining releases)ProgressCross project/cross workstream cooperation across all ofOCP CEStatus trac

68、ked in Immersion projectStatus is also tracked and presented to Hardware Management projectRequest for supportReview;please review the WIPReview;When v1.0 is released please provide feedbackProfiles(pending);These will determine OCP Hardware Management complianceReview/contribute and dont be surpris

69、edPeopleCE-ImmersionRolf Brink,PromersionImmersion CommunityBottom-up activitiesThe community determines direction and contentLeadership facilitates community and maintains direction and progressOCP as organisation does not“decide”on contentEasy to access and become influencer or creatorJoin the cal

70、ls,listen in and engageNo such thing as stupid questionsNo membership required to dial-in and contributeMembership required to be credited for contributionsCommunity way of workFacilitating the growth and global adoption of immersion coolingFacilitating open specificationsCreating best practicesFaci

71、litating industry standardsIdentifying issues and risks is key to growthHurdles workstream tasked with identifying obstacles,risks,problems and challengesWith sufficient interest and momentum,incubate new workstreamsTCO Modelling,IT Warranty and Signal Integrity are launched out of hurdlesNext prese

72、ntation on Hurdles by David Gyulnazaryan and Raul Alvarez.Community strategy10:00 Immersion Cooling Hurdles by David Gyulnazaryan and Raul Alvarez10:20 Power Distribution by Harry Soin and Oriol Chavanel10:40 Immersion Fluid Specification by Rolf Brink(on behalf of Intel)11:00 Signal Integrity in im

73、mersion by Andy Young11:30 Immersion Requirements by Rolf BrinkImmersion related sessions coming up:Sign up for the community and workstream calls Contributeto the projects and workstreams Shareany insight in obstacles or hurdles you see Helpshape the future for Immersion Cooling!All information can be found in the Immersion Wikihttps:/www.opencompute.org/wiki/Cooling_Environments/Immersion Get connected to the monthly community callsSupport the global transitionSCAN TO JOIN ImmersionIMMERSION WIKIThank you!