用于SR應用的共封裝光學器件中的VCSEL.pdf

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1、OCP Global Summit October 18,2023|San Jose,CAVipul Bhatt,CoherentFrank Flens,CoherentVCSELs in Co-Packaged Optics for Short-Reach ApplicationsMultimode Transceivers Have a Track Record of Success Proportions of various transceiver types,historic and projectedMultimode remains significantSource:Multi

2、modeMultimodeMultimodeMultimode Because Short Reach and Multimode are Made for Each OtherProperties of multimode opticsRequirements of short-reach applicationsVCSELLEDEdge-Emitting LaserLarge tolerances,low power,low complexity,high yields(margins)Multimode Specs Have High Production YieldsOMA outer

3、,each lane,minFor TDECQ 1.8 dBFor 1.8 dB TDECQ 4.4-2.6-4.4+TDECQTDECQ,each lane(max)4.4RS,each lane(max)For TECQ 1.8 dBFor 1.8 dB TECQ 4.4-4.4-6.2+TECQSRS,each lane(max)-1.8Power Budget(for max TDECQ)6.2Channel Insertion Loss1.7Penalties(for max TDECQ)4.5Power budgetTransmitterReceiverBudgetEye Clos

4、ure(dB),TECQor TDECQ1.8-6.2+TECQ4.4-4.4-2.6-4.4+TDECQ0-6.2TDECQ max=4.4ChIL+addl penalties=1.8RSTxOMA minExample:IEEE 800G-VR8(50 m on OM4)dBmFlexibility,Margin.By Design.Cost Improves with Volume;Volume Requires MarginCPO Needs Additional Link Power Budget for IEEE TP2&TP3 ComplianceMOTION I:Multim

5、ode CPO Research Project800G,16 fibers x 56G NRZ per fiber 1MOTION 1st-generation modulePowerTM10 Processor&MOTION50 Gb/s NRZ data51.28G clockNRZ dataAcknowledgment:“The information,data,or work presented herein was funded in part by the Advanced Research Projects Agency-Energy(ARPA-E),U.S.Departmen

6、t of Energy,under Award Number DE-AR0000846.The views and opinions of authors expressed herein do not necessarily state or reflect those of the United States Government or any agency thereof.”MOTION II:Multimode CPO Research Project3.2T,16 fibers x 2 per fiber x 112G PAM4 per 21.15 pJ/bit including

7、the laser!1.69 pJ/bitTotal:3 pJ/bit including lasers3.2T Multimode CPO Research Project:Architecture DescriptionArchitectural ParameterDescriptionApplication requirement or technical capabilityTechnical capabilityUse caseAll short-reach connectivity use cases:Artificial Intelligence/Machine Learning

8、 networks,HPC(high-performance computing)interconnects,Ethernet server-to-ToR links.Links/HostN x 3.2T,where N is limited only by host ASIC designHost interface(power)USR(1 pJ/bit).Uses a custom low-power interface that requires a clock.Un-retimed/retimed?Un-retimedFEC requirementsKP4Block DiagramSe

9、e page 83.2T Multimode CPO Research Project:Key ParametersParameterUnitsMinMaxCommentsData rate per laneGbps56112#lanes/link#32Aggregate BW/linkGbps3584Linear BW densityGbps/mm276Package size 13 mm x 13 mmAreal BW densityGbps/mm221Energy efficiency single direction linkpJ/bit3Energy efficiency with

10、external light sourcepJ/bit3No external light source required.Total Energy EfficiencypJ/bit3Reachmeters50OM4Latency(no FEC)nanosec20Plus fiber propagation delayBER(no FEC)1e-9PRBSLatency(post FEC)nanosec100Assume KP4 FEC has 80 nsec latency,encode+decode per linkBER(Post FEC)1e-18AWGNOptical channel

11、MMOM3,OM4,OM5.No PM fiber requiredOptical connectorsYes/NoYesMax Operating Temp C070Case temperature,deg CReliability/linkFITS50Per CPO moduleLiquid cooling Closed-system liquid cooling supported.Need depends on system design.Cost(initial volumes)$/Gbps0.25Cost(large volumes)$/Gbps0.25Commercial GA

12、timingCY202720301.6T transceiver generation will likely remain pluggable1:1 Cold-Sparing Improves VCSEL Reliability SignificantlyBy two to three orders of magnitude1000 ppmCumulative failures for typical single channel VCSEL(MTTFuse=50 yrs,=0.8),Fixed FIT=10 to account for random failuresLaser Spari

13、ng is FastSwitching from Primary to Spare VCSEL Takes 100 nsecCh NPrimarySpareCh N+3ConclusionVCSEL-based Multimode CPO is an excellent fit for short-reach applicationsProven track record of success in pluggable formEncouraging research results in CPO formLow power consumptionLow costProduction-frie

14、ndly specs with marginHigh reliability with 1:1 cold sparingReferences1.“MOTION:Multi-wavelength Optical Transceiver Integrated On a Node”by Dan Kuchta,IBM https:/arpa-e.energy.gov/sites/default/files/IBM_Kuchta_ENLITENED_Annual_Meeting.pdf2.Kuchta,Daniel.“Co-Packaging on Organic Laminates:MOTION Phase 2.”ARPA-E ENLITENED Kickoff Meeting,13 Jan.2021 http:/arpa-e.energy.gov/sites/default/files/2021-01/DAY1_Kuchta_ENLITENED%20Kickoff.pdf