Augmented Silicon Photonics for Data Center and AIML optical interconnects.pdf

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Augmented Silicon Photonics for Data Center and AIML optical interconnects.pdf

1、Yannick PAILLARD,Chief Commercial Officer,SCINTIL PhotonicsAugmented Silicon Photonics for Data Center and AI/ML optical interconnectsSPECIAL FOCUS:OPTICSOPTICSNetwork Performances Must Scale Faster to Support AI NeedsEast West traffic ComputesTrafficNorth-South traffic UsersGenerative AIIntelligent

2、 AppsAI Factory Machine Learning CloudTraditionalx 2 x 4 x 2 x 4 x 8 TrafficDevelopment cycle of high-speed interfaces is not fast enough,parallelism is required Cost and Power increase much faster than the rest of the compute system AI workload diversity pushes for new/composable optical network ar

3、chitectureIncreasing Speed of Optics Comes with Challenges 4 42 2Number of lanesIncrease baud rateHigher Modulation order QAMQAM-161656G56G112G112Gx 4 x 4 x 8 x 8 x 16 x 16 ParallelCWDM 4,8DWDM 8,16,32IntegrationIntegrationLatencyLatencyChallengesChallengesPAMPAM-4 4Optics for AI Scale Up,mainly par

4、allel todayAI accelerators+HBMCXL DDR controler DDRDDRDDRPCIeCPUs+DDRCXL DDR controler DDRDDRDDRPCIeCXL DDR controler DDRDDRDDRPCIePCIePCIePCIeCXL SwitchAEC/AOCPCIe/CXL SwitchAEC/AOC800G-ParallelPluggable OpticsEthernetor proprietaryp2pPacket SwitchingOptics with Optical Circuit Switching,requires W

5、avelength Division Multiplexing(WDM)AI accelerators+HBMCXL DDR controler DDRDDRDDRPCIeCPUs+DDRCXL DDR controler DDRDDRDDRPCIeCXL DDR controler DDRDDRDDRPCIePCIePCIePCIeCXL SwitchCPOI/OPCIe/CXL SwitchCPOI/0800G/1.6T MultiplexCWDM,LWDM,DWDM DWDM External Laser SourceOCSPluggable OpticsEthernetor propr

6、ietaryOCSBased on standard silicon photonics available from commercial foundries and massively deployed in datacentersScintil Augmented Silicon PhotonicsIntegrate the Lasers on the backside of the silicon photonic wafer(after flipping it)LASERSGeSiNSOI SubstrateGeSiNSiSi and SiN passivesGe PDSi MODF

7、abrication of the Standard silicon photonic waferHigh-level of optics integration including lasers and optical amplifiersHigh coupling efficiency of the lasersMuch-simplified packaging scheme with less components Leverage mature and standard Silicon Photonic PlatformSupport flip-chip assembly with h

8、igh-speed electronics ICsScintil Technology BenefitsSilicon substrateGeSiNSeamless integration of multiple lasers on a backside of standard silicon photonics waferSilicon Integrated MZM modulators3mm,35 GHz BW,56GBaudPAM4 Fixed(SiN)or Tunable(Si)filters(C/D-WDM Mux/Dmux)Germanium waveguide Photo Det

9、ectors 45 GHz,56GBaud PAM4III-V-on-Silicon integrated lasers and amplifiersFully Integrated Circuit PrototypeLow loss SiN passivesFirst monolithic integration of III-V/Si SOAs,Ge waveguide-PDs,Si active and Silicon Nitride(SiN)passive devices,Source:ECOC 2022,M.Peyrou,et al.,Fully Integrated Silicon

10、 Photonic Circuit technology with SiN passives,Ge photodetectors and III-V/Si SOAsSCINTIL Product focusPluggable OpticsExternal Laser Source for Co-Packaged OpticsOptical transmissionSwitch,GPUSwitch,GPUMATRx are transceiver circuits with integrated lasersTransmit/Receive 8 x 100/200Gbps,PAM-48 opti

11、cal carriers(CWDM or parallel)for 800G and 1.6TLEAF Light is an External Laser source for DWDM co-packaged optical I/O8 or 16lasers frequencies spaced by 100 GHz.Come as die or packaged in a module with its control electronics.Optical transmission2 x 800G TxPICMATRx-1600G,2x800G-FR4 Tx(4x200G CWDM4)

12、4x MZMMUXLaserLaser Laser Laser 4x MZMMUXSOASOAEC=Edge Couplerd=off-the-shelf modulator driverECEC2 x fibersMonitoring PD4 chDRV4 ch DRVMulti-wavelength DFB laser array multiplexed on 2 portsBy 8 or 16 configurations100 or 200GHz spacing+/-2GHz Wavelength locking featureLEAF Light-External Laser Sou

13、rce x8 DFB Laser Array PICECECMux 2Mux 1Port 1Port 2Control ElectronicsLaser DriversEC=Edge CouplerLaserLaser Laser Laser LaserLaser Laser Laser External Laser Source packaged with control electronicsCall to ActionsExplore WDM pluggable optics requirements for achieving the highest power efficiency for AI/ML use case Explore requirements to facilitate the integration of co-packaged optical I/O with an external DWDM laser sourceFurther information at www.scintil-My contact:yannick.paillardscintil- Thank you!

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