1、1英飛凌為英飛凌為AI數據中心提供先進的高能效電源解決方案數據中心提供先進的高能效電源解決方案Aug 20242Copyright Infineon Technologies AG 2024.All rights reserved.Aug 2024restrictedAI Server PSU Trend&Requirements 13Infineon CoolGaNTMPowers Next-Generation AI Server SMPS29Reference Designs317Key takeaways420Table of contents3Copyright Infineon T
2、echnologies AG 2024.All rights reserved.Aug 2024restrictedAI Server PSU Trend&Requirements 13Infineon CoolGaNTMPowers Next-Generation AI Server SMPS27Reference Designs316Key takeaways418Table of contents4Copyright Infineon Technologies AG 2024.All rights reserved.Aug 2024restricted201220285002008201
3、42022201020162018202020242026203001.0001.5002.000Server CPUsAI systems demand higher power that further increases semiconductor content50%AI GPU/TPURelease dateAI Training GPU/TPUUnit CAGR1 40%Avg.BOM CAGR1 10%Semiconductor SAM CAGR1Source:Company information;Infineon analysis 1CAGR 2023-2027 in Inf
4、ineon relevant market 2Incl.AI inference 15%Other ServersUnit CAGR1,2 6%BOM CAGR1,2 300kHz=98.5%Natural current sharing=98.5%Highest densitySiC400V SiCSiGaNPFCDC-DCSiGaNSiSiSiSiSiGaNGaNSiCGaNSiCGaN13Copyright Infineon Technologies AG 2024.All rights reserved.Aug 2024restrictedGen 1/2 AI PSU:1-ph 277
5、 Vac or 347 Vac to extend power to 5.5 kW and 8kWPSU Block DiagramSchematic of Power TopologySiCGaNSiPSU Block DiagramSchematic of Power TopologySiGaNSiGaNSi SiC for CCM TP PFC,GaN for LLC GaN for TCM TP PFC,GaN for LLC14Copyright Infineon Technologies AG 2024.All rights reserved.Aug 2024restricted8
6、60V380VGen 3 AI PSU:3-Ph 480Vac architecture and 380V distribution for 22kWPSU Block DiagramSchematic of Power Topology380V430V430V2x2xVienna PFC+FB LLCGaNGaNGaNBDSSiCN3-ph Vienna22kW48VN430V430V380V4x 5.5kW FB LLC3x 7.7kW 3-L LLCFB LLC1.8kW x 12 setsPSU on power shelfBus converter on server boardBu
7、s bar480Vac L-LPSU Block DiagramSchematic of Power TopologyNThree Phase B622kW48V860V380VFB LLC2 x11kWFB LLC1.8kW x 12 setsPSU on power shelfBus converter on server boardB6GaNSiCSiC SiC or GaN BDS for CCM TP PFC,GaN for LLC SiC for B6 PFC,and LLC pri,GaN for LLC sec.15Copyright Infineon Technologies
8、 AG 2024.All rights reserved.Aug 2024restrictedInfineon industrializes top-side cooling with the most robust roadmap in the market Enabler for high power and densityTHD Through Hole DeviceRobust thermal performanceHigh package inductanceDDPAKQDPAKTOLTDSO-20 D2PAKTO-247TOLLThinPAK8x8/5x6DSO-20 BSSMD
9、Bottom-side coolingMedium thermal performanceLow package inductanceSMD top-side coolingOptimal thermal performanceOptimal loop inductance and PCB design16Copyright Infineon Technologies AG 2024.All rights reserved.Aug 2024restrictedAI Server PSU Trend&Requirements 13Infineon CoolGaNTMPowers Next-Gen
10、eration AI Server SMPS27Reference Designs316Key takeaways418Table of contents17Copyright Infineon Technologies AG 2024.All rights reserved.Aug 2024restrictedReference Board 8 kW PSUShowcasing CoolMOS and CoolSiC and CoolGaNREF_8KW_HFHD_PSU FeaturesBenefitsFull IFX BOM content including CoolMOSTM,Coo
11、lSiCTM,CoolGaNTMand OptiMOSTMNovel integrated planar magnetic constructionHold-up time extension Full digital control(PFC and DCDC)Interleaved Totem-Pole PFC+Full-Bridge GaN LLCTarget 98%peak efficiencyPower density 100W/in (-38%volume vs ORv3 specification)Hold up time extension circuit for 20ms 10
12、0%Load 400kHz LLC switching frequency enabled with GaNBased on 2x REF_3K3W_HDHF_PSU reference board446mm73.5mm40mmORv3 Specs.73.5 x 720 x 40 mm Learn MoreInfineon components8x IGT65R025D2,8x IMT65R040M2H,4x IMT65R010M2H,4x IPT60R016CM8,2x IPT60R050G7,2x IDL12G65C5,1x IPT60R022S7,60 x IQE03xN08LM6,10
13、 x ISC018N08NM61EDB8275F,1EDN8511B,2EDB9259Y,1EDN8550BBAT46WJ,BAT165,BSS138NICE2QR2280G,TLS4120D0EPV33,4DIR1400HControllerXMC4200Technical detailsInput voltage range180 VAC 275 VACOutput voltage50 VDC nominalOutput power max8000 WEfficiency 98%Power factor(load 10%)PF 0.98,20%80%loadiTHD 10%,20%80%l
14、oad 180 275 VACTemperature Ambient0C to 40C -38%18Copyright Infineon Technologies AG 2024.All rights reserved.Aug 2024restrictedAI Server PSU Trend&Requirements 13Infineon CoolGaNTMPowers Next-Generation AI Server SMPS27Reference Designs316Key takeaways418Table of contents19Copyright Infineon Techno
15、logies AG 2024.All rights reserved.Aug 2024restrictedSummary&Key take-aways AI server SMPS higher power is reached by scaling up the number of interleaved stages and using lower Rds_on devices.Further higher power requirement will push the SMPS to 3-Phase topologies(e.g.:Vienna)and higher DC voltage
16、 distribution(ex:380V).AI servers show significant higher power trend,and possibly new rack architecture and cooling.Top side cooling packages can be an enabler for new cold plate liquid cooled SMPS.Infineon CoolGaNTMLeads the Way in Next-Generation AI Server SMPS Together with Si and SiC Power Technologies20