2020年5G基建半導體分析報告 -美國半導體協會（英文版）（32頁）.pdf

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1、 SIA CONFIDENTIAL | 5G INFRASTRUCTURE ANALYSIS | 1 5G WIRELESS INFRASTRUCTURE SEMICONDUCTOR ANALYSIS 2 | 5G INFRASTRUCTURE ANALYSIS 8 | 5G INFRASTRUCTURE ANALYSIS | SIA CONFIDENTIAL EXECUTIVE SUMMARY On behalf of SIA, a wireless market intelligence firm has analyzed all of the semiconductor function

2、 product families within the key elements of a 5G radio access network (RAN)- baseband unit (BBU) and active antenna unit (AAU)/remote radio unit (RRU) systems for 5G base stations along with the current domestic United States and foreign/international semiconductor suppliers. Our conclusion is that

3、 despite the United States maintaining overall market-share leadership in semiconductors with a 45% share of the global market, substitutes for U.S. components exist for nearly every semiconductor product family required to build a complete RAN infrastructure. In fact, our analysis indicates that of

4、 the more than fifty critical semiconductor elements necessary to design, manufacture, and sell a competitive 5G RAN network1, only 3 components could face supply constraints outside the United States in the event of an export restriction. For each of those three components, we have further conclude

5、d that alternatives are currently being deployed or under active development, especially within China by Huaweis semiconductor design arm, HiSilicon. 5G INFRASTRUCTURE ANALYSIS | 4 OUR CONCLUSION FOR THE BASEBAND UNIT SYSTEM FOR A 5G BASE STATION IS THAT THE TWO KEY SEMICONDUCTOR PRODUCT FAMILIES TH

6、AT MAY PRESENT SUPPLY ISSUES OUTSIDE OF THE UNITED STATES ARE: Commercial off-the-shelf Field Programmable Gate Arrays (FPGAs) 10Gbps Ethernet PHY Transceivers/Switches This is based upon current available information regarding foreign/ international semiconductor suppliers, their current products,

7、and performance metrics. For FPGAs, this bottleneck only applies to merchant FPGAs, as several BBU vendors including Huawei, Ericsson, and Nokia have long had internal capability to develop their own Application Specific Integrated Circuits (ASICs) that can replicate the minimum necessary requiremen

8、ts of an FPGA within a baseband unit. This is called the ASIC crossover, as vendors first deploy FPGAs in initial product release then deploy ASICs to reduce costs and improve power efficiency. These ASICs are designed in-house with fabrication outsourced to leading foundries, typically at the 14nm

9、FinFET node? ASICs for wireless infrastructure are developed on the same advanced process nodes as merchant chips. Deploying an ASIC as opposed to an FPGA does not degrade the overall functionality of the BBU. For merchant FPGAs, we note that state-of-the-art process nodes are at 7nm FinFET using Ta

10、iwan Semiconductor Manufacturing Company (TSMC) silicon foundry services. Current state of the art FPGAs available from Chinese domestic suppliers are at a 28nm process node. While it is logical that foreign FPGA suppliers have access to all of the process nodes at TSMC, Chinese suppliers will likel

11、y attempt to develop and scale FPGA designs to be on par with the U.S.-based suppliers. 1 For the purposes of this report we identified only semiconductor components deemed “critical” to aspects of a 5G RAN network. Critical is defined as essential for the design, manufacturing, and sale of 5G RAN e

12、quipment and possessing technical performance parameters unique to 5G networks. 5 | 5G INFRASTRUCTURE ANALYSIS EXECUTIVE SUMMARY We are convinced time is the only issue for development of non-U.S.-based designs and availability for these two functional product families. Non-U.S. based chip designs w

13、ill continue to have access to leading semiconductor electronic design automation (EDA) tools and the best semiconductor foundries, enabling rapid development and manufacturing. We are also convinced the amount of investment capital available in China is not an issue in preventing the evolution of t

14、he domestic semiconductor design industry. For Gigabit Ethernet PHY transceivers and switches, we note the availability of 1Gbps Ethernet PHY transceiver and switch solutions from foreign/international semiconductor suppliers but no availability for 10Gbps Ethernet PHY transceiver and switch solutio

15、ns outside the U.S. Within the 5G base station systems, the 10GE standard is predominantly used for optical/electrical transport functions. We understand that China-based suppliers, as identified in this report, are rapidly closing the gap between their current capability of 1Gbps to 10Gbps, and we

16、project the gap can be closed in the next eighteen months. EXHIBIT 1: BBU FUNCTION PRODUCT FAMILY BOTTLENECK ANALYSIS Fronthaul Optical Modules L1-L3 Baseband Processing Memory SDRAM Flash EEPROM Clock Gen/Dist Std Logic Power Management Power ConversionFPGA 10 GE PHY Switches Bottleneck No Supply I

17、ssue OUR CONCLUSION FOR THE AAU/RRU SYSTEM FOR A 5G BASE STATION IS THAT THERE IS ONLY A SINGLE POTENTIAL SUPPLY CONSTRAINT, AGAIN BEING THE FPGA. ALTHOUGH, AS NOTED ABOVE, VENDORS SUCH AS HUAWEI HAVE ALREADY DEVELOPED ASIC SOLUTIONS THAT REPLACE THE FUNCTIONALITY OF THE FPGA. IN EFFECT, THIS POTENT

18、IAL SUPPLY CONSTRAINT DOES NOT IMPACT HUAWEI, BUT COULD IMPACT OTHERS. 5G INFRASTRUCTURE ANALYSIS | 6 Similar to our outlook for research and development of such semiconductor products, it is simply time and money, neither of which is limited from the perspective of the domestic Chinese semiconducto

19、r design industry. We do not have a timeline as to how quickly and when such products will become available at the same performance as current U.S.-supplied solutions. For radio frequency (RF) functions such as power amplifiers, GaN has been identified as a key enabler for 5G radio systems due to th

20、e inherent wider bandwidth of operation as well as thermal performance. Additionally, we believe that the current evolution of 4G radio systems will also require GaN technology to achieve optimal performance. We believe that foreign/ international availability of GaN power amplifiers is sufficient a

21、nd will not be a supply chain issue currently. We also note that while domestic Chinese supply of GaN may be performance limited, research and development will not be impacted by a lack of investment capital. EXHIBIT 2: AAU/RRU FUNCTION PRODUCT FAMILY BOTTLENECK ANALYSIS Fronthaul Optical Modules A/

22、D Converters D/A Converters Analog Front End Clock Gen/Dist Std Logic Power Management Power Conversion RF SoCPower Amplifiers Low Noise Amplifiers RF Switches Isolator Circulator RF Filter Multiplexer FPGA Digital Front End Beamforming CPRI/eCPRI Fronthaul Antenna Array Bottleneck No Supply Issue 7

23、 | 5G INFRASTRUCTURE ANALYSIS EXECUTIVE SUMMARY WE NOTE THE FOLLOWING NON-U.S. BASED COMPOUND SEMICONDUCTOR FOUNDRIES AND THEIR LOCATIONS: Advanced Wireless Semiconductor Company (Taiwan) Global Communications Semiconductors (U.S., Taiwan) OMMIC S.A. (France) United Monolithic Semiconductors (France

24、) Wavetek Microelectronics Corporation (Taiwan) WIN Semiconductor (Taiwan) Sanan Integrated Circuits (China) WE ALSO NOTE THE FOLLOWING NON-U.S. BASED SiGe FOUNDRIES AND THEIR LOCATIONS: Innovation for High Performance (Germany) Tower Jazz (U.S., Japan, Israel) We believe that any potential supply c

25、hain bottlenecks to the specific semiconductor functional products highlighted in this analysis is merely a temporary “blip” in the supply chain. While there may be some level of disruption and performance degradation due to the unavailability of these specific products, we expect that these issues

26、will be resolved. The potential for development of domestic Chinese semiconductor products is based upon access to semiconductor foundries for silicon, silicon germanium (SiGe), silicon on insular (SOI), gallium arsenide (GaAs), indium phosphide (InP), silicon carbide (SiC), and gallium nitride (GaN

27、) semiconductor materials. 5G INFRASTRUCTURE ANALYSIS | 8 Company A Company B Company C Company D Company E Company F Company G Company H Company I Company J Company K Company L Company M Company N Company O Company P Company Q FRONTHAUL OPTICAL MODULES Company A Company B Company C Company D Compan

28、y E Company F Company G Company H Company I FPGA RF SoC Company A Company B Company C Company D Company E Company F Company G Company H Company I Company J Company K DIGITAL FRONT END ADC Company A Company B Company C Company D Company E Company F Company G Company H Company I Company J Company K Co

29、mpany L Company M Company N Company O ANALOG FRONT END Tx AMPLIFIER Company A Company B Company C Company D Company E Company F Company G Company H Company I Company J Company K Company L Company M Company N ANALOG FRONT END Rx LOW NOISE AMPLIFIER Company E Company F Company G Company H ANALOG FRONT

30、 END RF SWITCH Company A Company B Company C Company D Company A Company B Company C Company D Company E Company F Company G Company H Company I Company J Company K Company I Company L Company M Company N ISOLATOR/CIRCULATOR Company A Company B Company C Company D Company E Company F Company G Compa

31、ny H Company I Company J Company K Company I Company L Company M RF FILTER/MULTIPLEXER Company A Company B Company C Company D Company E Company F Company G Company H Company I Company J Company K Company I Company L ANTENNA ARRAY WIDESPREAD FOREIGN AVAILABILITY FOR KEY AAU/RRU SEMICONDUCTOR COMPONE

32、NTS 14 | 5G INFRASTRUCTURE ANALYSIS | SIA CONFIDENTIAL INTRODUCTION: WHAT IS 5G? The 5G standard, also known as IMT-2020, is the next evolution for the wireless industry. Every ten years, the wireless industry adopts a new, next generation standard for the network architecture as well as the radio w

33、aveform. 5G INFRASTRUCTURE ANALYSIS | 10 THERE ARE THREE PRIMARY GROUNDBREAKING ASPECTS OF 5G THAT THE 3GPP SPECIFICATIONS SUPPORT: 1. Enhanced Mobile Broadband (eMBB) 2. Ultra Reliable Low Latency Communications (uRLLC) 3. Massive Machine Type Communications (mMTC) eMBB is the continued evolution o

34、f wireless data for mobile networks with the goal of a 10X improvement in downlink (DL) speeds to mobile devices, achieving 10 Gb/sec compared with 1Gb/sec for 4G LTE services. uRLLC is a new type of wireless communications service that supports low latency applications of 1M per km2) for Smart X ap

35、plications. 5G is essentially a 10 x+ increase in all technical parameters compared with existing 4G technology today. The official industry standard defining the transition between the 4G Long Term Evolution (LTE) standard and 5G is 3rd Generation Partnership Project (3GPP) Release 15, approved in

36、December 2017. 3GPP Release 16 is scheduled to be completed by December 2019 and adopted in 2020. The new 5G NR standard has two variants, non-stand alone (NSA, or new 5G RAN but core network utilizes existing 4G LTE core infrastructure) and stand alone (SA, i.e. both RAN and core are 5G compliant)

37、which relates to the mobile core network (CN). Verizon Wireless created its own standard, Verizon Technical Forum (VTF), based upon 3GPP Release 15 NSA specifications due to the necessity of launching fixed wireless access (FWA) services in October 2018 in the United States. 11 | 5G INFRASTRUCTURE A

38、NALYSIS INTRODUCTION: WHAT IS 5G? EXHIBIT 3: COMPARISON OF 4G VS. 5G TECHNICAL SPECIFICATIONS As with prior generation wireless network architecture upgrades, true standalone (SA) 5G will require a new core network as well as a new radio access network (RAN). We show the most likely immediately migr

39、ation path, NSA Option 3a, which allows a mobile operator to build out a new 5G RAN while utilizing the existing 4G core network. This will save costs for network operators in the short-term, while allowing initial deployment of 5G network services. Ultimately, we believe mobile networks will evolve

40、 to a SA Option 1/2 architecture where there are two distinct and separate mobile networks, layered on top of each other. To fully utilize the uRLLC and mMTC technologies of 5G, a separate core network must be built. In the short term non-standalone 5G will remain the predominant version of 5G deplo

41、yment around the world. 5G INFRASTRUCTURE ANALYSIS | 12 EXHIBIT 4: 5G NETWORK EVOLUTION, NSA OPTION 3A VS. SA OPTION 1/2 The other significant change in the network architecture is in the RAN portion of the mobile network. The 4G evolved node B (eNB) performs the networking Layer 1-2 L1-L3 baseband

42、processing functions, transport, and operations & maintenance functions. The 5G next generation node B (gNB) is split into two logical and physical blocks, gNB-DU (5G distributed unit) and gNB-CU (5G centralized unit). The distributed unit (DU) performs all of the low latency real time processing of

43、 the radio signals while the central unit (CU) performs all of the non-real time processing of the radio signals. It is important to note that in a first generation 5G mobile network, the vast majority of mobile operators are implementing a NSA network architecture where all of the traditional eNB f

44、unctions are performed by the gNB. The CU-DU split of the gNB will likely occur when the 5G network transitions to a SA network architecture. CORE NETWORK CORE NETWORK 13 | 5G INFRASTRUCTURE ANALYSIS INTRODUCTION: WHAT IS 5G?INTRODUCTION: WHAT IS 5G? 4G LTE networks are frequency division duplex (FD

45、D) centric with China Mobile and Sprint as the two major networks using the time division duplex (TDD) mode. 5G NR networks will be TDD centric for all frequency bands in the mid-band and high band spectrum and FDD in the low band spectrum. Current 4G LTE remote radio units (RRU) use 4x4 MIMO 4T4R a

46、rchitectures for frequency division duplex (FDD) mode and 8x8 MIMO 8T8R for time division duplex (TDD) mode. We expect low band FDD radio units (RU) to be 4x4 MIMO 4T4R while mid band RUs will use a combination of 8x8 MIMO 8T8R and massive MIMO 32T32R/64T64R RUs. High band RUs will use a lower order

47、 MIMO but with high antenna elements (AE), typically with 128AE to 512AE configurations. EXHIBIT 5: RADIO ACCESS NETWORK ARCHITECTURE, 4G VS. 5G The final major changes in 5G are the radio implementation for the duplex mode, frequency bands, channel bandwidth, and a focus on massive MIMO radio units

48、. Current 4G LTE frequency bands operate at frequencies 4GHz. The initial 5G networks will focus on using a combination of low band (600-900MHz) and mid band (2.5-4.5GHz) spectrum as well as high band (24-47GHz) millimeter wave (mmWave) frequency bands. Eventually, all existing 4G LTE spectrum will

49、be converted to 5G NR spectrum. The current maximum 4G LTE single channel bandwidth is 20MHz. 5G NR single channel bandwidths can be up to 100MHz, a 5x increase. 5G INFRASTRUCTURE ANALYSIS | 14 EXHIBIT 6: 5G RU VS. MIMO ORDER VS. FREQUENCY BAND THE EXISTING WIRELESS NETWORK EQUIPMENT SUPPLIERS FOR 4G LTE NETWORKS ARE ALSO THE SAME VENDORS FOR 5G NR NETWORKS. THESE ARE: China Information and Communication Technologies Group Corporation (CICT) Telefonaktiebolaget LM Ericsson Huawei Technologies Co., Ltd