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全球3DNAND分制程節點位元產出情況（bGB）-行業數據

全球3DNAND分制程節點位元產出情況（bGB）
全球3DNAND分制程節點位元產出情況（bGB）
232 層及以上 3D Nand 產品有望成為 2024 年市場規模增長的主要驅動力。從產品當前層數來看，隨著 96層 3D Nand產品的逐步退出，128層 3D Nand是當前主流產品，且預計在 2024年之前與 176層 3D Nand 產品一起占據主要地位。232層以上的產品市規模將持續增長，并將在 2024 年逐步成為主流產品，并成為推動Nand Flash市場規模增長的主要驅動力。
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所屬報告： 德明利-公司深度報告：專注閃存模組領域周期上行乘風起-231014（33頁）.pdf
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