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HB與TCB技術有相似性、應用領域有部分重合-行業數據

HB與TCB技術有相似性、應用領域有部分重合
HB與TCB技術有相似性、應用領域有部分重合
公司未來另一重要先進封裝設備是混合式焊接 HB 設備，HB 與 TCB 技術有相似性、應用領域有部分重合，但價值量更高，公司首批 HB 訂單將于 2024 年交付，為公司貢獻重要業績增量。
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HB與TCB技術有相似性、應用領域有部分重合_第1頁
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HB與TCB技術有相似性、應用領域有部分重合_第2頁
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HB與TCB技術有相似性、應用領域有部分重合_第6頁
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HB與TCB技術有相似性、應用領域有部分重合_第16頁
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HB與TCB技術有相似性、應用領域有部分重合_第17頁
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HB與TCB技術有相似性、應用領域有部分重合_第18頁
HB與TCB技術有相似性、應用領域有部分重合_第19頁
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HB與TCB技術有相似性、應用領域有部分重合_第29頁
HB與TCB技術有相似性、應用領域有部分重合_第30頁
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所屬報告： ASMPT-港股公司首次覆蓋報告：全球封裝設備龍頭有待行業景氣度修復迎來拐點-230605（24頁）.pdf
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