高效能接觸式寬幅CIS相機及新品TDI線掃相機助力行業應用轉型升級——Teledyne Dalsa王培源先生.pdf

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1、Teledyne Imaging1高速高分辨率接觸式寬幅CIS相機及新品TDI線掃相機助力行業應用轉型升級王培源2024.7Teledyne Imaging2DALSA如何助力行業發展從從1D，2D到到3D，DALSA為您提供量身定制的合適設備為您提供量身定制的合適設備Teledyne Imaging3接觸式圖像傳感器（寬幅相機）https:/ Imaging44Teledyne Imaging5應用鋰電池印刷PCB晶圓紙病檢測機器視覺Teledyne Imaging66Teledyne Imaging77Teledyne Imaging88Teledyne Imaging99Teledyne

2、 Imaging1010Teledyne Imaging11Best Image Quality11Teledyne Imaging12Best Image Quality12Teledyne Imaging13CIS vs 傳統線陣/面陣方案優勢:本身設計緊湊 Compact form factor 高度集成 camera,lens,and light Telecentric遠心光路局限性:1:1 放大倍率 DoF景深小CISConventional cameraTeledyne Imaging14自聚焦透鏡組Self-focus Lens AssemblyGRadient-INdex(GR

3、IN)LensTeledyne Imaging1515SpecificationsPart No.AX-FM-04B12H-00AX-FM-08B12H-00Sensor typeDualline CMOS sensorField of view400mm800mmResolution14,304 pixels28,608 pixelsPixel size28/42/56/84m(900/600/450/300 dpi)selectableDepth of field0.6 mmWorking distance13.9 mmOutputMono/HDRRandom noise23 e-Full

4、well100 ke-ResponsivitySee graphMax line rate120 kHz(mono mode);60 kHz x 2(HDR mode)Min line rate0 kHzMetrology measurement error50 m 20C ambientBit depth8 or 12 bit selectableGain range1x 10 xData and controlCamera Link HS LCGPIORS422Operating temperature0 to+65C caseLED lightNone(sold separately a

5、s an accessary)Power+24VDC,75.3WDimension441.8(W)x 100(H)x 75(D)mm 841.8(W)x 100(H)x 75(D)mm Dust Ingress protectionIP60(optical path)Cooling mechanismFansTeledyne Imaging1616Features 在整個視場上無縫成像，無像素缺失（不使用插值像素）最高line speed速度120kHz 或 雙線高動態 60kHz 檢測精度（孔洞尺寸 28um(900dpi)）HDR mode with dual exposure contr

6、ol 獨立控制的HDR功能 適合測量類應用，輸出真實測量反饋 現場可替換LED/Field replaceable LED lights Camera Link HS interface 提供可靠的高速數據傳輸 光纖方案，節省線纜成本 cable lengths to 100 meters 供電接口 24VDC power supplyTeledyne ImagingTeledyne DALSA Proprietary and ConfidentialMultiline CMOS Sensor DALSA多線CMOS芯片四線 CMOS 圖像傳感器sensor with 12bit 板載模-數轉

7、換器on-chip ADCMono/HDR,RGB或 RGB+NIR 圖像感應能力120kHz 黑白,60kHz x3 彩色,14x14um 像元尺寸9e 暗噪聲 帶數字 CDS,獨立曝光控制Teledyne Imaging1818Staggered Sensor Architecture 芯片交錯排列交錯排列，以覆蓋整個FoV視場，沒有丟失像素 The modules image processing aligns the images from each die and removes the overlapped pixels TD CMOSTD CMOSTD CMOSTD CMOSTe

8、ledyne Imaging1919傳統CIS相機 Sensor 排列:10.2um35.1um Missing pixels due to die butting,need data interpolation 無法獲得真實原始測量數據 裝配過程管理欠成熟，導致模具間隙失控，超出規格3rd Party Sensor3rd Party Sensor3rd Party Sensor3rd Party SensorX=24.9 um,for a 800mm,the total variation could be 772um!Teledyne ImagingHigh Resolution28um(

9、900dpi)42um(600dpi)MTF(target 45um/line)40.9%27.6%Measurement(target 500um/line)Mean value501.2um504.8umstandard deviation5.928um13.33umCourtesy of EnvisionTeledyne Imaging21Optics and LightingOptional 1x or 2x white LED lights with intensity&angle adjustment(future)0.6 mm DoF13.9mm WDHigh quality s

10、elfoc lensTeledyne Imaging22ElectricalSingle power supply 24VCLHS SFP+fibreoptic interface with LC connectorsGPIO for power,encoder input with multiplierTeledyne Imaging23MechanicalMounting bracket for fine alignmentDust proof sealThermal managementTeledyne Imaging24Module Dimensions 400mm:437.4(L)x

11、75(W)x100(H)mm 800mm:837.4(L)x75(W)x100(H)mm Teledyne ImagingTeledyne DALSA Proprietary and ConfidentialData Interface1x Xtium2 CLHS FX8 FG supports up to 4x 400mm modules each with 1x SFP+CLHS SFP+supports fiberopticcable length up to 300m with immune to EMI radiationTeledyne ImagingHDR ImagingShor

12、t exposure:bright sceneLong exposure:dark scene+Fused image:HDRDual arraysCaptures 2x images using different exposure timesOutput 2x images or 1x fused HDR image(future)Teledyne ImagingMetrology Application Provide metrology in the horizontal direction Calibrated lengths over a range of operational

13、temperaturesTeledyne ImagingTeledyne DALSA Proprietary and ConfidentialData Interface1x Xtium2 CLHS FX8 FG supports up to 4x 400mm modules each with 1x SFP+CLHS SFP+supports fiberoptic cable length up to 300m with immunity to EMI radiationTeledyne Imaging鋰離子電池制造工藝Vision inspectionTeledyne Imaging電極：

14、涂層 Anode Graphite/Cu and cathode Li-NiMnCo/Al coated on both sides,width up to 1500mm Speed 5080m/min,film thickness 50100um,variation 525umSource:PEMTeledyne Imaging電極：壓延 Coated films are compressed by rollers to deduce porosity by precise pressure Speed 60100m/minTeledyne Imaging電極：分切 Mother rolls

15、 cut into smaller widths 60300mm by roller knives Speed 80150m/min,tolerance 200um,burr-freeTeledyne Imaging組裝：堆疊/纏繞 Stack or wind anodes,cathodes,and separators together,up to 120 layers Speed up to 60 cells/min,tolerance 200umCylindPrism PouchTeledyne Imaging裝配：包裝 Insert Jelly rolls into cell hous

16、ing,weld and partly seal.CylindPrism PouchTeledyne ImagingDalsa 線陣產品家族介紹Teledyne ImagingCostPerformanceLinea MLquad8k/16k 300kHzLineasingle/bi2k/4k/8k/16k80kHzLinea HSTDI4k/8k/13k/16k/32k400kHzLinescan 線陣相機定位Linea2quad4k/8k/16k 120kHzLinea Lite:dual/bi2k/4k/8k50/120kHzTeledyne ImagingLinea2 Camera P

17、latform:An Upgrade Path for Linea and P4Mono/HDR Super ResColourMS/MFSensorArrayResolution4k/8k/16k x48k/16k4k/8k/16k x34k/8k/16k x4Pixel size7/7/3.5m3.5/3.5m7/7/3.5m7/7/3.5mLinerate120kHz120kHz40kHz x330kHz x4Interface510GigE/CLTeledyne ImagingLinea Lite Camera Platform:Low Cost SolutionsMono/HDR S

18、uper ResColourSensor ArrayResolution2k/4k x28k2k/4k x2Pixel size14/7m3.5m14/7mLinerate50/25kHz120kHz25kHz120kHz25/12kHz x3InterfaceGigE/CLTeledyne ImagingDALSA不斷嘗試提升制造工藝以應對不同應用的檢測硅染色分色納米壓印Mono黑白Colour彩色多光譜/MF偏振相機BSILinea/Linea LiteLinea2Linea MLLinea HSFSI硅硅硅硅Teledyne Imaging多光譜多光譜/多場：晶圓級鍍膜濾光片多場：晶圓級

19、鍍膜濾光片 多光譜:RGB+NIR 4個通道 Multifield:visible+NIR 2-channelsTeledyne Imaging41近紅外光譜法檢測食品中的異物 Applications e.g.food,print,and PCB etc 從彩色成像轉向多光譜成像(近紅外技術有助于識別特定材料)Teledyne Imaging(a)UV(b)Visible(c)NIRImage in Different Depths 光學穿透深度取決于波長 紫外線紫外線增強表面增強表面，而近，而近紅外紅外檢測電路下方檢測電路下方Teledyne Imaging43Super Resoluti

20、onSR Data reconstructionCameraHost/Sapera LT4k/7m image 14k/7m image 28k/3.5m SR image Teledyne Dalsas 專利技術Teledyne Imaging4416k/5um vs.32k/2.5um:Resolution and SNR Significantly improves resolution,SNR,and detectability Ideal for subpixel defect detectionSuper ResolutionInput ResolutionHigher resol

21、utionHigher SNRTeledyne Imaging45MTF test patternSuper ResolutionInput Resolution16k/5um vs.32k/2.5um:MTFBetter MTFTeledyne Imaging46Benefits of Super Resolution 超分辨率優勢Software centric solutionsImproves SNR by up to 4x for subpixel defectsOvercomes technical challenges associated with a small pixel

22、size,e.g.responsivity,fullwell,MTFAvoid a high-cost optical lensMaintain a small image circleLower system costsReduces amount of data transferred from camera to FG/hostSoftware centric algorithmAvoid high-cost lightingReduce power consumption,heat dissipationLower system and maintenance costsTeledyn

23、e Imaging 超分辨率的應用Application Description Image Remark FPD Bump,Pinhole,short,dust,scratches in TFT patterns Subpixel defects,SNR is key PCB Etching fault,dent,shorts,contaminant etc in printed circuits High resolution has benefits semi Defects in semi wafers Small defects and high mag Glass Chips,cr

24、acks and scratches on glass Battery Scratch,separation film,Electrolyte leak Trending to higher resolution Logistics Black and white barcode Smaller lens with lower cost Teledyne Imaging48從可見光波段到紫外48 檢測應用突破可見光波段，提高對較小特征的光學分辨率 UV 波段檢測需要 BSI 背照式芯片Teledyne ImagingPhotoluminescence光致發光Geometric opticsQu

25、antum opticsexcitationemissionreflectiontransmission 光致發光改變了機器視覺的游戲規則，因為它能夠光學地選擇和檢測幾何光學所不能檢測的東西 弱熒光要求高靈敏度和低噪聲Optical transitions between energy bandsPhotoluminescenceTeledyne ImagingLinea HS Camera Platform:業界領先TDI技術Mono/HDR Super Res Colour/MFFSIBSIResolution4k/8k/13k/16k x(128+64)32kx12816kx(64+12

26、8+64)Pixel size5m2.5m5mMax Speed400kHz400 kHz300/400 kHzInterfaceCamera Link HS646412864128646412864Teledyne Imaging51Multifield 多場51 部署提高可探測性所需的各種照明方案配置 隔離不同波長的光譜 在一次掃描中捕獲多個圖像Teledyne Imaging52Frontside vs.Backside Illumination52Source:SonyTeledyne Imaging5310 xFSIBSIBSI背照式TDI2x BSI:Improve QE for

27、UV/visible imaging 芯片:Multi-array TDI 128+64 stages 分辨率:16k/5um 速度:400kHz aggregate BSI背照式TDI相機 顯著提高了近紫外和可見光波段的量子效率，并在光線不足的情況下提高了成像應用的信噪比。Teledyne Imaging BSI sensors are ideal for PL imaging due to its high QE Linea HS BSI well positioned,see high demandsPhotoluminescence ImagingDNA seq:biomarker-v

28、isibleSolar cell:silicon-NIRWLP:polymer-visibleMicroLED:GaN-visibleFluorescence wavelengthTeledyne ImagingExtend Spectral Capability 全頻譜段產品覆蓋Customized NUV Visible NIR SWIRSi BSISi FSI/BSIInGaAsNew!New!Teledyne ImagingTDI NIR:Piranha HN 8K NIR:The only TDI camera in NIR wavelength.Also enhanced Resp

29、onsibity in 800-1100nmTeledyne ImagingHN-80-08K40 A unique NIR TDI camera!Teledyne Imaging58Teledyne Imaging59Teledyne Imaging聯系我們銷售咨詢:Michelle Ye 中國區銷售總監Email:MEmail:SalesC技術咨詢：Peiyuan Wang OEM 技術支持工程師 Email: Tel:187 0199 2513Teledyne Imaging如需了解更多，歡迎前往我們的展位號 E2.230261Teledyne Imaging6262Thank You!謝謝！