MicromaxTM高熱導銀膠車規級半導體應用.pdf

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1、Celanese CorporationDesign Options with MicromaxElectronic Inks and PastesCelanese CorporationWe are a global chemical and specialty materials company that engineers and manufactures a variety of products essential to everyday living.我們是一家全球化學和特種材料研發和生產企業-塞拉尼斯成立于1918年，迄今已有106年歷史Celanese Corporation

2、Overview Global headquarters in Dallas,Texas,USA 全球總部設于美國德克薩斯州達拉斯 Approximately 12,400 employees globally 全球約12,400名員工$10.9 billion in net sales in 2023(highest in company history)2023年凈銷售額達109億美元 Number 396 on the 2021 FORTUNE 500 list 財富美國500強中排名第396位 50 owned and operated manufacturing locations;

3、operations in 27 countries worldwide 全球50家自營和營運制造工廠，足跡遍布全球27個國家 Two leading businesses:Engineered Materials and Acetyl Chain 兩大核心業務：工程材料和乙?；湲a品 Innovation is at the core of our differentiated business model 創新是我們差異化的業務模式的核心external2Celanese CorporationCelanese MicromaxTMThick film inks and pastes th

4、at are conductive,resistive,dielectric and compatible with many substrate surfaces-polymer films,glass,metals,ceramics,textiles厚膜電子漿料是在各類基材表面（聚合物薄膜、玻璃、金屬、陶瓷、紡織品）形成功能性的互連與線路，具有導電性、電阻性、介電性等不同特性Celanese CorporationAutomotivePower Electronics 功率電子功率電子Seat Sensor Cabin&Steering Wheel heating HMI,3D Capac

5、itive SwitchesLED Light DemisterMillimeter Radar5G(high frequency)Lidar(VSCEL&demisting)Battery(heater)ConditioningHigh-voltage Coolant HeaterPower Electronics(Inverter,DC/DC converter,OBC)ADAS/CPU/GPU(Advanced package of chip)4MicromaxMaterials in EV ApplicationsMicromax 電子漿料在電動汽車中的應用Celanese Corpo

6、rationThermal Conductive Applications and Recommendation 導熱應用和用和銀膠推薦膠推薦52mm x2mm4mm x4mm6mm x6mm8mm x8mm10mm x10mmEpoxy Ag820 W/m.kNon-metal contact(flip chip and die attach)Sinter Ag 150280W/m.kMetal contact Ag,Au,Cu(usually wire bonding)Epoxy Ag for die attach(20W/m.k)Epoxy Ag for TIM1 and die att

7、ach(1015W/m.k)Gel fillingHeat sinkCeramic SubstrateChipChipSinter SilverPressure free sinter Ag(110 W/m.k,low modulus)Pressure assisted sinter Ag(200 W/m.k)Pressure free sinter Ag(280 W/m.k,high modulus)TcChip sizeCelanese CorporationIntroducing MicromaxPressure Sinter Silver Micromax輔壓燒結銀的介紹 DA510/

8、DA51x6Celanese CorporationPressure Sinter Silver:DA510 Features&Performance 輔壓燒結銀：DA510特性與性能7Long work life at room temperature 室溫下工作壽命長Good printability 良好的印刷適性Pressure-assisted sintering process 輔壓燒結工藝Air or N2 atmosphere sintering 空氣或氮氣氣氛燒結Bond to Au,Ag and Cu 與金、銀和銅的良好鍵合Applicable for SiC or hig

9、h-power Si power module,survives 2000 cycles of thermal shock(-55175C)適用于SiC或大功率Si基功率模塊，可承受 2000次熱沖擊（-55175C）Celanese CorporationPressure Sinter Silver DA510:Shear Strength with Metals輔壓燒結銀 DA510：與金屬的剪切強度8Achieve higher initial die shear strength on Au-Au or Ag-Ag bonding 在 Au-Au 或 Ag-Ag 粘合上實現更高的初始芯

10、片剪切強度Substrate:1mm thick Chip:3mm square,1mm thickSintering condition:280C/10MPa/1.5minCelanese CorporationPressure Sinter Silver DA510:Paste Stability(Viscosity)輔壓燒結銀 DA510：漿料穩定性（粘度）901020304050607080050100150200250Viscosity(Pa.s)DaysViscosity HAT 10rpm Good paste stability after 200 days room temp

11、erature storage200 天室溫儲存后，漿料穩定性好Celanese CorporationPressure Sinter Silver DA510:Paste Work Life Test Result 輔壓燒結銀 DA510：漿料工作壽命測試結果（印刷性）10A B Dry thickness after continuous printingPrint directionB A Thickness measurement directionDry thickness is stable even after 2 hours continuous printing 即使在連續印

12、刷 2 小時后，干燥厚度也保持穩定Celanese CorporationPressure Sinter Silver DA51x:Applicable for Dispense輔壓燒結銀 DA51x：點膠應用11.Metal mask print(13mm square pattern)Slit nozzle dispense(6.5mm square pattern)Jetting dispense(5mm square pattern)Dried patternThickness profileDirection AThickness profileDirection BRa(um)0.

13、040.191.24Print direction100um2mmSlit nozzle dispense&jetting dispense can be applied instead of metal mask printing 狹縫噴嘴點膠和噴墨點膠可以代替鋼板印刷Print directionB A Thickness measurement directionCelanese CorporationPressure Sinter Silver DA51x:Die top attach application輔壓力燒結銀 DA51x：芯片頂部貼裝應用12Stable printabil

14、ity and dispensability without paste bleeding or fading at pattern edge穩定的印刷適性和點膠性，圖案邊緣不會出現溢膠或邊緣塌陷Die AttachedDie Top DispensingDA51x Die Top Attach Celanese CorporationPressure Free Sinter Silver Features&Performance無壓燒結銀特性與性能13Long work life at room temperature 室溫下工作壽命長Good printability/dispensabi

15、lity 良好的印刷性/可點膠性Low fillet,Less residue 低爬膠，少殘留Short sintering process time 燒結工藝時間短Celanese CorporationCategoryProduct typePrintDryChip MountSinterStencil printingOvenChip mounter/Die bonder(dry mount)Die bonderDispense-Chip mounter(wet mount)Reflow oven/Box ovenStencil printingOvenChip mounter/Die

16、bonder(dry mount)Reflow oven/Box ovenPressure-assisted輔壓DA510Pressure-free無壓Wet chip mount typeDry chip mount typeSintered pasteDried pasteWet pasteSubstrateDried pasteChipSintered pasteWet pasteSubstrateWet pasteChipskipNo pressure sinteringPressure free Sinter Silver:Dry chip mount process無壓燒結銀：芯片

17、干式貼裝工藝14Dried pasteWet pasteSubstrateDried pasteChipNo pressure sinteringSintered pasteCelanese CorporationPressure free Sinter Silver:Paste property,Standard process condition 無壓燒結銀：漿料性能，標準工藝條件15ItemQ2905Low modulus typeQ2906High modulus typePrint methodStencil printChip size 7mm sq.Compatible surf

18、aceAg,Au,CuDry120degC/10minChip mount150degC(chip side)/175degC(substrate side)/1MPa/1secSintering atmosphereAir or N2Sintering temp280degCSintering timeIn-out 45min,Peak hold 30minPaste storageRoom tempThermal conductivity(280degC/0MPa/30min sinter)105 W/(m.K)in airNo data in N2288 W/(m.K)in air125

19、 W(m.K)in N2confidential Celanese CorporationThermal Conductive Applications and Recommendation 導熱應用和推薦用和推薦162mm x2mm4mm x4mm6mm x6mm8mm x8mm10mm x10mmEpoxy Ag820 W/m.kNon-metal contact(flip chip and die attach)Sinter Ag 150280W/m.kMetal contact Ag,Au,Cu(usually wire bonding)Epoxy Ag for die attach(

20、20W/m.k)Epoxy Ag for TIM1 and die attach(1015W/m.k)Gel fillingHeat sinkCeramic SubstrateChipChipSinter SilverPressure free sinter Ag(110 W/m.k,low modulus)Pressure assisted sinter Ag(200 W/m.k)Pressure free sinter Ag(280 W/m.k,high modulus)TcChip sizeCelanese CorporationMicromaxEpoxy Ag CE 1709 Feat

21、ures&Performance環氧樹脂銀 CE 1709特性與性能17High thermal conductivity solution in package 封裝中的高導熱性解決方案High thermal conductivity(10W/m.k)高導熱系數Stable bonding to large chip(10mmx10mm)與大芯片穩定粘接Low modules epoxy 低模量環氧樹脂High adhesion to metal lid to Si chip 對金屬蓋與硅芯片的高附著力Excellent reliability 出色的可靠性Designed for use

22、 for TIM1 in advanced flip chip package and die attach in wire bond package 設計用于芯片封裝中的 TIM1 和引線鍵合封裝中的芯片貼裝Celanese Corporation18SAT Results(Through Scan)_ 10 x10mm sq.T0T300T700T1000Chip:bare silicon Substrate:bare copper BLT:755 mCuring profile:RT-120C/1hr-175 C/1hrThermal cycling test:-55C to 125 C

23、(air)Stable bonding quality before and after thermal cycle test confidential MicromaxEpoxy Ag-CE 1709:reliability and adhesion 環氧樹脂 Ag-CE 1709：可靠性和附著力Celanese Corporation總結：Micromax電子漿料在半導體封裝中的應用CategoryProductKey PropertyApplicationValue StatementSintering AgPressure assistant:DA510/DA51XTC：200W/m.

24、kDie-AttachTop-AttachHeatsink-AttachRoom temperature storage and stable operation window 室溫儲存和穩定的工藝窗口Pressure free:Q2906Q2905TC：280W/m.k for high moduleTC：110W/m.k for low moduleDie-AttachDry Chip mounting,less void,best BLT and residue control 干式芯片貼裝，少空隙，最佳的 BLT 和殘留物控制Epoxy AgCE 1709TC：8-20W/m.kTIM

25、1Die AttachThe best modulus epoxy Ag which enable large bonding area to the chip 最佳模量環氧樹脂Ag，可實現與芯片的大面積鍵合Celanese CorporationMicromax Thermal Management Solution 20Heating On SteelHeating On AluminumPTF PTC Heating Film CategoryProductKey Property絕緣介質3500NCTE:10-11 ppm導體H6000/LF131Rs:2.6mOhm電阻Hxxx20mOhm 1.2Ohm保護釉3500NCTE:10-11CategoryProductKey Property絕緣介質AS100CTE：15ppm導體AS300Ra:2.6mOhm電阻K2478/K247940mOhm 250m Ohm保護層5499Polymer EncapsulantCategoryProductKey Property基材PI/PET高絕緣，高導熱導體5025Rs:10保護基材PI/PET高絕緣，高導熱Celanese CorporationB0 314Booth G22pcimASIAWelcome to Visit