2024年高性能芯片研討會（HOT Chips 2024）嘉賓演講PPT合集（共37套打包）

1、Blackhole&TT-MetaliumThe Standalone AI Computer and its Programming ModelAugust 2024Jasmina Vasiljevic,Senior FellowDavor Capalija,Senior FellowAgenda Architecture Micro-architecture Scale-out So。

2、Next-Generation Cooling For NVIDIA Accelerated ComputingAli Heydari,Director,Data Center Cooling&InfrastructureAug 25,2024Era of AIApplication FrameworksThe 3 connected dynamics to give Million-X。

3、 2024 Phononic.All rights reserved.Phononic Confidential./Datacenters:Explosive Growth Meets Thermal ConsequencesPower&Potential of Solid State CoolingAugust 25th,2024/2024 Phononic.All rights re。

4、Snapdragon and Qualcomm branded products are products of Qualcomm Technologies,Inc.and/or its subsidiaries.On-device AI and its thermal implicationsNader Nikfar,Sr.Dir.of TechnologyQualcomm Technolog。

5、1Broadcom Proprietary and Confidential.Copyright 2023 Broadcom.All Rights Reserved.The term“Broadcom”refers to Broadcom Inc.and/or its subsidiaries.|Broadcom Proprietary and Confidential.Copyright 20。

6、August 2024Built for the Edge:The Intel Xeon 6 SoCPraveen MosurIntel Fellow 2Edge is the Next Frontier in Digital Transformation Secure,connected,managedCompute density for AI&scalar workloadsInt。

7、NVIDIA Blackwell Platform:Advancing Generative AI and Accelerated ComputingAjay Tirumala,Raymond Wong|NVIDIANVIDIA Blackwell Platform Data Center Scale Architecture Blackwell GPUNVIDIA Quasar Quantiz。

8、HOT Chips 2024:AI Assisted Hardware DesignWill AI Elevate or Replace Hardware Engineers?Bryan Chin(UCSD),Mark Ren(NVIDIA),Stelios Diamantidis(Synopsys),Hanxian Huang(UCSD),Jishen Zhao(UCSD)HotChips 2。

9、AirJet:Solid-state active cooling helps maintain Moores LawHotChips 2024Moores Law Dead?Transistor counts increasingDie sizes are increasingPower/transistor is stallingTotal Heat is increasingThermal。

10、AMD VersalAI Edge Series Gen 2 for Vision and AutomotiveTomai Knopp and Jeffrey ChuCo-author:Sagheer AhmadHot Chips 20242|AMD VERSAL AI EDGE SERIES GEN 2 FOR VISION AND AUTOMOTIVE|AUGUST 2024Agenda C。

11、Introduction to AI for Chip DesignHaoxing(Mark)Ren,Director of Design Automation Research,NVIDIA08/25/2024AI for Design Performance and ProductivityAnalysisFasterPredictiveCross-StageOptimizationFast。

12、Wafer-Scale AI:GPU Impossible PerformanceSean Lie,Co-founder and CTO,Cerebras SystemsHot Chips 2024Cerebras SystemsFounded in 2016400 EmployeesOfficesSilicon Valley|San Diego|Toronto|BangaloreCustome。

13、ConfidentialPredictable Scaling and InfrastructureTrevor CaiConfidentialPredictable Scaling2Confidential What Collect a dataset of text,code,images,audio,math.Pre-train a model to predict the next wo。

14、SK hynix AI-Specific Computing Memory Solution:From AiM device to Heterogeneous AiMX-xPU System for Comprehensive LLM InferenceGuhyun Kim1,Jinkwon Kim1,Nahsung Kim1,Woojae Shin1,Jongsoon Won1,Hyunha 。

15、Lunar Lake Architecture SessionHotChips 2024Arik GihonSenior Principal Engineer,CCGSoC ArchitectureBreakthrough x86 power efficiencyMassive leap in graphicsUnmatched AI computeExceptional core perfor。

16、Domain-adaptive LLMs for Chip DesignTutorial 1:AI Assisted Hardware Design-Will AI Elevate or Replace Hardware Engineers?Hanxian HuangAdvisor:Prof.Jishen ZhaoUniversity of California San Diego1Outlin。

17、August 2024Intel Gaudi 3 AI Accelerator:Architected for Gen AI Training and InferenceRoman Kaplan,Ph.D.Principal AI Performance Architect Intel CorporationAugust 20242Product ParameterGaudi Gaudi 2Ga。

18、4 Tb/s Optical Compute Interconnect Chiplet for XPU-to-XPU Connectivity2024 Hot Chips Saeed Fathololoumi,Intel CorporationAugust 20242Integrated Photonics Solutions2024 Hot Chips Evolution of Optical。

19、HotChips 2024 TutorialHans Bouwmeester,PrimisAIOutline1.Introduction to LLMs2.Introduction to RAG3.From LLM+RAG to EDA AI-Agentv41.Introduction to LLMsWhat is an LLM?Large Language ModelArchitectureP。

20、Next Gen MTIA Next Gen MTIA-Recommendation Inference AcceleratorRecommendation Inference AcceleratorMahesh Maddury,Pankaj Kansal,Olivia WuAcknowledgementAcknowledgementPrahlad Venkatapuram,Linda Chen。

21、MN-Core 2:Second-generation processor of MN-Core architecture for AI and general-purpose HPC applicationJun MakinoPreferred Networks,Inc./Kobe UniversitySummary2MN-Core is a series of AI-oriented acc。

22、HOT CHIPS 2024Tesla Transport Protocol over Ethernet(TTPoE)A new lossy,Exa-Scale fabric for the Dojo AI SupercomputerEric Quinnell,Ph.D.Dojo Fabric Lead2HOT CHIPS 2024Problem StatementTCP/IP is too s。

23、LLM Agents for Chip DesignHaoxing(Mark)Ren,Director of Design Automation Research,NVIDIA08/25/2024Agent AdvantageLLama3GPT4turbo020406080100Non-agentic41.7%Agentic67.3%(VerilogCoder)Non-agentic60.3%A。

24、AI-Assisted Chip Design TutorialHotChipsStelios DiamantidisSynopsys Distinguished Architect25 August 2025(c)2024 Synopsys,Inc.AI-driven Optimization for Chip Design1.Motivation Why AI for Optimizatio。

25、SambaNova SN40L RDU:Breaking the Barrier of Trillion+Parameter Scale Gen AI ComputingRaghu PrabhakarArchitect,SambaNova SystemsHotChips 2024Copyright 2024 SambaNova Systems Inc.SN40L:SambaNovas New L。

26、1Snapdragon and Qualcomm branded products are products of Qualcomm Technologies,Inc.and/or its subsidiaries.June 2024Snapdragon X65 5G ModemQualcomm FastConnectTM 7800 Wi-Fi&BluetoothQualcomm Ory。

27、Thermal Techniques Thermal Techniques for Data Center for Data Center Compute DensityCompute DensityTom GarvensSupermicroVP Hardware Solutions Better Faster Greener 2024 SupermicroAgendaAgendaBetter 。

28、The Journey to AI PervasivenessVictor PengPresident,AMD2|1960s1989Early History:Supervised Learning,Perceptrons,MNISTEvolution of AIV11 M Chip1984Early NPUs at ISSCC1991Alpha 2126419983|1960sEarly Hi。

29、Onyx:A Programmable Accelerator for Sparse Tensor AlgebraKalhan Koul1,Maxwell Strange1,Jackson Melchert1,Alex Carsello1,Yuchen Mei1,Olivia Hsu1,Taeyoung Kong1,Po-Han Chen1,Huifeng Ke1,Keyi Zhang1,Qia。

30、 2024 FuriosaAI Inc.RNGD Tensor Contraction Processor for Sustainable AI ComputingRNGD Tensor Contraction Processor for Sustainable AI ComputingJune Paik,Co-Founder and CEO of FuriosaAI 2024 FuriosaA。

31、 2024 ENFABRICA CORPORATION.ALL RIGHTS RESERVED.UNLEASH THE REVOLUTION IN NEXT-GEN COMPUTING ACF-S:An 8-Terabit/sec SuperNIC for High-Performance Data Movement in AI&Accelerated Compute NetworksH。

32、Inside Maia 100Sherry Xu,Partner Lead SOC ArchitectChandru Ramakrishnan,Partner SW Eng ManagerMaia 100 IntroductionMicrosofts 1st-gen custom AI Accelerator Targets large-scale AI workloads Designed s。

33、XiangShan:An Open-Source Project for High-Performance RISC-V Processors Meeting Industrial-Grade Standards1 Institute of Computing Technology,Chinese Academy of Sciences2 University of Chinese Academ。

34、Sustainable Computing for AI&Cloud Native WorkloadsMatthew Erler-ArchitectAug 27,2024A MODERN SEMICONDUCTOR COMPANY BUILDING THE FIRST CLOUD NATIVE PROCESSORSFOR THE SUSTAINABLE CLOUDTurbo Freque。

35、Next Generation“Zen 5”Core Brad Cohen and Mahesh SubramonyCo-author:Mike ClarkHot Chips 20242|NEXT GENERATION“ZEN 5”CORE|AUGUST 2024“ZEN 4”+14%IPC over“Zen 3”AVX-512 on FP-256 1M L2 VNNI and BFLOAT16。

36、AMD Instinct MI300X Generative AI Accelerator and Platform ArchitectureAlan Smith,Sr.Fellow,Instinct Lead SoC ArchitectVamsi Alla,Fellow,Instinct Chief EngineerHot Chips 20242|AMD INSTINCT MI300X GEN。

37、IBM Telum IIprocessor andIBM SpyreAccelerator chip for AIChris BerryIBM Distinguished Engineer70%of all financial transactions go through an IBM mainframeIBM mainframes run an estimated 70%of all wor。