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1、AirJet:Solid-state active cooling helps maintain Moores LawHotChips 2024Moores Law Dead?Transistor counts increasingDie sizes are increasingPower/transistor is stallingTotal Heat is increasingThermal envelope of devices must increase to maintain Moores LawWThe AI RevolutionDemand for AI Computing es
2、timated to increase by over 300%by 2030Requires increased performanceIncreasing HeatOn-Device AITabletsNoteBooksSmartphonesCamerasAR|VRMini PCsCopilotPhoto Realistic GamingIntelligent Video Editing and Image De-noisingReal Time Video conferencing with Real-time Translation and TranscriptionFacial Re
3、cognitionIndustrial ManufacturingSmart RetailSmart CityPredict Maintenance,Remote MonitoringAutomation,Robots,Asset ManagementConnected Public Transport and Traffic ManagementVideo Surveillance Smart Shelves,Inventory ManagementAutomated CheckoutWithout adequate cooling Edge devices will not be able
4、 to run AI applicationsThis is Just the Tip of the Iceberg!Inadequate Existing Thermal Solutions TabletsFan-less NoteBooksSmartphonesSmart CamerasVRFan-lessMini PCsEmploy conduction and radiation to the environmentCompact,thin device,highly packed with no space for fansThermal envelope limited to 5-
5、10WPassively CooledGamingNoteBooksIndustrial PCsEmploy heatsinks,heat pipes,fans,and blowersBulky,noisy,heavy,reliability concernsThermal envelope:15-35WActively CooledStreamingDevicesWhat is the Ideal Thermal Solution?High rate of heat removalThinLightSilentOperate effectively in densely packed com
6、pact devicesDust proofWaterproof(IP68)compatibleReliableScalableMarket Requirement Document for Frore Systems 5 years ago!Introducing AirJet MiniSolid-State Active Cooling Chip based on MEMS Technology Heat Removal 5.25 WBack Pressure 1750 PascalsMax Power Consumed 1 WWeight 7gMaking Devices:Faster|
7、Quieter|Thinner|Lighter|Vibration Free|Dustproof2.5 mmProcessorHow AirJetWorksSolid-State Active Cooling MEMS ChipFrore Systems Confidential Information:Shared it under NDAExit Air Temperature Processor TemperatureJet impingement and high heat transfer2.5 mmHow AirJetis ManufacturedCustom Semiconduc
8、tor Process for Non-Silicon Wafer An entirely new category of chip using unique:MaterialsDesignManufacturing Frore Systems Confidential Information:Shared it under NDAFrore Systems Fab,TaiwanWho is Using AirJet Mini?Ultra Thin Fanless Notebook with AirJet67%increase in CPU power 23%higher CPU perfor
9、mance Silent260028003000320034000100200300Frequency MHzTime s3500 MHzAirJet delivers fullprocessor performancePerformancewithout AirJetPERFORMANCE IMROVEMENTNo AirJet With AirJetSoC Power:12W20 W60 CPremium Tablet with AirJet Frore Systems Confidential Info.rmation:Shared it under NDAOn-device AI in
10、 mobile ultra-thin form factors100%increase in sustained SoC performance PERFORMANCE IMROVEMENTCommercial With 2x AirJet MiniSoC Power:5W10.4 WAirJetMini in SmartphonesHandle AI Workloads,IP68 Compatible,Same ThicknessSmartphoneUpgraded with AirJet Mini SportOriginalSmartphoneSame phone thickness wi
11、th extended camera bump 40%increased performancePERFORMANCE IMROVEMENTNo AirJet With AirJetSoC Power:5 W7 W60 C3x Faster20oC CoolerFull sustained Thunderbolt speeds with no throttlingMobile SSD Accessory with AirJetPERFORMANCE IMROVEMENTNo AirJet With AirJetSustained Data Throughput:700 MB/s3000 MB/
12、sSkin Temperature:62oC42oC 60 CPERFORMANCE IMROVEMENTNo AirJet With AirJetSystem Power:14 W24 WSkin Temperature:72oC60oC 60 CIndustrial MiniPC with AirJetFanless MiniPC with 2x AirJet Mini Smart Cities Cameras with AirJetFrore Systems Confidential Information:Shared it under NDAEdge-devices in harsh
13、 environmentsPERFORMANCE IMROVEMENTNo AirJet With AirJetSystem Power:10W22 W60 C3x AirJet Mini cooling Nvidia Nano 8GBSmart Camera without AirJetSmart Camera with AirJetWhats Next?LiquidJet for Data CenterSolid-State Active Cooling MEMS technology applicable to all FluidsFrore Systems Confidential Information:Shared it under NDATHERMAL PERFORMANCE COMPARISONAirWaterThermal capacity1.2 x10-6J/cc/C4.2 x10-3J/cc/C(3500 x larger)60 CWhat if we replace Air with Water?Exit Fluid Temperature Processor TemperatureQuestions?