Leveraging OCP to Create a Purpose Built ARM Processor.pdf

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1、As data centers continue to evolve and optimize,the next revolution is through designing Silicon for specific needs.The ARM ecosystem paired with OCP accelerates designs with advanced capabilities.Leveraging OCP to Create a Purpose Built ARM Processor SUSTAINABILITYZachary Bobroff,Sr Director Produc

2、t Management,AMIDong Wei,Lead Standards Architect&Fellow,ArmLeveraging OCP to Create a Purpose Built ARM Processor SUSTAINABLE SCALABLE COMPUTATIONAL INFRASTRUCTUREData Processing Continues to EvolveScaling infrastructure to meet needsScaling on DemandOn-prem and cloud infrastructureSystems from mul

3、tiple manufacturersSolutions using multiple Si vendorsAccelerators and Smart NICs now commonNon-Homogenous Hardware VendorsNon-Homogenous ArchitecturesHybrid EnvironmentsAdditional Compute UnitsOptimizing compute infrastructure continues to drive additional innovationPRIVATE CLOUDPUBLIC CLOUDON PREM

4、ISEWorkload OptimizationInitially,optimizations were done in Software:Today,optimizations are also being done in Hardware:Compiler optimizations HW virtualization optimizations Container optimizations Clustered HW via fabricGPUs,ASICs and FPGAsSmart NICsML is driving the need for more compute,and op

5、timizations may have proprietary IPSuccess of Graviton at AWSCopyright Take a look at Graviton from AWS:Improved performance:Graviton processors are optimized for specific workloads,such as web servers,containerized microservices,and data processing,leading to improved performance and faster process

6、ing speeds.Higher performance per dollar and cost-effective scalingSource:https:/ Hyperscalers have already found success in creating optimized Si for their specific needsPressures on Silicon Development Entails New ApproachAdvanced nodesYieldScalingMAX DIE SIZE MAX DIE SIZE Moores LawHARDER TO ACHI

7、EVE7NM,5NM,3NM,2NMTalentHELP WANTEDAI6GAutomotiveAUTONOMOUS VEHICLESSilicon SpinsVALIDATION,REWORKSustainabilityNET ZEROAnnual CycleDRIVE SALESTime to MarketSpecialised SiliconCostArm Neoverse:Scalable Efficiency from CPU to ChipletsIP PortfolioCOMPUTE SUB SYSTEMSINTEGRATED&VALIDATED SYSTEMS PERFORM

8、ANCE PER WATTFASTER TTM VIA CHIPLETSARM CHIPLET ECOSYSTEMCPUsSystem IPsCMN FabricATD LaunchSuccessful Program Launch OCP15+media&press articles with more than 70+articles on newsroom coverageExpanding ATD EcosystemTraining&access to CSS for partnersEngaging complementary IP providers to simplify int

9、egrationPartners building reference platforms on leading edge nodesPartners building test chips for customer PoCsEnabling Chiplet EcosystemNew Arm chiplet based CSSNew chiplet standardsWorking with foundries on advanced 3D packagingCompatibility with companion chiplet providersChiplet interop progra

10、mPhase 3Phase 3ChipletChiplet EcosystemEcosystemPhase 2Phase 2Build Reference Build Reference PlatformsPlatformsPhase 1Phase 1LaunchLaunch2H23 1H2024 2H2024Arm Total Design(ATD)Vision Enabling Path to a Chiplet EcosystemArm Investments to Enable Re-useable ChipletIndustry Standards Driving chiplet i

11、nteroperability and platform re-useUCIe established as the leading consortium for chiplets with widely available PHY IPArchitectureExtending traditional monolithic SoC designs to multi-die AMBA CHI C2C extends the on-chip bus to multichipCSA defines optimal partitioning choices for chiplet-based sys

12、tems.IP ProductsComplete portfolio to enable chiplet platform development Arm interconnects and system IP multi-chip readyNeoverse CSS providing the foundation to build a compute chiplet2024 is the year for re-usable chipletsWhen Will Chiplets Go Mainstream?Industry cooperation and coordination rega

13、rding chiplets is not without issueCurrently multiple standards exist on connecting chiplet componentsChiplet component providers are long term competitorsIndustry is moving in the right direction for chiplets,but when will it happen?Forbes Article LinkNY Times Article LinkIs it possible to get some

14、 of the advantages of chiplets today?Use OCP to Accelerate Your Full Platform DesignThe Open Compute Project(OCP)is a collaborative community focused on redesigning hardware technology to efficiently support the growing demands on compute infrastructure.OCP has already achieved 10 years of collabora

15、tion from OEMs/ODMs/CSPsIncludes projects focused on open server motherboard designs,chassis designs and interconnectionsUtilize the open solutions to jumpstart your custom developmentContribute back to get industry feedback and drive innovationSource:https:/www.opencompute.org/about DC FACILITIESHW

16、 MGMTOPEN SYS FWAINETWORKINGRACK&POWERSERVERSUSTAINABILITYThe Expanding Collection of Firmware on SiCORE-1CORE-2CORE-n.MemoryControllerPCIe/CXL PHY ControllerEthernet PHY ControllerOn Chip Management ControllerCustomizedAcceleratorCustomizedAcceleratorOn Chip Security ControllerMany new components o

17、n the designed CPU will require some firmware to functionUtilizing firmware with Si allows fixes to be made without costly redesign of the chip itselfMany basic designs exist in the open market for security,management and RASIndustry groups need to be created to standardize how these components inte

18、ract with each other and the outsideOCP OSF is a potential solutionAvoid every chiplet having its own external flash or unique and convoluted firmware loading mechanismAn ecosystem will form around these additional componentsCustomized Accelerator ConnectionCommon Firmware StrategySilicon ASilicon B

19、Silicon CMultiple Silicon environments are now the normABCCommon Base+Silicon A specific sourceDevelop&BuildSilicon AFirmwareCommon Base+Silicon B specific sourceDevelop&BuildSilicon BFirmwareCommon Base+Silicon C specific sourceDevelop&BuildSilicon CFirmwareMultiple Silicon use common base firmware

20、Results in same level of management features and functionalityBuilding from a common base ensures maximum compatibilityMaking purpose-built Si is more possible than ever beforeThe benefits of making custom Si are more important with the latest workloads and is the next stage of optimizationThe OCP c

21、ommunity offers the most resources to do a complete platform designChiplets are the future,but the industry is not fully ready for chiplets yetArm Neoverse program accelerates designs todayUsing common firmware across all platforms provides higher manageability and common featuresSummaryCall to Acti

22、onOptimizing Si for software is now a mustGet involved in various OCP groups to drive adoption of your custom solutionsAI,DC Facilities,Hardware Management,Networking,Open System Firmware,Rack&Power,Server and Sustainability Groups are a great place to get involvedCreate a new OCP group focused on chiplets and expand OSF for chiplet firmwareOther industry groups like UCIe will need a lot of collaborationOCP provides the system and datacenter level information to make your design a realityArm Total Design and Arm Neoverse AMI DCMThank you!