在可擴展的AI硬件架構中通過銅纜和光互連優化數據路由.pdf

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1、INNOVATIVE TECHNOLOGIES SUDDEN SERVICE GLOBAL REACHOptimizing Data Routing via Copper&Optical Interconnects in Scalable AI Hardware ArchitecturesMatthew BurnsGlobal Director,Technical MarketingSeptember 10,2024Samtec ConfidentialOptimized Data Routing-How?1.21 GW!224 Gbps/SIFabricsDisaggregationTher

2、mal ReliefScalabilityMemoryAccessOpticsSamtec ConfidentialKey AI Hardware ApplicationsCHIPSETSSoMs/CoMsACCELERATORSDSAsSamtec ConfidentialAI Chipsets/Characterization PlatformsA number of emerging AI chipset options from a variety of suppliersSoCs,CPU,GPU,TPU,Digital Compute,Analog Compute,etc.Fine-

3、tuned for training or inference whether at edge or in the data centerAI system development typically links AI chipset development boards mimicking end applicationsAI chipset I/O expansion opportunities aboundSamtec ConfidentialSamtec Bulls Eye High-Performance TestThe high-density array designs and

4、advanced cabling solutions support T&M applications to 70 GHz90 GHz solutions in developmentCompression interface provides easy mating/unmating and eliminates soldering costsHigh-density,space-saving designEnables smaller eval boards and shorter trace lengthsIdeal for testing the latest AI chipsets

5、capable of 224 Gbps PAM4Bulls EyeBulls Eye Enables smaller evaluation boards&shorter trace lengthsTraditional with SMAsTraditional with SMAsSamtec ConfidentialBulls Eye Case StudySamtec ConfidentialAI SoMs/CoMsComplete compute system on a single PCBASIC,RAM,I/O,peripherals,etc.System I/O and periphe

6、rals routed via connectors to carrier board/baseboardProvides a path from prototype to productionAI systems can consist of multiple SoMs/CoMsNew SoMs/CoMs feature increased speed and density in small footprintsSamtec ConfidentialHigh-Density Slim Body ArraysUp to 400 I/Os in a 4-row,open-pin-field d

7、esign0.635 mm pitch Edge Rate contactsSlim 5 mm body width5 mm to 16 mm stack heightsPCIe 6.0/CXL 3.1 capable Solder column termination for improved SI and ease of processingADM6/ADF6Samtec ConfidentialHigh-Performance ArraysFlexible open-pin-field and cost optimized,extreme performance solution5 mm

8、 and 10 mm stack heightsRight-angle socket available(APF6-RA)Four row design with up to 400 total pins on a 0.635 mm pitchRoadmap to 1,000+pinsSolder column termination for improved SI and ease of processingData rate compatible with PCIe 6.0/CXL 3.1 and 100 GbEAdditional row and pin counts in develo

9、pmentAPM6/APF6Samtec ConfidentialAI AcceleratorsUsed to“Accelerate”parallel computing workloads common to AI/MLIndustry-standard form factorsPCIe CEM AIC,PECFF,M.2,etc.AI chipset manufactures developing their own solutionsDeliver dramatic acceleration across a broad set of applicationsReconfigurable

10、 to provide an ideal fit for the changing workloads of the modern data centerSamtec ConfidentialPCI Express Edge Card SystemsPCI Express 4.0 Low Profile Edge Card ConnectorPCI Express 5.0 Edge Card ConnectorPCIE-LPPCIE-G5In Development:In Development:64 GT/s 64 GT/s edge edge cardcard systemsystemPC

11、IE-RAPCIE-EMPCI Express 3.0 Edge Card ConnectorSamtec ConfidentialPCI Express Jumper Cable AssembliesPCIe 3.0/4.0/5.0 capable cable assemblyPCIe 6.0 under developmentUsed for PCIe implementation,evaluation and developmentConfigurable as a jumper or an extension cableAvailable in custom lengths to su

12、it any applicationStandard 36,64,98 and 164 PositionsEdge card or connector end options availableMates with Samtecs PCIE/PCIE-G4/PCIE-G5 seriesPCIEC/PCIEC-G4/PCIEC-G5Standard RF End 2 options also availableSamtec ConfidentialGenerate High-Speed Edge Card SystemCompatible with SFF-TA-1002(1C,2C,4C&4C

13、+)PCIe 6.0/CXL 3.1 capableEdge Rate contacts optimized for signal integrity performanceVertical or right-angle cable launchMates with Generate 0.60 mm pitch high-speed edge card socket(HSEC6)Rugged metal latching systemGC6/HSEC6Samtec ConfidentialAcceleRate Slim,Direct Attach SystemSlimmest cable as

14、sembly in the industry-7.6 mm width8,16 and 24 DPs configurations in a high-density 2-row design72 DPs in developmentPCIe 6.0/CXL 3.1 capableContacts directly soldered to the twinax improves signal integrity by eliminating the transition board and its variabilityRugged metal latching and shielding“R

15、eversed Polarity”pinout option for reduced FEXTRight-angle board mate available(ARF6-RA)ARC6/ARF6Samtec ConfidentialDomain Specific ArchitecturesEvolving AI DSAs require more external cablingReach requirements vary depending on use case2m Within the rack7m Rack-to-rack10m+-Larger clusteringSeveral i

16、ndustry efforts underway to answer the challengePassive DACsRe-timed AECsNew PCI-SIG CopprLink Cable SpecificationOptical Transceiver MSAsIs there another way?Samtec ConfidentialFireFlyOptical Flyover TechnologyFEATURESData connection is taken“off board,”simplifying board layout and enhancing signal

17、 integrity from IC to faceplateUp to 28 Gbps per channel via optical cable for greater reach 32 Gbps under developmentIndustry leading miniature footprint allows for higher density close to the data sourceProtocol agnosticSimple to use system with easy insertion/removal and trace routing,no through-

18、holes,and a surface mount connector systemSupports data center,HPC and FPGA Protocols,including 10/40/100 GbE Ethernet,InfiniBand,Fibre Channel,PCIe,CXL,and AuroraSamtec ConfidentialScalable AI Hardware Optical Solutions Samtec ConfidentialScalable AI Hardware Optical Solutions Mid-board optical tra

19、nsceivers are nice,but.Many AI HW systems leverage PCB-based interconnectSamtec FireFly OCP OAI EXP ModuleFeatures 16x FireFly Optical Transceivers25 Gbps x4 configuration400 Gbps aggregate throughputLive demonstration at 2024 OCP Global SummitSamtec ConfidentialFlyover QSFP SystemsUp to 800 Gbps PA

20、M4 aggregate data rateVarious configurations(x4/x8 bidirectional)Belly-to-belly mating availableMultiple heat sink options for optimal dissipationVariety of end 2 optionsAdditional front panel ports in development:Flyover SFP112/Flyover OSFP 112 Gbps PAM4Sideband signals are routed through press-fit

21、 contacts for increased airflowHigh-speed contacts directly soldered to Eye Speed ultra low skew twinaxFQSFP-D8Samtec ConfidentialAcceleRate HP Gen 2 On-Package SystemFirst direct-to-chip package solution with the industrys highest density 112 Gbps PAM4 interconnectDouble the density in same footpri

22、nt 144 DPsVertical cable application provides the highest footprint density2-piece system for high reliability and thermal performance required for co-packaged solutionsART6/ATF6Samtec ConfidentialSi-Fly High-Density On-Package SystemVertically launched cables for the highest density package 64 DPs

23、in 14 mm x 14 mm footprint0.53 mm(Signal-Ground)and 0.40 mm(Signal-Signal)contact pitch;1.25 mm row-to-row pitchDesigned for High Density Interconnect(HDI)and package substratesEye Speed AIR foamed twinax cable for significantly improved signal integrity and even lower intra-pair skewSamtec Confiden

24、tialSi-Fly High-Density On-Package SystemUltra-high-density solution for co-packaged applications.Samtec ConfidentialGLOBAL CABLE FACILITIESSamtecs global cable manufacturing and assembly facilities are dedicated to R&D and manufacture of precision extruded twinax and micro coax cable,as well as hig

25、h-frequency RF cable.Samtec has developed multiple proprietary ultra-high performance cable technologies that have been engineered to address the challenges of next generation system designs.STARS Microelectronics Thailand(CM)Samtec ConfidentialNovaRay Micro Rugged BackplaneRugged blind-mate housing

26、 design with optional guide posts and keyingUp to 128 DPs(32 wafers)in one connectorSupports 1”slot pitch(less than 17.5 mm height)Innovative wafer design eliminates intrapair skewOffset footprint for optimal SI performanceWeld tabs for increased shear strengthDiff PairSingle EndedPowerNVBM-RA/NVBF/

27、NVCM/NVCFSAMPLES NOW AVAILABLESamtec ConfidentialKey TakeawaysSamtec offers a comprehensive portfolio of high-performance interconnect solutions ideally suited for AI system architectures in the data centerSamtecs global team of SI technical experts,online design tools and world-class customer service are available to support any AI system architectures in the data centerSamtecs new AI Interconnect Solutions GuideFor more information: