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1、ISSCC2025Forum6EvolutionoftheSoftware-DefinedVehicle:NavigatingSmartCockpitsandIn-CarHardwareOrganizers:Kazuki Fukuoka,Renesas Electronics,Tokyo,JapanEric Jia-Wei Fang,Mediatek,Hsinchu,TaiwanCo-Organizers:Sugako Otani,Renesas Electronics,Tokyo,JapanMina Shahmohammadi,NXP Semiconductors,Delft,The Net
2、herlandsHao Gao,Southeast University,Nanjing,ChinaCarlos Tokunaga,Intel,Hillsboro,ORChampions:Makoto Nagata,Kobe University,Kobe,JapanArun Natarajan,Oregon State University,Corvallis,ORISSCC 2025-Forum 6:Introduction1 of 4ISSCC 2025 Forum 6Evolution of the Software-Defined Vehicle:Navigating Smart C
3、ockpits and In-Car Hardware 2025 IEEE International Solid-State Circuits ConferenceForum Basics8 Talks1 Breakfast,2 Coffee Breaks&1 Lunch Break42-45 minutes talk followed by 5-8 minutes Q&A for each presenterElectronic copies for Forums are available for downloadPlease silence your mobile devicesRem
4、ember to fill out your speaker evaluations using the ISSCC app.ISSCC 2025-Forum 6:Introduction2 of 4 2025 IEEE International Solid-State Circuits ConferenceEvolution of the Software-Defined VehicleValue creation by softwareExtra function will be enabled after car purchasing.Bug fix can be performed
5、by OTA(over-the-air).Is SDV similar to Smartphone?Lots of challenges!New automotive hardware definition based on software updateWhat is a new trend for each automotive component?Wireless communicationCentral computing(SOC for Smart cockpit)Micro Controller UnitRadar systemSecuritySensor fusionAI mod
6、el processingISSCC 2025-Forum 6:Introduction3 of 4 2025 IEEE International Solid-State Circuits ConferenceAgendaISSCC 2025-Forum 6:Introduction4 of 4StartTitleSpeakerAffiliation8:00 AMBreakfast8:15 AMForum 6 IntroductionKazuki FukuokaRenesas8:25 AMOverview of Electrical and Electronic Architecture f
7、or Software Defined VehiclesMarius RotaruNXP9:15 AMAutomotive 5G Technologies and RF/Baseband Chipsets for High Speed and Large Capacity CommunicationFeng LuMediatek10:05 AMBreak10:20 AMChallenges in Automotive SoCs for Enabling Software-Defined VehiclesYasuhisa ShimazakiRenesas11:10 AMUnderstanding
8、 Over-The-Air Firmware Updates for Microcontrollers with Embedded Non-Volatile MemoryNicolas GrossierSTMicroelectronic12:00 PMLunch1:20 PMRadar Systems-on-Chip with Integrated Front-End,Processing,and Functional Safety for Automotive ApplicationsKarthik SubburajTexas Instruments2:10 PMPrivacy and Se
9、curity Research Challenges for an Automotive SupplierShalabh JainBosch3:00 PMBreak3:15 PMFunctional-Safe and Cybersecure Computing in Automotive Sensor Fusion DomainsUdo DannebaumInfineon4:05 PMRethinking Autonomous Vehicle Development with AV Foundation ModelsMarco PavoneNvidia4:55 PMClosing Remark
10、s 2025 IEEE International Solid-State Circuits Conference 2025 IEEE International Solid-State Circuits ConferenceOverview of Electrical and Electronic Architecture for Software Defined VehicleMarius RotaruChief Software Architect and Fellow NXP SemiconductorsISSCC 2025-Forum 6.1:Overview of Electric
11、al and Electronic Architecture for Software Defined Vehicle1 of 46Marius Rotaru 2025 IEEE International Solid-State Circuits Conference2 of 46Marius Rotaru Megatrends driven disruption in automotive E/E architecture Overview of today E/E vehicle network architectures Challenges when designing new ve
12、hicle architectures for SDVEnabling new E/E architectures for SDV NXP CoreRideTMPlatform Software-defined SoC architecturesIsolation and Virtualization for up-integrationSoftwaredefined networking acceleratorsSecurity and Safety solutions for SDVMaking AI Embedded Managing complexity System Software
13、 IntegrationConclusions and QuestionsOutlineISSCC 2025-Forum 6.1:Overview of Electrical and Electronic Architecture for Software Defined Vehicle 2025 IEEE International Solid-State Circuits Conference3 of 46Marius RotaruTrendsISSCC 2025-Forum 6.1:Overview of Electrical and Electronic Architecture fo
14、r Software Defined Vehicle 2025 IEEE International Solid-State Circuits Conference4 of 46Marius RotaruVehicle data-driven insights used to drive digital twins,improve algorithms and machine learning models deployed via Over-the-Air(OTA)updates through the life of vehiclesAutonomousConnectedElectricV
15、ehicle DataOver-the-Air(OTA)ServicesConnected Vehicle Enables Innovations in Autonomy and ElectrificationSoftware Defined Vehicles get more intelligent over time safer,more secure,higher efficiency,improved experiences.ISSCC 2025-Forum 6.1:Overview of Electrical and Electronic Architecture for Softw
16、are Defined Vehicle 2025 IEEE International Solid-State Circuits Conference5 of 46Marius RotaruWhat is a Software-defined Vehicle?ISSCC 2025-Forum 6.1:Overview of Electrical and Electronic Architecture for Software Defined Vehicle 2025 IEEE International Solid-State Circuits Conference6 of 46Marius
17、RotaruVehicle Transformation UnderwayFrom hardware-oriented vehicleTovehicleFunctions tied to ECUsFunctions can be anywhere in the vehicleStatic architectureFlexible architectureExponential increase in complexitySimplification of implementationFunctionFunctionFunctionFunctionFunctionFunctionFunction
18、FunctionFunctionFunctionFunctionFunctionFunctionISSCC 2025-Forum 6.1:Overview of Electrical and Electronic Architecture for Software Defined Vehicle 2025 IEEE International Solid-State Circuits ConferenceChallenges of SDV Integration ComplexityECUs contain 10s to 100s of components from both hardwar
19、e and software vendorsDiscrete ECUs require separate integration efforts of hardware and softwareFeatures and variants drive complexityAutomakers Must Navigate Mounting SWHWECU 1SWHWECU 2SWHWECU 3SWHWECU 4SWHWECU 5SWHWECU XIntegration effort exponentiallyincreases with more ECUsSeparate integration
20、efforts for every ECU7 of 46Marius RotaruISSCC 2025-Forum 6.1:Overview of Electrical and Electronic Architecture for Software Defined Vehicle 2025 IEEE International Solid-State Circuits ConferenceMultiple E/E architecture types evolving with different configurations,performance,and memory requireme
21、ntsDifferent vehicle classes drive many combinations of features and ECUs 25 ECUs in low end up to 150 in high end classesMultiple Vehicle Classes and Architectures FlatZonal FlatDomainHybrid ZonalClustered DomainFull ZonalFull CentralizedDistributed Zonal8 of 46Marius RotaruISSCC 2025-Forum 6.1:Ove
22、rview of Electrical and Electronic Architecture for Software Defined Vehicle 2025 IEEE International Solid-State Circuits ConferenceChallenges of SDV Key Architectural Transition:Evolutionary or Revolutionary9 of 46Marius RotaruComplementary paths aheadChoices and challengesDomainclustering+Partialz
23、onalization+FullzonalizationFeature Integration&IsolationLegacy Software DistributionCommunicationsSensor ConnectCo-Hosting applicationsLegacy software integrationDistributed safety and securityData and resource sharingPredictable,reliable networksFull ZoneGATEWAYDRIVETRAINCONNECTIVITYBODYBody+Drive
24、trainVehicle ComputerOEM AOEM CPhysical TransitionZonalization of the networksLogical TransitionClustering of DomainsPartial ZoneFull ZoneADASIVIConnectivity+IVIADASZonal GatewayZonal GatewayZonal GatewayZonal GatewayADASConnectivity+IVIVehicle ComputerZonal GatewayZonal GatewayZonal GatewayZonal Ga
25、tewayADASConnectivity+IVIVehicle ComputerISSCC 2025-Forum 6.1:Overview of Electrical and Electronic Architecture for Software Defined Vehicle 2025 IEEE International Solid-State Circuits ConferenceOverview of Software Challenges for SDV10 of 46Marius RotaruManaging complexity while reducing developm
26、ent time&cost Growing integration of functions with ECU consolidationIntegration of many SW partners in one SoCWhile maintaining security&isolation and offering in-field upgradabilityNetworking demandIncreasing performance bandwidth&latency,multiple protocolsAdvanced future-proof securityTamper-resi
27、stant,crypto-agile,IDPSBuilt on automotive safety and quality standards and reputationPhysical restructure ZONALGATEWAYZONALGATEWAYZONALGATEWAYZONALGATEWAYenabling software-defined vehiclesCENTRALBRAIN(S)Future means the software-defined vehicle with full service-oriented architecture,virtualization
28、 and shared compute resources12345ISSCC 2025-Forum 6.1:Overview of Electrical and Electronic Architecture for Software Defined Vehicle 2025 IEEE International Solid-State Circuits Conference11 of 46Marius RotaruOutlineISSCC 2025-Forum 6.1:Overview of Electrical and Electronic Architecture for Softwa
29、re Defined VehicleIntroduction to Software-Defined Vehicles Megatrends driven disruption in automotive E/E architecture Overview of today E/E vehicle network architectures Challenges when designing new vehicle architectures for SDV NXP CoreRideTMPlatform Software-defined SoC architecturesIsolation a
30、nd Virtualization for up-integrationSoftwaredefined networking acceleratorsSecurity and Safety solutions for SDVMaking AI Embedded Managing complexity System Software IntegrationConclusions and Questions 2025 IEEE International Solid-State Circuits Conference12 of 46Marius RotaruOverview of Electric
31、al and Electronic Architecture for Software Defined Vehicle 2025 IEEE International Solid-State Circuits ConferenceNXP CoreRideTMPlatform13 of 46Marius RotaruEssential to the operation of the vehicleHighest levels of real-time performance,safety and security neededMust be stable and long-lasting Eve
32、ry vehicle is built on Energy managementBody functionsMotion and dynamicsResource managerState controlVehicle HealthNetworkingData intelligenceVehicle SecurityADAS fusion&safetyIVIADAS perceptionISSCC 2025-Forum 6.1:Overview of Electrical and Electronic Architecture for Software Defined Vehicle 2025
33、 IEEE International Solid-State Circuits ConferenceNXP CoreRideTMPlatform14 of 46Marius RotaruOpen with unprecedented combination of scale and integration,paving the way to a new era of SDV developmentPlatformTightly integrated software and hardwareScalable hardwareSystem power managementS32Z/ES32RS
34、32M2S32K1S32NS32GS32K3S32 computeNetworking10 Mb 10 GbEthernet PHY&switch CAN&LINFocus ondifferentiationReduce complexityMaximize systemperformanceDiscrete HW components Middleware,OSes,DriversApplicationsNetworkingEnergy ManagementCentral ComputeZonesCoreRideplatformLeading partnersISSCC 2025-Forum
35、 6.1:Overview of Electrical and Electronic Architecture for Software Defined Vehicle 2025 IEEE International Solid-State Circuits ConferenceNXP CoreRideTMPlatform15 of 46Marius RotaruPlatform Enables Flexibility across Architectures and Design ChoicesFlexible function movement within architecturesFl
36、exible design choices across architecturesFlat ZonalizedFlatDomainHybrid ZonalClustered DomainFull ZonalFull CentralizedDistributed Zonal132CoreRideTMISSCC 2025-Forum 6.1:Overview of Electrical and Electronic Architecture for Software Defined Vehicle 2025 IEEE International Solid-State Circuits Conf
37、erenceNXP CoreRideTMPlatform16 of 46Marius RotaruThe Fast Path from Development to ProductionProduction-ready reference designs with system-level validated performanceProduction-ready development platformSafe,secure system-optimized foundation Compute,networking,system power Pre-integrated middlewar
38、e,OSes and drivers ISSCC 2025-Forum 6.1:Overview of Electrical and Electronic Architecture for Software Defined Vehicle 2025 IEEE International Solid-State Circuits Conference17 of 46Marius RotaruIsolation and Virtualization for Up-IntegrationISSCC 2025-Forum 6.1:Overview of Electrical and Electroni
39、c Architecture for Software Defined Vehicle 2025 IEEE International Solid-State Circuits ConferenceIsolation and Virtualization for Up-Integration18 of 46Marius RotaruBenefits:Lower cost and fast-time to marketReduce the number of wiring harnessesReduce the number of ECUsReduce SW complexity.Reduce
40、test and validation effortSimplified SW upgradability Challenges:Ensuring deterministic behavior of the application.Ensuring isolation of and precise resource allocation for safety-critical functionsVirtualizing various peripherals/devices across domains.Inter vECU communicationECUECU Consolidation
41、via Isolation and VirtualizationECU 1Application 1ECU 2Application 2ECU 3Application 3Communication BusiECU 1Application 1iECU 2Application 2Virtualization LayerHW Separation LayeriECU 3Application 3Heterogeneous SoCCommunication BusECU Consolidation with Mixed-Criticality ApplicationsISSCC 2025-For
42、um 6.1:Overview of Electrical and Electronic Architecture for Software Defined Vehicle 2025 IEEE International Solid-State Circuits Conference19 of 46Marius RotaruIsolationThe ability to group resources together into partitions,such that each partition can only see and affect itselfHARDWAREAARRMMRMA
43、ARMHARDWAREThe ability to run software without knowledge of silicon-specifics,i.e.hardware abstractionVirtualizationXRDCHypervisorIsolation and Virtualization for Up-IntegrationXRDC=eXtended Resource Domain Controller IPISSCC 2025-Forum 6.1:Overview of Electrical and Electronic Architecture for Soft
44、ware Defined Vehicle 2025 IEEE International Solid-State Circuits Conference20 of 46Marius RotaruDefinitionIsolated partitions or Execution Environments are collections of hardware resources,SW-defined and HW-enforced,that make up an“SoC within an SoC”HW CapabilitiesHW access control (XRDC is the co
45、mmon IP across SoCs)HW virtualized peripherals with QoS capabilities (for performance-critical use-cases)Cores with virtualization capabilities (used to create more“virtual”cores)PartitionPartitionPartitionPartitionPartitionPartitionS32NIsolation and Virtualization for Up-IntegrationISSCC 2025-Forum
46、 6.1:Overview of Electrical and Electronic Architecture for Software Defined Vehicle 2025 IEEE International Solid-State Circuits Conference21 of 46Marius RotaruOverview of Electrical and Electronic Architecture for Software Defined VehicleExtended Resource Domain Controller manages access control,s
47、ystem memory protection and peripheral isolation.Secure Resource Isolation Using IPApplications co-exist on the same silicon with an absolute firewall between them.Enforces absolute freedom from interference by permitting software to sandbox resources within robust processing domains.2025 IEEE Inter
48、national Solid-State Circuits Conference22 of 46Marius RotaruIsolation and Virtualization for ECU Consolidation with Mixed-criticality ApplicationsMaster CoreMulti-core APPLICATION Compute(ArmCortex A)Multi-core REAL-TIME Compute(ArmCortexM/R)HW Separation Layer(XRDC,MMU/MPU)Type1 HypervisorVirtuali
49、zation-aware HW Accelerators/Peripherals/MemoryRTOS 2VirtRTOS 1ExecutionEnvironmentBare-MetalRTOSSystem ManagementSecurity ManagerSafety ManagerSystem ManagerRICH-OS 1ExecutionEnvironmentExecutionEnvironmentExecution EnvironmentRICH-OS 2Execution EnvironmentSoftwareHardware?Programmable HW Accelerat
50、orsProgrammable HW AcceleratorsNXPs approach for SDV:Heterogenous SoC with hardware-assisted virtualization supportManaging Complexity of Hardware and Software for Up-IntegrationISSCC 2025-Forum 6.1:Overview of Electrical and Electronic Architecture for Software Defined Vehicle 2025 IEEE Internation
51、al Solid-State Circuits Conference23 of 46Marius RotaruSoftware-defined Network HW AcceleratorsISSCC 2025-Forum 6.1:Overview of Electrical and Electronic Architecture for Software Defined Vehicle 2025 IEEE International Solid-State Circuits Conference24 of 46Marius RotaruSoftware-defined networking
52、accelerators:Optimize the network architecture to different OEMs vehicle topologies Offload traffic routing to host processor addressing the needs for isolation and virtualization Reduce power dissipationWhy Software-Defined Networking Accelerators?ISSCC 2025-Forum 6.1:Overview of Electrical and Ele
53、ctronic Architecture for Software Defined Vehicle 2025 IEEE International Solid-State Circuits Conference25 of 46Marius RotaruSoftware-Defined Networking Accelerators for S32 PlatformProgrammable networking accelerator aiming to accelerate most routed packets,with minimal CPU load.Main Functionaliti
54、es:Deep packet inspection-Classify(L2,L3,L4,)Advanced packet filtering(e.g.SOME/IP filter and IPsec offload)VLAN support Ingress QoS Modify(Headers:MAC,NAT,)Multi queue transmit Multicast Multi-channel host interface L2 Basics(CRC,Basic HASHing,L3/4 Checksum offload,IEEE1588/802.1AS-Rev)S32G PFE-Eth
55、ernet Packet Forwarding EngineISSCC 2025-Forum 6.1:Overview of Electrical and Electronic Architecture for Software Defined Vehicle 2025 IEEE International Solid-State Circuits Conference26 of 46Marius RotaruSoftware-Defined Networking Accelerators for S32 PlatformS32NEth Ctrl InterfaceHVVMVMCortex-A
56、+Rich OS+HVCortex-RAutosarCortex-RAutosarRCUVMVMA.SAR GWEth SwitchLine Rate MACsec Encryption/AuthenticationSignal to Service FWiECU3iECU2iECU1Eth Ctrl InterfaceEth Ctrl Interface Support high BW communication(up 2 10 Gbps)Reduce system cost Compatible with all auto-relevant TSN Standards Built-in v
57、irtualization support for isolated Eth access to all vECUs Integrated line-speed MACsec Secure communications encryption,and IDPS offload engine Ethernet network management via rich TSN and SDN SW stack Extend port count via switch stacking(S32J Switch)Isolate all applications using HW-enabled virtu
58、al interfacesCustomer ValueKey Use CasesS32N:Networking Engine with Integrated Ethernet Switch ISSCC 2025-Forum 6.1:Overview of Electrical and Electronic Architecture for Software Defined Vehicle 2025 IEEE International Solid-State Circuits Conference27 of 46Marius RotaruSoftware-Defined Networking
59、Accelerators for S32 Platform Data plane example includes:An S32G automotive gateway andAn SJA1110 ethernet switch Flow and roles:SJA1110 handles VLAN bridging,and has the highest port count,high bandwidth,and low cost per data unit.S3G PFE firmware-based packet engine handles VLAN bridging,routing,
60、NAT,stateless firewall,and encryption offloads.General purpose cores handle termination of Eth traffic,stateful firewalling/connection tracking,and protocol-specific functions like SOME/IP checking.PFE Use-Case Example:Software-defined Networking(SDN)S32GSJA11106x 100BASE T1+3x SGMIISGMIIPHYSGMIIPHY
61、2.5G SGMIIPFE3x R/SGMII,5x Host IFsGMACR/SGMIIFW packet engineCortex-A/M coresR/SGMIIPHYR/SGMIIPHYR/SGMIIPHYvECUsNetworkingAPPsEth bridgingIP Routing,NATTermination,stateful functionsISSCC 2025-Forum 6.1:Overview of Electrical and Electronic Architecture for Software Defined Vehicle 2025 IEEE Intern
62、ational Solid-State Circuits Conference28 of 46Marius RotaruSoftware-Defined Networking Accelerators for S32 PlatformKey Advantage of LLCE vs Traditional approach:Flexibility to Customer ApplicationFlexible host interface Can be customized to specific customer use case Host CPU OffloadFunction offlo
63、ad from the main core Advanced filtering(Bitwise,range,.)e.g.Removes Host Look-up(100+cycles)Consistency/format checks Low latency frame gateway functionsReduced interrupt loading on the host core Enhanced Feature SupportSecurity offload Global timestampingCan to Ethernet tunnelling IEEE1722Traffic
64、logging Compliance with standardsCompatible with AUTOSAR Communication stack via AUTOSAR MCAL drivers(CAN,FR,LIN)S32G LLCE:Low Latency Communication EngineISSCC 2025-Forum 6.1:Overview of Electrical and Electronic Architecture for Software Defined Vehicle 2025 IEEE International Solid-State Circuits
65、 Conference29 of 46Marius RotaruSoftware-Defined Networking Accelerators for S32 PlatformS32G LLCE Use-Case Example:Fast Path Frame Routing Function Offload from Main Core:Advanced filtering(bitwise,range,.)Low latency frame gateway functionsCan to Ethernet tunnelling IEEE1722 Routing Latency:With H
66、ost:2xT1+2xT2+2xT3 With LLCE:T4 ISSCC 2025-Forum 6.1:Overview of Electrical and Electronic Architecture for Software Defined Vehicle 2025 IEEE International Solid-State Circuits Conference30 of 46Marius RotaruSecurity for SDVISSCC 2025-Forum 6.1:Overview of Electrical and Electronic Architecture for
67、 Software Defined Vehicle 2025 IEEE International Solid-State Circuits Conference31 of 46Marius RotaruWhat makes SDV unique,from a security perspective?CloudSoftwareHardwareV E H I C L E D A T ACentralized,Upgradable,Innovation PlatformsSimplify SW integration and deployment,through lifetime of vehi
68、cleNew Data Access&InsightsPortable,abstracted,accessible,bridging to legacySecure VehicleInfrastructureVehicle root of trust and firewall to the cloud123 Sheer Amount of Software and Data The large amount of software means the attack surface gets further increased SDVs will collect,process and stor
69、e sheer amounts of(monetizable)data attractive target for attackers The SDV security concept and architecture must also prioritize data(privacy)protection Increased Reliance on Connectivity SDVs increasingly rely on connectivity:internal(SOA)and external(personal devices,cloud services,infrastructur
70、e)increases the risk of operational impact New Revenue Streams SDV introduction goes hand in hand with(paid)services and applications to enrich the drivers experience Attacks may impact the OEMs business model,as well as the end user(by disrupting the services they paid for)ISSCC 2025-Forum 6.1:Over
71、view of Electrical and Electronic Architecture for Software Defined Vehicle 2025 IEEE International Solid-State Circuits Conference32 of 46Marius RotaruSystem Security With NXPs CoreRide Integral Security at All LevelsNetworkingEnergy ManagementSecureEnd-NodeSecureVehicle ComputeSecureZoneECUContext
72、-awareRoot-of-TrustECUSecurity ExtensionsIntegrated crypto acceleratorsSecure element solutionsSecure IVN solutionsSecure ranging solutionsSecure boot and run-timeSecure resource portioningKey managementSecure key provisioningSoftware attestationSecurity Rooted in HardwareVehicle Security Enablement
73、ECU Security EnablementAt System LevelAt Component LevelAt Vehicle LevelNo 3rdparty dependenciesHigh performanceHigh security assuranceComplete security stacksFast path to functional implementationSecure vehicle network enabledFast path to functional validationISSCC 2025-Forum 6.1:Overview of Electr
74、ical and Electronic Architecture for Software Defined Vehicle 2025 IEEE International Solid-State Circuits Conference33 of 46Marius RotaruSystem Security With NXPs CoreRide Integral Security at All LevelsInfotainment ECUi.MX High performance GFX&cloud connectivityECU functions&featuresESELinuxAUTOSA
75、RVehicle Compute PlatformS32N SW-defined compute platformVirtual ECUVirtual ECUVirtual ECUHSE2IVNCrypto Extensions(Encrypt/Decrypt/Authenticate)LinuxAUTOSARMemories(Flash,RAM)Secure SwitchSecure Trans.Vehicle ECUS32x Heterogenous compute platformECU functions&featuresHSEMemories(Flash,RAM)Secure Tra
76、ns.Edge NodeS32K3 Versatile&cost-effectiveECU functions&featuresHSESecure Trans.Secure Trans.LinuxAUTOSARAUTOSARSecure ElementSW-Defined VehicleSW-Defined Security FrameworkHardening vs.Local AttacksSecure PHYOEM Trust CenterSecure ProvisioningNXP Trust CenterSecure ElementSecure KeylessISSCC 2025-F
77、orum 6.1:Overview of Electrical and Electronic Architecture for Software Defined Vehicle 2025 IEEE International Solid-State Circuits Conference34 of 46Marius RotaruSystem Security With NXPs CoreRide Central Root of TrustHardware Security Engine as Central Root-of-Trust at the Core of SDVFirst relea
78、se-to-market:2018(S32G2)One solution(and API)across the entire S32 familyProven fit with market(OEM)requirementsReady for Post-Quantum CryptoComplete solution(one-stop-shop)SESIP-certified designed to comply with ISO21434On-Chip Security SubsystemISSCC 2025-Forum 6.1:Overview of Electrical and Elect
79、ronic Architecture for Software Defined Vehicle 2025 IEEE International Solid-State Circuits Conference35 of 46Marius RotaruS32 Quantum-Safe PlatformFastInstall then bootSecureLeveraging NXP expertiseHolisticComplete and future-proofImage update withML-DSA in 20ms*Verification in the secure boot cha
80、in at 500MB/s*throughputSecure boot flow and firmware update hardened against fault injectionQuantum-safe hybrid boot chaincovering NXP and customer assetsSecure field updates for crypto agility&long-term maintenanceSESIP certification*for additional assurance by independent labs*PoC timings for S32
81、G2 further optimization expected*S32G2/G3 SESIP L2 certified;S32K3 planned500-under NDAISSCC 2025-Forum 6.1:Overview of Electrical and Electronic Architecture for Software Defined Vehicle 2025 IEEE International Solid-State Circuits Conference36 of 46Marius RotaruMaking AI EmbeddedISSCC 2025-Forum 6
82、.1:Overview of Electrical and Electronic Architecture for Software Defined Vehicle 2025 IEEE International Solid-State Circuits Conference37 of 46Marius RotaruAutomotive:The Role of Artificial Intelligence GrowsDriver ReplacementRaw and/or object sensor data fusionPredictionFree space detectionTraje
83、ctory planningVisionDetect,segment,classify and track objectsRadarImaging radarSecurityDetect attacks and anomaliesDriver MonitoringFace/expression recognitionFace identificationOccupancy detectionPowertrainEnergy optimization with route and terrain planningPredictive battery managementInter-Environ
84、mentAwarenessPersonalized experience follows from one environment to the nextISSCC 2025-Forum 6.1:Overview of Electrical and Electronic Architecture for Software Defined Vehicle 2025 IEEE International Solid-State Circuits Conference38 of 46Marius RotarueIQTMAUTO:Deploying Automotive Quality,Safety
85、Aware ApplicationsTrainModelCodeDatasetTrainedModelOptimize/ConvertConverted ModelEvaluateEvaluatePruningQuantizationCompressionInput Image/DataConverted ModelDeploymentApplication CodeOptimizedSilicon PartitioningEnablement SW StackS32LS2Autoi.MxAutoDeep Learning FrameworkData FileeIQTMAUTOData Pre
86、parationand TrainingEvaluationDeploymentInferenceISSCC 2025-Forum 6.1:Overview of Electrical and Electronic Architecture for Software Defined Vehicle 2025 IEEE International Solid-State Circuits Conference39 of 46Marius RotarueIQTMAUTO Deep Learning Toolkit for Making AI EmbeddedPython workflow buil
87、t-on/integrates with standard open-source frameworks.Prepare for deploymentGraph builderPrototype,explore,validate,and debugGraph inference Graph analysisModel Preparation Tools Runtime framework and libraries manages the details to deploy easier and fasterMultiple backends with a single APIIntegrat
88、ed handling of resource management and initializationAutomated data movementScheduling and synchronization between coresHigh flexibility and low overheadRuntime Model Execution FrameworkISSCC 2025-Forum 6.1:Overview of Electrical and Electronic Architecture for Software Defined Vehicle 2025 IEEE Int
89、ernational Solid-State Circuits Conference40 of 46Marius RotaruISSCC 2025-Forum 6.1:Overview of Electrical and Electronic Architecture for Software Defined Vehicle 2025 IEEE International Solid-State Circuits Conference41 of 46Marius RotaruAutomotive Software Development and IntegrationMultiple leve
90、ls of integrationSafe and securesystem solutionsSoftware compatibility and reuseacross products and applicationsTransformation and Development ChallengesISSCC 2025-Forum 6.1:Overview of Electrical and Electronic Architecture for Software Defined VehicleAutomotive trends increase vehicle complexity I
91、ncreased software content every part of the vehicle Most advanced automotive features are software-greedy Puzzle of objectives,components and suppliers Integration is essential to unlock new use casesDevelopment of software modules frequently occurs in isolation Need to find a compatible ecosystem s
92、tandardization Tools to configure and build togetherMultiple layers of integration Software Platform Ecosystem 2025 IEEE International Solid-State Circuits Conference42 of 46Marius RotaruAutomotive Software Development and IntegrationDemonstrates S32Z/Es capability to execute multiple of application
93、s(iECUs)in separated boxes,free-from-interference in safety point of viewS32G2/3:GoldVIP(Gateway)S32Z/E:GreenVIP(RT Zonal/Domain)Demonstrates S32Gs Seamless vehicle-to-cloud infrastructureVehicle Integration Platforms(VIPs)Enables integration of 3rd party applications from different vendors with NXP
94、 SW on each MPUEnables fast time-to-market and reduces your investmentOEM/Tier 1 ApplicationsOEM/Tier 1 ApplicationsISSCC 2025-Forum 6.1:Overview of Electrical and Electronic Architecture for Software Defined Vehicle 2025 IEEE International Solid-State Circuits Conference43 of 46Marius RotaruAutomot
95、ive Software Development and IntegrationNetworkingEnergy ManagementCentral ComputeZonesNXP CoreRideplatformPurposefully-integrated software and hardwareFocus ondifferentiationReduce complexityMaximize systemperformanceDiscrete HW components Middleware,OSes,DriversApplicationsLeading partnersPlatform
96、Co-designwith Ecosystem PartnersAccelerated customer developmentOptimization for customers specific use caseMaximized performance from siliconSystem expertise to support OEM use casesStrengthen ecosystem through increased added-value.ISSCC 2025-Forum 6.1:Overview of Electrical and Electronic Archite
97、cture for Software Defined Vehicle 2025 IEEE International Solid-State Circuits Conference44 of 46Marius RotaruOutlineIntroduction to Software-Defined Vehicles Megatrends driven disruption in automotive E/E architecture Overview of today E/E vehicle network architectures Challenges when designing ne
98、w vehicle architectures for SDVEnabling new E/E architectures for SDV NXP CoreRideTMPlatform Software-defined SoC architecturesIsolation and Virtualization for up-integrationSoftwaredefined networking acceleratorsSecurity and Safety solutions for SDVMaking AI Embedded Managing complexity System Soft
99、ware IntegrationISSCC 2025-Forum 6.1:Overview of Electrical and Electronic Architecture for Software Defined Vehicle 2025 IEEE International Solid-State Circuits Conference45 of 46ConclusionsNXP CoreRideTMPlatform Streamline development with pre-integrated software Consolidate without compromising s
100、afety Scalable,reconfigurable,move functionsS32 Scalable Compute Platform for Software-defined Vehicles Essential building blocks for safe vehicle isolation,computing,secure networking and data intelligenceAutomotive System Software Integration Enable integration of HW and SW to optimize performance
101、 and interoperability Open software ecosystemOver-the-air updatesISSCC 2025-Forum 6.1:Overview of Electrical and Electronic Architecture for Software Defined VehicleMarius Rotaru 2025 IEEE International Solid-State Circuits ConferenceQuestions46 of 46Marius RotaruISSCC 2025-Forum 6.1:Overview of Ele
102、ctrical and Electronic Architecture for Software Defined Vehicle 2025 IEEE International Solid-State Circuits ConferenceAutomotive 5G Technologies and Chipsets for High Speed and Large Capacity CommunicationDr.Feng LuAssociate VP,MediaTek USAISSCC 2025-Forum 6.2:1 of 26 2025 IEEE International Solid
103、-State Circuits Conference Recap of auto/mobile communications historyFrom“0G”Car phone to 5G NTN automotive communications use case and challengesConnected mobilityIn cabin connectivityPeer-to-PeerUbiquitous Coverage Communications technology and solutions for automotiveConnected mobility:5G TN cel
104、lular connectivityUbiquitous Coverage:satellite communications for the carIn cabin connectivity:Wi-Fi,Bluetooth,NearLinkPeer-to-Peer:V2X2 of 26ISSCC 2025-Forum 6.2:Presentation Outline 2025 IEEE International Solid-State Circuits Conference3 of 26ISSCC 2025-Forum 6.2:Auto/Mobile Communications Histo
105、ry Proprietary car phone“0G”1946Weighs 80 pounds$6 for 3-minute call,no dataExclusively for the wealthy 1G mobile1979Weighs 2 pounds,$10,0002.4kbpsStill for the wealthy 2025 IEEE International Solid-State Circuits Conference4 of 26ISSCC 2025-Forum 6.2:Auto/Mobile Communications History 2G GSM/GPRS19
106、91“candy bar phones”Democratized voice and messages100+kbps 3G UMTS/CDMA2000/TD-S2001“Smart”phones21MbpsPopularized data and app usage 2025 IEEE International Solid-State Circuits Conference5 of 26ISSCC 2025-Forum 6.2:Auto/Mobile Communications History 4G LTE2009More smart phonesDemocratized Data,1G
107、bps+5G NR2019Smart phones,foldables,FWAEven more data,10+GbpsSatellite communication 2025 IEEE International Solid-State Circuits Conference6 of 26ISSCC 2025-Forum 6.2:Auto/Mobile Communications History Observations Automotive and mobile communications synergyAutomotive drives some of the frontier m
108、obile technologiesFrom early era car phone to 5G NTNMobile evolution democratizes technologies for automotive adoption Every generationComes 10 years after the previousBrings 10X+enhancement in capabilitiesDemocratizes applications that was introduced in the previous gen 2025 IEEE International Soli
109、d-State Circuits Conference automotive communications use cases and challengesConnected mobilityPeer-to-PeerIn cabin connectivity7 of 26ISSCC 2025-Forum 6.2:Auto/Mobile communications use cases 2025 IEEE International Solid-State Circuits Conference Use casesVoiceData applicationsEmergency services
110、ChallengesVoice quality(solved with 2G)Data speedSystem capacityCoverage8 of 26ISSCC 2025-Forum 6.2:Connected Mobility and Challenges 2025 IEEE International Solid-State Circuits Conference Use casesVehicle-to-Vehicle;Vehicle-to-Pedestrian;Vehicle-to-InfrastructureSafety applicationsConvenience/traf
111、fic managementAutonomous driving ChallengesRangeLatencyCapacity9 of 26ISSCC 2025-Forum 6.2:Peer-to-Peer use cases and Challenges 2025 IEEE International Solid-State Circuits Conference Use cases Digital car keysWifi access pointIn-car audioActive noise cancellation ChallengesReliabilitySecurityData
112、rateLatency Not a focus for today10 of 26ISSCC 2025-Forum 6.2:In-Cabin Connectivity and ChallengesPicture Source:LXT.ai 2025 IEEE International Solid-State Circuits Conference 5G Communications technology and solutions for automotiveConnected mobility:5G TN cellular connectivityUbiquitous Coverage:s
113、atellite communications for the car11 of 26ISSCC 2025-Forum 6.2:5G Technologies for Automotive 2025 IEEE International Solid-State Circuits Conference12 of 26ISSCC 2025-Forum 6.2:Mobile TN Technology Evolution3G4G5G6G ProjectionPeak DL Rates&Antenna20Mbps1Tx/2Rx1Gbps1Tx/2+Rx10Gbps2Tx/4+Rx1Gbps 1Tbps
114、4Tx/8+RxSpectrumFDD+new TDD(e.g.,2.3GHz)+more TDD(2.5GHz)+unlicensed(5GHz)+3.5-7GHz+mmW(28-60GHz)+7-24GHz+Sub-THzNetwork densificationNominal+MIMO&small cell+massive MIMO+distributed computing Key TechnologyCDMA,Rx Diversity,Equalization,5MHz channel,64QAMOFDM,MIMO,20MHz channel,256QAM(more)MIMO,100
115、MHz channel,1024QAM,FR2 mmW,ULRRC(even more)MIMO,400MHz channel,FR3,distributed computing 2025 IEEE International Solid-State Circuits Conference 5G has been a resounding commercial success.Three years after launch,5G smartphone shipment exceeded 600M units per year.Success factorsSub-6 eMBB enhance
116、mentsCompetitionCountries(US,China,Korea)Policy and spectrum allocations/auctionsOperators in the leading countries,especially US and China operatorsDevice OEMs:all the biggest smartphone brandsChipset vendors:MediaTek,Qualcomm,Samsung LSI,HiSiliconPandemic5G killer app is still absent,but 5G user e
117、xperience did improve thanks to competition13 of 26ISSCC 2025-Forum 6.2:Is 5G TN a Success?2025 IEEE International Solid-State Circuits Conference5G NTN Technologies14 of 26 Terrestrial network covers 60%population,but 40%landmass.Still lack of broadband coverage in remote area4G/5G network deployme
118、nt mostly based on human distribution Terrestrial+Satellite networks can offer truly ubiquitous coveragearound the worldCellular:urban+indoorSatellite:rural+outdoor“Coverage”as Key KPI for mobility networkISSCC 2025-Forum 2.1:2025 IEEE International Solid-State Circuits Conference“Best In Show”GSMA
119、2023 Global Mobile Awards in MWC5G Narrowband NTN Technology15 of 26ISSCC 2025-Forum 2.1:2025 IEEE International Solid-State Circuits Conference5G Wideband NTN Technology16 of 26ISSCC 2025-Forum 2.1:2025 IEEE International Solid-State Circuits Conference5G Broadband NTN Technology17 of 26MediaTek 5G
120、-Adv NTN platform integrated onto a vehicle5G gNB+5GCLEO Channel EmulatorCobot emulating the satellite trajectory100+Mbps for Satellite BroadbandParametersValuesFrequency band Ku band DL center frequency12.58 GHz(MWC freq)UL center frequency14.08 GHz(MWC freq)Bandwidth50 MHzTransmission mode1 Tx*1 R
121、xArray elements8*8Beamforming technology Ephemeris-based Satellite height 600 KmSatellite speed7.56 Km/sMax Doppler 18.5ppmMax Doppler drift0.27ppm/sMax RTT 5.7 msMax delay drift18.5 us/sInternetISSCC 2025-Forum 2.1:2025 IEEE International Solid-State Circuits ConferenceMassive MIMO beamforming to a
122、chieve 10 x100 x data rate Native PHY and protocol designs for seamless TN+NTN interworkingSmart spectrum sharing between satellite and terrestrial to enable rapid NTN deploymentNTN Communication Beyond 5G18 of 265G Satellite Communicationsvs.6G Satellite CommunicationsISSCC 2025-Forum 2.1:2025 IEEE
123、 International Solid-State Circuits Conference Using MediaTek Solutions as example19 of 26ISSCC 2025-Forum 6.2:5G Solutions for Automotive 2025 IEEE International Solid-State Circuits Conference20 of 262021.MayFR1+FR2 DC World-1stwith Ericsson&Verizon2021.JuneFR2 Uplink 4CC World-1stwith Ericsson202
124、2.FebR16 FR1 DL 4CCWorld-1stwith Nokia&TMO2022.OctR16 FR1 PC1.5World-1stwith Moto&TMO2023.AprilFR1 UL 2CCWorld-1stwith Nokia&AT&T2023.JulyR16 FR1 3TXWorld-1stwith Samsung2023.AugR17 RedCapWorld-1stwith Ericsson&Verizon2023.AugR17 RedCapWorld-1stwith Nokia&AT&TMediaTek 5G Modem Leading MNO FeaturesIS
125、SCC 2025-Forum 6.2:2025 IEEE International Solid-State Circuits Conference21 of 26Next Gen MT2739 Ultra Speed 5G NR ModemSupport5G+5G/5G+4G DSDA5G 5CC 400 MHz9.0+Gbps5G UltraSave 4.05G5GSIM 15G/4GSIM 25G/4GStable uplink throughput&coverage enabling remote diagnostics and predictive maintenance5G NR
126、peak rate33%Ultra-fast speeds enabling connected car services such as OTA update,HD maps&multimedia contentMT2739MT2737MT2739MT2737Light LoadingHeavy LoadingLight LoadingPower30%Heavy LoadingPower10%Optimized power consumption during transmission of periodic data and massive data to the cloudISSCC 2
127、025-Forum 6.2:MT2739MT2737 2025 IEEE International Solid-State Circuits Conference22 of 26Next Gen MT2739 Ultra Speed 5G NR ModemRelease 17 Coverage EnhancementRelease 17 Throughput EnhancementRelease 18 Mobility Enhancement MT2739MT2737Extended uplink coverage enabling better signal reception in ru
128、ral areasUL Throughput45%MT2739MT2737Enhanced uplink throughput enabling applications like real-time monitoring and fault detectionMT2739MT2737Optimized handover time enabling seamless switching between base stationsWith UL Tx Switching,2T-2T(2 band)20%With HPUE TDD PC1.5,ULCA PC2,FDD PC2With LTM Lo
129、w Layer Triggered MobilityHandoverTime67%ISSCC 2025-Forum 6.2:2025 IEEE International Solid-State Circuits Conference23 of 26MediaTek Maintains Leadership on 5G NTNISSCC 2025-Forum 6.2:Wideband2023 MWCWorlds first voice/video streaming demo over 5G NR NTN on a smartphone,7+MbpsFR1 S-band,5MHz bandwi
130、dthSmartphone form factor,linear antennaBroadband2024 MWCNarrowband2023 CESWorlds first 5G advanced satellite broadband over Ku-band,100+MbpsFR3 Ku-band,50MHz bandwidth8x8 phase array antennaWorlds first smartphone with two-way satellite messaging capabilityFR1 S/L-band,200kHz bandwidthSmartphone fo
131、rm factor,linear antenna 2025 IEEE International Solid-State Circuits Conference24 of 26MT2739 NB-NTN&NR-NTN for Connected Cars ISSCC 2025-Forum 6.2:NB-NTNNR-NTNCategoryNarrow BandBroad BandWaveformNB-IoTNRBandwidth200KHz520MHzFrequencyBandB23,B255,B256L-Band(n255)S-Band(n256)Data RateKbpsMbpsApplic
132、ationsDataData,VoiceAntenna Diversity1T2R1T2R Power ClassPC2:26dBmPC2:26dBmEmergency SOS(NB-NTN)Emergency Voice Call(NR-NTN)In-Vehicle Entertainment(NR-NTN)Two-way Messaging(NB-NTN)Location Sharing(NB-NTN)2025 IEEE International Solid-State Circuits Conference A suite of 5G technologies are offered
133、for automotive use casesHigh data rates;higher capacity;Ubiquitous coverage Key KPIs are an order of magnitude better than 4G 5G IC solution incarnations have seen strong adoptionSynergy between smartphone and automotive form factors 6G outlookEvolution of NTN towards pervasive coverage and seamless
134、 user experienceNew uses cases:GAI,Robotics,XR,Robotics,etc.25 of 26ISSCC 2025-Forum 6.2:Concluding Remarks 2025 IEEE International Solid-State Circuits ConferenceReferencesPress Release:MediaTek Conduct Worlds First Public Test of 5G Satellite IoT Data Connection with Inmarsat,Aug 19,2020MWC 2023-M
135、ediaTek Live NTN Video Call Demo:https:/youtu.be/gGT2M4O-cxc?feature=sharedMWC 2024-Worlds First 5G-Advanced Satellite Broadband:https:/youtu.be/FGFqhf6_kDQ?feature=sharedMediaTek 6G Technology White Paper-Satellite and Terrestrial Network Convergence“Reverse Spectrum Allocation for Spectrum Sharing
136、 between TN and NTN,”IEEE CSCN 2021“Feasibility and Opportunities of Terrestrial Network and Non-Terrestrial Network Spectrum Sharing,”IEEE Wireless Communications Magazine 2023“Interference Mitigation for Reverse Spectrum Sharing in B5G/6G Satellite-Terrestrial Networks,”IEEE Transactions on Vehicu
137、lar Technology,Mar.2024.26 of 26ISSCC 2025-Forum 6.2:2025 IEEE International Solid-State Circuits ConferenceYasuhisa ShimazakiISSCC 2025 ForumsForum6.3:Challenges in Automotive SoCsfor Enabling Software-Defined VehiclesYasuhisa Shimazaki()Renesas Electronics CorporationISSCC 2025-Forum 6.3:Challenge
138、s in Automotive SoCs for Enabling Software-Defined Vehicles1 of 43 2025 IEEE International Solid-State Circuits ConferenceYasuhisa ShimazakiOutlineIntroductionAutomotive System TrendsAutomotive E/E ArchitectureChallenges in Automotive SoCsSoC Requirements for SDVsKey EnablersExamples of SoCs for SDV
139、sCommunication Gateway(CoGW)Automotive Multi-domain SoCSummaryISSCC 2025-Forum 6.3:Challenges in Automotive SoCs for Enabling Software-Defined Vehicles2 of 43 2025 IEEE International Solid-State Circuits ConferenceYasuhisa ShimazakiAutomotive System Trends:CASEElectric VehiclesConnected CarAutomated
140、 Driving Acceleration of EV market growth Zero emissions requirements Expansion of emerging companies Cloud service w/connected car OTA for maintenance&upgrade Threat of cyberattack Acceleration of Level 3/4 self-driving Driver-less Taxi service Utilization of AI computingCAEChanges in the Automotiv
141、e Industry in 3 Key Segments+ServiceISSCC 2025-Forum 6.3:Challenges in Automotive SoCs for Enabling Software-Defined Vehicles3 of 43 2025 IEEE International Solid-State Circuits ConferenceYasuhisa ShimazakiAutomotive Market TrendsConnected/UXAutonomous6xElectric vehicles by 20274xAD Level 1-5 vehicl
142、es by 20303xGateway installed vehicles by 2027Streamlined(E/E architecture)2xTelematics installed vehicles by 2027Source:Strategy AnalyticsConnected/UX:#of Telematics ECU installed vehicles 2021 to 2027,Autonomous:#of AD Level 1 5 vehicles(standard scenario)2020 to 2030,Streamlined:#of Gateway Modul
143、e installed vehicles 2021 to 2027,Electrified:#of Battery EV production 2021 to 2027SAM growth123Source:Renesas Estimation based on TechInsightsCAGR16%ElectrificationISSCC 2025-Forum 6.3:Challenges in Automotive SoCs for Enabling Software-Defined Vehicles4 of 43 2025 IEEE International Solid-State C
144、ircuits ConferenceYasuhisa ShimazakiE/E(Electric/Electronic)ArchitectureTOMORROWDomain ArchitectureTODAYDistributed ArchitectureFUTUREZone ArchitectureVehicle levelGatewayDomain ControlSimple ActuatorECU(Electrical Control Unit)Central Compute/ZoneSimple ActuatorWire Harness|Automotive Business|List
145、 of Vehicle Equipment Business|YAZAKI Corporation(yazaki-)ECUs are moving toward domain,zone architectureSystems require higher real-time processing performance,network topology development,enhanced safety&security and secure OTA(over the air)ISSCC 2025-Forum 6.3:Challenges in Automotive SoCs for En
146、abling Software-Defined Vehicles5 of 43 2025 IEEE International Solid-State Circuits ConferenceYasuhisa ShimazakiDomain E/E ArchitectureVehicle ComputerCameraCameraCameraDomainControllerGatewayPower Train/Chassis BodyInfotainmentADAS DomainApplication(Function)ADAS and ADSAdaptive Cruise Control Pre
147、-crash safety systemInfotainmentIVI(In-Vehicle Infotainment)Head UnitNavigationPower Train(Engine,xEV)Engine management systemAutomatic transmissionChassis and SafetyElectric power steeringBrake systemBodyAir conditionerDoor systemDomainControllerDomainControllerDomainControllerADAS:Advanced Driver-
148、Assistance Systems,ADS:Automated Driving SystemISSCC 2025-Forum 6.3:Challenges in Automotive SoCs for Enabling Software-Defined Vehicles6 of 43 2025 IEEE International Solid-State Circuits ConferenceYasuhisa ShimazakiAutomated Driving System(ADS)SAE LevelLevel 0Level 1Level 2Level 3Level 4Level5What
149、 the features do:Driver support featuresAutomated driving featuresWarning and momentary assistanceSteering or brake/acceleration supportSteering and brake/acceleration supportDriving vehicle under limited conditionsDriving vehicle under all conditionsWhat the driver must do:The driver is driving.The
150、 driver is not driving.The driver must constantly supervise the features.The driver must drive when the features require.The features will not request the driver to take over driving.*Source:SAE J3016.Levels of driving automationSAE:Society of Automotive EngineersBig technology gap in SAE level 3 an
151、d beyond from role&responsibility viewpoint between human driver and system.AISSCC 2025-Forum 6.3:Challenges in Automotive SoCs for Enabling Software-Defined Vehicles7 of 43 2025 IEEE International Solid-State Circuits ConferenceYasuhisa ShimazakiConnected CarsService focused on the driverInformatio
152、n to driversmaintenance servicePre-installed Serviceservices to all carsData from all vehicles(Camera,Map,Route）Service collaborationIT providers and IT servicers get activeData limit to OEM serviceAdd on ServiceNew service businessby using informationon the carTODAYTOMORROWC SISSCC 2025-Forum 6.3:C
153、hallenges in Automotive SoCs for Enabling Software-Defined Vehicles8 of 43 2025 IEEE International Solid-State Circuits ConferenceYasuhisa ShimazakiElectric VehiclesThe New York Times()2022/08/24EMarket Demand for EV(Electric Vehicles)Stricter CO2 emissions regulationsTurmoil in the electric vehicle
154、 business aside,the evolution and expansion of technologies related to the electrification of vehicles continuesISSCC 2025-Forum 6.3:Challenges in Automotive SoCs for Enabling Software-Defined Vehicles9 of 43 2025 IEEE International Solid-State Circuits ConferenceYasuhisa ShimazakiOutlineIntroductio
155、nAutomotive System TrendsAutomotive E/E ArchitectureChallenges in Automotive SoCsSoC Requirements for SDVsKey EnablersExamples of SoCs for SDVsCommunication Gateway(CoGW)Automotive Multi-domain SoCSummaryISSCC 2025-Forum 6.3:Challenges in Automotive SoCs for Enabling Software-Defined Vehicles10 of 4
156、3 2025 IEEE International Solid-State Circuits ConferenceYasuhisa ShimazakiSource:VW,Development Trend:SW First02004006008001000120020052010201520202025Lines of Code(LOC)per Vehicle Full autonomous driving systems will reach one billion lines of code Linux 5.11 20 million Google Chrome 35 million Ma
157、c OS X 100 million Android 35 million Windows 7 40million(Million)ElectricAutonomousShared&ServicesConnectedMega Trend:CASE for human centric worldValue Proposition:HW SW/ServicesInevitable SW ExplosionSW Defined Vehicle:Development TrendISSCC 2025-Forum 6.3:Challenges in Automotive SoCs for Enablin
158、g Software-Defined Vehicles11 of 43 2025 IEEE International Solid-State Circuits ConferenceYasuhisa ShimazakiSemiconductor Intrinsic ValuesUX Values Performance Functionalities Process Technology Energy Efficiency Security Easy to Use SW Development Environment SW Reusability/Compatibility Rich Eco
159、System for Scaling Time to Market Agile*CI/CD*CI/CD:Continuous Integration and Continuous DeliveryUX ValuesSemiconductor Intrinsic ValuesFormer DevelopmentFuture DevelopmentMore UX OrientedTwo Directions:“Semiconductor Intrinsic”&“User Experience(UX)”UX Technologies:Solutions for SW Explosion of Cus
160、tomersSW Defined Vehicle:Two DirectionsISSCC 2025-Forum 6.3:Challenges in Automotive SoCs for Enabling Software-Defined Vehicles12 of 43 2025 IEEE International Solid-State Circuits ConferenceYasuhisa ShimazakiSoC Requirements for SDVsIndustry trends areincreasing demand for SoC portfolio Mass deplo
161、yment of advanced ADASData and software-oriented E/E architecture Shift to central car compute and domain integrationSoC requirementsMULTI-DIE EXTENSIONSOFTWAREREUSESCALABILITY ACROSS ENTIRE FLEETSCALABLE COMPUTE PLATFORM:MONOLITHIC&MULTI-DIEISSCC 2025-Forum 6.3:Challenges in Automotive SoCs for Ena
162、bling Software-Defined Vehicles13 of 43 Scalability for entire vehicle fleet R&D efficiency via software reuse Centralized&domain compute 2025 IEEE International Solid-State Circuits ConferenceYasuhisa ShimazakiISPIMRVideo I/OGPGPU Use caseADASGWIVI KPI/criteriaSWHWTool Device model specSystem Requi
163、rementFPGA instancePC/CloudApplication domainGP-DSPAI AccPeripheralI/OLinux BSPMCALMWRef app(DMS,Front camera and SV)SimulatorEmulatorRTLMW/BSP/MCALRef appHW access patterns,data and sequenceGeneral PurposeCV/Video pipelineMulti Device FrameworkOSALVirtualSDKEmulation PlatformOn premise/Via cloudHos
164、t machinePC/CloudReal domain BusIPIPFunctional development and validationPerformance validationFast SimulatorCV:Computer Vision,DMS:Driver Monitor System,GP:General Purpose,ISP:Image Signal Processing,IMR:Image Rendering Unit,MCAL:Microcontroller Abstraction Layer,OSAL:OS Abstraction LayerSW explosi
165、on requires SW design environment without HW Virtual SW development environmentKey Enablers:Virtual SW Development Env.ISSCC 2025-Forum 6.3:Challenges in Automotive SoCs for Enabling Software-Defined Vehicles14 of 43 2025 IEEE International Solid-State Circuits ConferenceYasuhisa ShimazakiKey Enable
166、rs:Chiplet TechnologyWire BGAFCBGAChip Area mm2ChipletPin CountEvolving system requires more pins and larger chip area for a monolithic chipPackage:BGA Flip-Chip BGA ChipletChiplet MeritsEnables integration and enhances performanceBetter system level yield than a monolithic huge chipRealizes time to
167、 market coping with moving system requirementsISSCC 2025-Forum 6.3:Challenges in Automotive SoCs for Enabling Software-Defined Vehicles15 of 43 2025 IEEE International Solid-State Circuits ConferenceYasuhisa ShimazakiKey Enablers:Chiplet Challenges*EMC:Electro Magnetic CompatibilityBase ChipAI ChipC
168、omputing ChipFunction Extension ChipGraphic ChipChallenges:HWReliability in mechanical strength,thermal conditions,and*EMCMaterials for interposer and package Interconnect standard among chipsHi Speed and Bandwidth interfacesConnection fault handlingSystem/SWSystem partitioning among chipsSW archite
169、cture running across chipsVerification and validation Interconnect standardization to enable rich ecosystemMulti-die synchronized operation.Solution:Design and verification/validation in virtual environmentISSCC 2025-Forum 6.3:Challenges in Automotive SoCs for Enabling Software-Defined Vehicles16 of
170、 43 2025 IEEE International Solid-State Circuits ConferenceYasuhisa ShimazakiOutlineIntroductionAutomotive System TrendsAutomotive E/E ArchitectureChallenges in Automotive SoCsSoC Requirements for SDVsKey EnablersExamples of SoCs for SDVsCommunication Gateway(CoGW)Automotive Multi-domain SoCSummaryI
171、SSCC 2025-Forum 6.3:Challenges in Automotive SoCs for Enabling Software-Defined Vehicles17 of 43 2025 IEEE International Solid-State Circuits ConferenceYasuhisa ShimazakiCommunication Gateway(CoGW)SystemADAS ECUsCameraRadar/LidarCognitiveIVI ECUsCommunication Gateway ProcessorComm.module CAN busEthe
172、rnet SwitchEthernet SwitchCommunication Gateway ECUPMICTiming ICCloud service w/connected carOTA for maintenance&upgradeIntegration to one chip for efficiencyECUsECUsECUsK.Shimada et al,ISSC,2023ISSCC 2025-Forum 6.3:Challenges in Automotive SoCs for Enabling Software-Defined Vehicles18 of 43 2025 IE
173、EE International Solid-State Circuits ConferenceYasuhisa ShimazakiKey Factors for CoGWCloud service w/connected carOTA for maintenance&upgradeIntegration to one chip for efficiency 30k DMIPSCPU Perf.Secure/Non-Secure separation Security Max 7W Stand-by 2mWLow Power 30k DMIPSCPU Perf.ISSCC 2025-Forum
174、 6.3:Challenges in Automotive SoCs for Enabling Software-Defined Vehicles20 of 43 2025 IEEE International Solid-State Circuits ConferenceYasuhisa ShimazakiNetwork Performance with Limited Power101001010.10.0110010.10.01CAN-FD100BASE-T1000BASE-TRequired bandwidth for CoGWCoGWCommunication Power PHY+C
175、PUW This workCar networkComm.power limitNetwork performance GbpsHigh Performance Computing Total Power 7W100Gb10GbLINApplication 6WPower for Network Processing Max 7W due to passive cooling Keep 6W+for rich application 10Gbps/W is targetPower consumption budget Ethernet2Gbps x1+1Gbps x2Network Perf.
176、Max 7W Stand-by 2mWLow PowerISSCC 2025-Forum 6.3:Challenges in Automotive SoCs for Enabling Software-Defined Vehicles21 of 43 2025 IEEE International Solid-State Circuits ConferenceYasuhisa ShimazakiSecurity Threats in CoGWISSCC 2025-Forum 6.3:Challenges in Automotive SoCs for Enabling Software-Defi
177、ned Vehicles22 of 43 2025 IEEE International Solid-State Circuits ConferenceYasuhisa ShimazakiCoGW Processor Architectural OverviewISSCC 2025-Forum 6.3:Challenges in Automotive SoCs for Enabling Software-Defined Vehicles23 of 43 2025 IEEE International Solid-State Circuits ConferenceYasuhisa Shimaza
178、kiCoGW Processor Architectural OverviewISSCC 2025-Forum 6.3:Challenges in Automotive SoCs for Enabling Software-Defined Vehicles24 of 43Control DomainCovers traditional gateway featureLimited performance&Low powerApplication DomainRealize CoGW applicationMaximum performance 2025 IEEE International S
179、olid-State Circuits ConferenceYasuhisa ShimazakiLow Power Modes to Support CoGW Use CasesCAR conditionDeep stopCyclic runRunFull RunPeriodical operation like as car diagnostic 20mW RoomTempExecute partial CoGW application 0.5WHighTempExecute Full CoGW application 6-7WHighTempIgnition off(Parking)Ign
180、ition on(Running)PerformanceWaiting for Wake-upLow Power for Battery Saving1000K DMIPS,ASIL D supportSecurityHigh speed interconnects including PCIe Gen4/6,USB2/3 and 8-port ethernet switchMCU subsystem over 60K DMIPS,supporting ASIL B/D&low-power modes.10MB on-chip SRAMSafety/FFIsystem Multi-stage
181、security arch.featuring dedicated security acceleratorMulti-megapixel camera processing with ISP&DOF HWAMemoryI/FHigh performance GPU up to 4 TFLOPS equivalent(2)for leading-edge graphics,supporting HW virtualizationChipletextensionASIL D support without ext.MCU.HW-supported FFI for mixed criticalit
182、y apps.Flexible QoS.Open architecture/chiplet with industry-standardized die to die interconnects and APIsMulti-4k media streaming supporting H264/5,VP9,and AV1LPDDR5x supporting over 250GB/s memory throughput Best-in-class power efficiency AI acceleration up to 400 TOPS(1)GPDSPOffload NPU&CPU with
183、general purpose DSP coresFUNCTIONALITYADASIVIGATEWAYCOMPUTE(1):Sparse(2):Manhattan 3.0 benchmarkingISSCC 2025-Forum 6.3:Challenges in Automotive SoCs for Enabling Software-Defined Vehicles36 of 43 2025 IEEE International Solid-State Circuits ConferenceYasuhisa ShimazakiThe Problem We Are Solving:FLE
184、XIBILITYCost effective multi-domain scalable integrated solutions with chiplet extension to scale upMULTI DIE PACKAGEMULTI DIE PACKAGEMULTI DIE PACKAGEMULTI DIE PACKAGECombination of NPU and GPU chiplet extension in single SoC packageNPU ChipletD2DHardware compatibility via SIP option(FCBGA)TOPS for
185、SENSORSTFOPS forDISPLAYSMORE CAMERASMORE RADARSLIDARSRADARSNPU&GPUUPGRADECAMERAS60 mphGPU ChipletD2DPanoramic60 mphSoCSoCISSCC 2025-Forum 6.3:Challenges in Automotive SoCs for Enabling Software-Defined Vehicles37 of 43 2025 IEEE International Solid-State Circuits ConferenceYasuhisa ShimazakiSoC with
186、 Interoperability:FLEXIBILITYModular hardware and systems to meet OEM processing needsIntegrates industry standard die-to-die interconnect and APIsFacilitates interoperability with other components in a multi-die systemMix and match different functions and customize systems including future upgrades
187、 across vehicle platformsGPUUPGRADENPUUPGRADEDifferent flavor of packaging options supported enabling an open ecosystem for on-package innovationISSCC 2025-Forum 6.3:Challenges in Automotive SoCs for Enabling Software-Defined Vehicles38 of 43 2025 IEEE International Solid-State Circuits ConferenceYa
188、suhisa ShimazakiSoC Use Cases:FLEXIBILITYModular hardware and systems to meet OEM processing needsSoCGPUNPUNetworkCPUGPU CHIPLETGPUD2DMirror/CMSCameraDriver/InteriorCameraSurround ViewCameraRear displayMirror displayPanoramic displayHead-Up DisplaySoCNPUGPUGatewayCPUD2DCluster displayCenter displayF
189、ront&RearCameraDriver/InteriorCameraSurround ViewCameraHead-Up Display60 mphRadarSoCNPUGPUNetworkCPUNPU CHIPLETNPUD2DFront&RearCameraDriver/InteriorCameraSurround ViewCameraFisheyeCameraSVM displayRadarLidarFusion ECUADAS+IVI+GatewayADAS Domain ECUHigh-end sensors fusionCockpit Domain ECUMulti&panor
190、amic display&camerasx4x1x2x4x3x3x4x3x3x460 mphISSCC 2025-Forum 6.3:Challenges in Automotive SoCs for Enabling Software-Defined Vehicles39 of 43 2025 IEEE International Solid-State Circuits ConferenceYasuhisa ShimazakiSoC in Monolithic Design:POWER-EFFICIENCY3-nm multi-domain central car computer wit
191、h optimized power design 30-35%improvement in power efficiency for specific workloads compared to the next higher node 5nm 3nm35%Low power operation mode.Limits the module to operate for perception.Low power operation mode.Limits module to operate for peripherals(sensor)house keeping in the parking.
192、Chip level standby mode reducing power consumption in the parkingNormal operationIndustry-first 3-nm automotive qualified multi-domain central car computerIntegrates AI processing for 360-degree perception with highly efficient TOPS/WattsBest-in-class power,non liquid cooled*safety compliant central
193、 car computerDEEPSTOPCYCLICRUNOptimized power design and power modes to support modern automotive use casesRUNSENTRYISSCC 2025-Forum 6.3:Challenges in Automotive SoCs for Enabling Software-Defined Vehicles40 of 43 2025 IEEE International Solid-State Circuits ConferenceYasuhisa ShimazakiAutomotive So
194、C:MIXED-CRITICALITYMulti-domain compute solution enabling BOM cost reduction Hosting multiple compute domains(aka X-domain)in a single SoC requires to guarantee their respective specificitiesSoftware methods alone like hypervisor cant guarantee full freedom from interferenceHardware measures are nee
195、dedUnique&industry proven freedom from interference(FFI)solution extended to new SoCEnsure domain isolation via deep hardware measures on Automotive SoC including RegionID,memory protection by RegionID or QoS extension Automotive SoCRTOSFrequentUpdatesQMHighIntegrityASIL-B/DTrustedAppsQMHighAvailabi
196、lityASIL-BHardReal TimeASIL-DClusterIVIADASServiceVCPandroidQNXLinuxAUTOSARISSCC 2025-Forum 6.3:Challenges in Automotive SoCs for Enabling Software-Defined Vehicles41 of 43 2025 IEEE International Solid-State Circuits ConferenceYasuhisa ShimazakiSummaryAutomotive system trends:CASEKey aspects for So
197、ftware-Defined VehiclesValue proposition:HW SW/ServicesTwo directions:Semiconductor intrinsic values&User experienceSoC requirements for SDVsScalability for entire vehicle fleetR&D efficiency via software reuseCentralized&domain computeKey enablersVirtual SW development environmentChiplet technology
198、Communication Gateway(CoGW)Computing/Network performance,Low-power,SecurityAutomotive Multi-domain SoCScalability,Flexibility,Power Efficiency,Mixed-CriticalityISSCC 2025-Forum 6.3:Challenges in Automotive SoCs for Enabling Software-Defined Vehicles42 of 43 2025 IEEE International Solid-State Circui
199、ts ConferenceYasuhisa ShimazakiReferencesS.Otani,“Automotive System Design,”IEEE Solid-State Circuits Society Distinguished Lecture,2024.S.Yoshioka,“Renesas Technology Strategy for a Paradigm Shift in The Semiconductor Industry,”International Semiconductor Executive Summits Japan 2024,Mar.2024.“Cali
200、fornia to Ban the Sale of New Gasoline Cars,”The New York Times,Aug.24,2022.Online.Available:https:/ and Definitions for Terms Related to Driving Automation Systems for On-Road Motor Vehicles-SAE International.”Y.SE-Ho,“Integration Technology From Package Level to Wafer Level Integration,”in 2020 IE
201、EE International Electron Devices Meeting SC1,Dec.2020.K.Shimada et al.,“A 33kDMIPS 6.4W Vehicle Communication Gateway Processor Achieving 10Gbps/W Network Routing,40ms CAN Bus Start-Up and 1.4mW Standby Power,”in 2023 IEEE International Solid-State Circuits Conference-(ISSCC),Feb.2023,pp.240241.“IS
202、O 26262:2011,2018,”Road vehicles Functional safetyISSCC 2025-Forum 6.3:Challenges in Automotive SoCs for Enabling Software-Defined Vehicles43 of 43 2025 IEEE International Solid-State Circuits ConferenceISSCC 2025Forum 6.4:Understanding Over-The-Air firmware updates for microcontrollers with embedde
203、d non-volatile memoryNicolas GrossierSystem on Chip ArchitectSTMicroelectronicsISSCC 2025-Forum 6.4:Understanding Over-The-Air firmware updates for microcontrollers with embedded non-volatile memory1 of 41 2025 IEEE International Solid-State Circuits ConferenceOutlineShort history of OTA software up
204、dateOTA automotive market requirements Smart mobility,software defined vehicle,and OTA OTA software update key characteristicsOTA implementation OTA infrastructure outside the MCU Device initialization:boot process and Root of Trust OTA execution flow Memory consideration:an OTA hungry of memoryTake
205、 away&Future evolution of OTAISSCC 2025-Forum 6.4:Understanding Over-The-Air firmware updates for microcontrollers with embedded non-volatile memory2 of 41 2025 IEEE International Solid-State Circuits ConferenceOutlineShort history of OTA software updateOTA automotive market requirements Smart mobil
206、ity,software defined vehicle,and OTA OTA software update key characteristicsOTA implementation OTA infrastructure outside the MCU Device initialization:boot process and Root of Trust OTA execution flow Memory consideration:an OTA hungry of memoryFuture evolution of OTAISSCC 2025-Forum 6.4:Understand
207、ing Over-The-Air firmware updates for microcontrollers with embedded non-volatile memory3 of 41 2025 IEEE International Solid-State Circuits ConferenceShort history of software updateFUNCTIONAL2000201019501970198019902020ISSCC 2025-Forum 6.4:Understanding Over-The-Air firmware updates for microcontr
208、ollers with embedded non-volatile memoryAT HOMEOPEN SOURCESECURE/MOBILEAUTOMOTIVESW DEFINEVEHICLE4 of 41 2025 IEEE International Solid-State Circuits ConferenceOutlineShort history of OTA software updateOTA automotive market requirements Smart mobility,software defined vehicle,and OTA OTA software u
209、pdate key characteristicsOTA implementation OTA infrastructure outside the MCU Device initialization:boot process and Root of Trust OTA execution flow Memory consideration:an OTA hungry of memoryTake away&Future evolution of OTAISSCC 2025-Forum 6.4:Understanding Over-The-Air firmware updates for mic
210、rocontrollers with embedded non-volatile memory5 of 41 2025 IEEE International Solid-State Circuits ConferencePost-salevehicle customizationSW-enabledfunctions&servicesFast access to marketSecurity improvementsImproves user experienceImproves business valueTHE MARKETRegulatory compliancySafety impro
211、vementsOTA(Over-the-Air software update)Software Defined VehicleISSCC 2025-Forum 6.4:Understanding Over-The-Air firmware updates for microcontrollers with embedded non-volatile memory6 of 41 2025 IEEE International Solid-State Circuits ConferenceOver-the-Air(OTA)update Any method of making data tran
212、sfers wirelessly instead of using a cable or other local connectionDefinitionISSCC 2025-Forum 6.4:Understanding Over-The-Air firmware updates for microcontrollers with embedded non-volatile memoryTHE MARKET7 of 41 2025 IEEE International Solid-State Circuits ConferenceOTA SW updatecharacteristicsTHE
213、 MARKETSecureCosteffectiveSafe and robustISSCC 2025-Forum 6.4:Understanding Over-The-Air firmware updates for microcontrollers with embedded non-volatile memoryUser friendly8 of 41 2025 IEEE International Solid-State Circuits ConferenceCost effectivenessNo OTASW update at the garageWorkshop infrastr
214、uctureDiagnostic stationRecall campaignCustomer perceptionCar immobilizationOTASoftware update anywhereExternal infrastructureOTA platform in vehicleProduct early in the market,improving market shareTHE MARKETISSCC 2025-Forum 6.4:Understanding Over-The-Air firmware updates for microcontrollers with
215、embedded non-volatile memory9 of 41 2025 IEEE International Solid-State Circuits ConferenceSafety and robustnessImage FileCHECK CAR OKCode FileXCode FileCode manifest&certification(integrity)Test&monitoring(functionality)Roll back/safe stateTHE MARKETISSCC 2025-Forum 6.4:Understanding Over-The-Air f
216、irmware updates for microcontrollers with embedded non-volatile memory10 of 41 2025 IEEE International Solid-State Circuits ConferenceSecurityUNECE R155&R156ISO/SAE 21434ConfidentialityAuthenticityAvailabilityTHE MARKETISSCC 2025-Forum 6.4:Understanding Over-The-Air firmware updates for microcontrol
217、lers with embedded non-volatile memory11 of 41 2025 IEEE International Solid-State Circuits ConferenceUser friendly No OTAKey OFFKey ONIn mission OTAPTHE MARKETISSCC 2025-Forum 6.4:Understanding Over-The-Air firmware updates for microcontrollers with embedded non-volatile memory12 of 41 2025 IEEE In
218、ternational Solid-State Circuits ConferenceOutlineShort history of OTA software updateOTA automotive market requirements Smart mobility,software defined vehicle,and OTA OTA software update key characteristicsOTA implementation OTA infrastructure outside the MCU Device initialization:boot process and
219、 Root of Trust OTA execution flow Memory consideration:an OTA hungry of memoryTake away&Future evolution of OTAISSCC 2025-Forum 6.4:Understanding Over-The-Air firmware updates for microcontrollers with embedded non-volatile memory13 of 41 2025 IEEE International Solid-State Circuits ConferenceThe SW
220、 update OTA flow overviewConception/preparation/documentationNotificationDownloadInstallationFailure/rollbackConfirmation/monitoringOTA SOLUTION IN THE CARISSCC 2025-Forum 6.4:Understanding Over-The-Air firmware updates for microcontrollers with embedded non-volatile memory14 of 41 2025 IEEE Interna
221、tional Solid-State Circuits ConferenceThe OTA infrastructure outside the MCU2-Notification3-Download 6-MonitoringCentralcomputingMemorycloudServerData fileFirmware1-Conceptionand preparationZone controllerZone controllerZone controller3-Download 4-Installation5-Failure rollback4-Installation5-Failur
222、e rollbackOTA SOLUTION IN THE CARISSCC 2025-Forum 6.4:Understanding Over-The-Air firmware updates for microcontrollers with embedded non-volatile memory15 of 41 2025 IEEE International Solid-State Circuits ConferencePrimary resourcesmanagement(power,reset,clock,safety)CommunicationEthernet/CAN subsy
223、stemOTA module in the MCUSecure BootRoot of TrustOTA managerCrypto engineNon-volatile memorySecure vaultApplication Non-volatile memorySecure bootOTA SOLUTION IN THE CARISSCC 2025-Forum 6.4:Understanding Over-The-Air firmware updates for microcontrollers with embedded non-volatile memoryLegend:OTA p
224、rocess16 of 41 2025 IEEE International Solid-State Circuits ConferenceSecure boot step by stepTo be continuedSupply ECU Check the condition for a safe and secure working window(monitor voltage,temperature)Execute hardware Built-In Self-Test(BIST):Memory,logic,analogCertify device safe statusSafe and
225、 secure VT conditionsHardwaresafety self-test Power-upOTA SOLUTION IN THE CARISSCC 2025-Forum 6.4:Understanding Over-The-Air firmware updates for microcontrollers with embedded non-volatile memory17 of 41 2025 IEEE International Solid-State Circuits ConferenceSecure boot step by stepRoot of TrustApp
226、licationcodeInitialize secure and cryptographic servicesRelease reset to the application executionGOTrusted Secure HW configurationCheck life cycleUnlock HW resources:Access to the secure data vault and secure keys from the Root of TrustIdentify exec.ImageInitialize and executeof the HW secure modul
227、eCheck device integrityRun authentication of the application codeOTA SOLUTION IN THE CARISSCC 2025-Forum 6.4:Understanding Over-The-Air firmware updates for microcontrollers with embedded non-volatile memory18 of 41 2025 IEEE International Solid-State Circuits ConferenceExample of OTA execution flow
228、Secure boot and device configurationOTA configuration checkData acquisitionData decryptionData buffering/programmingLoop until full image download completionData verification and authentication.Image registrationRe-bootOTA SOLUTION IN THE MCUISSCC 2025-Forum 6.4:Understanding Over-The-Air firmware u
229、pdates for microcontrollers with embedded non-volatile memory19 of 41 2025 IEEE International Solid-State Circuits ConferenceSW package structure(MCUboot as example)HEADERImage type,size,version,magic PAYLOADSW Image containing the application codeSecurity informationSecurity attribute,signatureTRAI
230、LERInstallation requestSwap status,Image confirmation flag(No failure,no Roll back)SW package structureRef:https:/www.trustedfirmware.org/projects/mcuboot/index.htmlTRAILERHEADERPAYLOAD(CODE IMAGE)SECURITY INFOEMPTYOTA SOLUTION IN THE MCUISSCC 2025-Forum 6.4:Understanding Over-The-Air firmware updat
231、es for microcontrollers with embedded non-volatile memory20 of 41 2025 IEEE International Solid-State Circuits ConferenceSecurity implementationSecure Communication Channel Vehicle/MCUServerData FileFirmwareData FileFirmwareData FileEncrypted FirmwareReferenceCalculated ValueOKNOKreject SW updateIns
232、tall CodeCode FileClear TextFirmware certificate+ISSCC 2025-Forum 6.4:Understanding Over-The-Air firmware updates for microcontrollers with embedded non-volatile memoryOTA SOLUTION IN THE MCU21 of 41 2025 IEEE International Solid-State Circuits Conference Authentication and acknowledgement of the OT
233、A request Verification of SW package header Check of compatibility with current header and OTA log prevent unwanted roll-back Identification of NVM target for new image programming(context A or context B)Preparation of target NVM areaOTA configuration checkRoot of Trust NVMOTA configOTA SOLUTION IN
234、THE MCUISSCC 2025-Forum 6.4:Understanding Over-The-Air firmware updates for microcontrollers with embedded non-volatile memory22 of 41 2025 IEEE International Solid-State Circuits ConferenceData flow within the MCUNon-Volatile memoryOTA SWApplication NVMOTA manager(core)Memory bufferCrypto engineSec
235、ure vaultSecurity keysOTA managercodeNVMcontrollerNew image targetCommunicationEthernet/CAN subsystemData bufferData bufferOTA SOLUTION IN THE MCUISSCC 2025-Forum 6.4:Understanding Over-The-Air firmware updates for microcontrollers with embedded non-volatile memory23 of 41 2025 IEEE International So
236、lid-State Circuits ConferenceCommunication SubsystemCommunication subsystem need to grant access to the car backbone or to the local network Medium speed interface for zone controllerEthernet 100MBits,1000MBits,Low speed interface for local MCUEthernet T1S 10MBitsCAN network(standard,FD,XL)ETHERNETO
237、TA SOLUTION IN THE MCUISSCC 2025-Forum 6.4:Understanding Over-The-Air firmware updates for microcontrollers with embedded non-volatile memory24 of 41 2025 IEEE International Solid-State Circuits ConferenceMain Ethernet subsystem layer:PHY for access to the mediaMACSEC for frame authentication/encryp
238、tionMAC for datalink controlEthernet switch to reduce core overhead,and manage Ethernet loopOn a standard 1Gbit/s Ethernet networkBorrowing 1%of Ethernet bandwidthConsidering overhead linked to Ethernet frame and data authentication1MByte image is transmitted in 1 secondETH.LOOPTypical Ethernet subs
239、ystemEthernet subsystem overviewMACSWITCHMACSECPHYMACMACSECPHYMCUFROM/TO CENTRAL COMPUTERFROM/TO MCU SYSTEM AND OTA MANAGEROTHER TRAFFICOTA OTA SOLUTION IN THE MCUISSCC 2025-Forum 6.4:Understanding Over-The-Air firmware updates for microcontrollers with embedded non-volatile memory25 of 41 2025 IEEE
240、 International Solid-State Circuits ConferenceThe OTA functionality requests a subset of the secure services and may not require a full Hardware Security Module(HSM)OTA Crypto accelerator provides a set of services like:SHA2,SHA3,SM3 for hashingRSA/ECC,SM2 for signature verificationAES-128/256,SM4 f
241、or decryption or tag authenticationIf implemented as a full HSM,the crypto engine can also act as OTA manager,granting the decrypted code is confined within the secure module,which can be a must for secure code Crypto engineCrypto CPUCrypto acceleratorSecure NVM Secure codeSecure vaultSecureRAMSecur
242、eperipheralsINTERCONNECTKeysmicrocodeSecure SWKeysTo/from MCU systemOTA SOLUTION IN THE MCUISSCC 2025-Forum 6.4:Understanding Over-The-Air firmware updates for microcontrollers with embedded non-volatile memory26 of 41 2025 IEEE International Solid-State Circuits ConferenceRoot NVM contains the OTA
243、configurationConfiguration bit to enable OTA functionalityA/B swap pointer to select the image to be executedOTA log table to track software update historyCode NVM contains the SW images of the applicationOne organization is the A/B swap mode,code NVM hosts up to two imagesDepending on OTA configura
244、tion information,image A/B are available at the execution addressAlias of images present in the device may be available for safety or monitoring reasons.Access is restricted,for example permitted only for safety coreNVM memory organization to host OTAEXECUTION IMAGE(A or B)IMAGE A(ALIAS)IMAGE B(ALIA
245、S)RECOVERY IMAGE(B or A)Access protected through MPURoot of Trust NVMOTA ConfigA/B SwapCODE NVMRoot NVMOTA SOLUTION IN THE MCUISSCC 2025-Forum 6.4:Understanding Over-The-Air firmware updates for microcontrollers with embedded non-volatile memory27 of 41 2025 IEEE International Solid-State Circuits C
246、onferenceSeveral strategies to execute an application during OTA update:Execution from RAMExecution from RAM,typically limited vs NVM At least move critical interrupt services to RAM Execution from NVM with stall-while-writeExecution from NVM,OTA steal timing slot for writeKey off,latency for critic
247、al interrupt services Execution from NVM with read-while-writeTwo NVM banks:One NVM bank is written while the second NVM bank is readNatively supported with A/B swap NVM memory organization to execute OTAApplicationcoreNVMRAMApplicationcoreNVMApplicationcoreNVM0NVM1Delay accessOTA SOLUTION IN THE MC
248、UISSCC 2025-Forum 6.4:Understanding Over-The-Air firmware updates for microcontrollers with embedded non-volatile memoryRAM28 of 41 2025 IEEE International Solid-State Circuits ConferenceA robust OTA architecture requires 2x image locationsLoad image during execution(key-on)RollbackA/B swap or activ
249、e/recovery imagesimpacting product size120%*product area at 2x memory50%of image size at fixed area*Considering NVM as 20%of products areaOTA SOLUTION IN THE MCUMain applicationOTA managerNon-volatileMemory(IMAGE A)Non-volatileMemory(IMAGE B)Non-Volatile memory(Root of Trust)An OTA hungry of memoryI
250、SSCC 2025-Forum 6.4:Understanding Over-The-Air firmware updates for microcontrollers with embedded non-volatile memory29 of 41 2025 IEEE International Solid-State Circuits ConferenceOTA memory organization and performanceApplicationCore0NVM 0(B)NVM 0(A)NVM 1(B)NVM 1(A)ApplicationCore1Choice between
251、the different structures can be driven bySW architecture,performance target,cost consideration,OTAmanagerApplicationCore0NVM 0(A)NVM 1(B)ApplicationCore1OTAmanager2x memory banksOTA updateOTA updateCode transferVERTICAL SWAPHORIZONTAL SWAPCode transfer4x memory banksIncreased bandwidthLimited collis
252、ion(cross accesses)Higher costs:2x NVM interfaces Arbitration between cores to access code in an active context Cost-optimized solution OTA SOLUTION IN THE MCUISSCC 2025-Forum 6.4:Understanding Over-The-Air firmware updates for microcontrollers with embedded non-volatile memory30 of 41 2025 IEEE Int
253、ernational Solid-State Circuits ConferencePhase-change memory:working principlePCM storage mechanism:material with variable resistanceGexSbyTez(GST*)chalcogenide alloy has 2 phases with different resistivity*Germanium,Antimony,and TelluriumPhase change(write):Joule effectAmorphous Read“0”RESET PROCE
254、SSSET PROCESSHigh resistivityPolycrystallineRead“1”Low resistivity4 F.Arnaud et al,2020 IEDM,pp.501-504OTA SOLUTION IN THE MCUISSCC 2025-Forum 6.4:Understanding Over-The-Air firmware updates for microcontrollers with embedded non-volatile memory31 of 41 2025 IEEE International Solid-State Circuits C
255、onferencePhase-change memory characteristicsMemory cell sizeBest-in-classHigh temperatureAchieves automotive requirements for AEC-Q100 operating up to+165CRadiation immunityBest-in-classTechnology power efficiencyLower consumption at more stringent conditionsProprietary PCM technology:Industry-leadi
256、ng memory density&robustnessIndustry smallest eNVM cell(28/18nm)2x memory density vs.alternativesHighest density for A/B swapBest power,performance,area(PPA)index versus alternative technologies(RRAM,MRAM,Flash)0.019 m2per bit(28nm)Qualified and in mass production nowOTA SOLUTION IN THE MCUISSCC 202
257、5-Forum 6.4:Understanding Over-The-Air firmware updates for microcontrollers with embedded non-volatile memory32 of 41 2025 IEEE International Solid-State Circuits Conference OTA bandwidth:Ethernet/CANMust be limited to few%,not to impact the running application Ethernet range:1MB/s,CAN range 10kB/s
258、 OTA bandwidth:crypto engineMACSEC line rate limited by Ethernet bandwidth Internal crypto-engine up to 500MByte/s Bandwidth non-volatile memory write Peak programming rate when dedicated bank available(1MB/s)Down to 100kB/s in case of shared R/W bankBandwidth consideration bottleneck for OTA proces
259、s100 ECUs3 of 52 2025 IEEE International Solid-State Circuits ConferenceSDV-Architecture EvolutionISSCC 2025-Forum 6:Privacy and Security Research Challenges for an Automotive SupplierDomain-oriented architecture with many ECUsExample:current upper-class vehicle has 100 ECUsZone-oriented,vehicle-cen
260、tralized architecture with fewer,more powerful vehicle computersIncrease in requirements placed on software platforms,virtualization,4 of 52 2025 IEEE International Solid-State Circuits ConferenceSDV-Architecture ImplicationsISSCC 2025-Forum 6:Privacy and Security Research Challenges for an Automoti
261、ve SupplierGradual transition from hardware-driven development to software-defined developmentFunctions&feeling implemented primarily through software Continuous updatesPersonalized user experienceHigh-performance vehicle computer as central element of the E/E architectureHigh connectivity and high
262、integration of off-board functionalityFunctionality&feeling largely determined by hardware components:engine,drivetrain etc.Software“just”realizing the potentials of the hardware componentsSome connectivity5 of 52 2025 IEEE International Solid-State Circuits ConferenceSDV-Architecture ImplicationsIS
263、SCC 2025-Forum 6:Privacy and Security Research Challenges for an Automotive SupplierThe car will be connected and become part of the IoT Fundamental changes in connectivity infrastructure and vehicle architecture will emerge.More flexible models of cooperation with intense softwarereuse from a multi
264、tude of sourcesArtificial intelligence and autonomous driving,will transform the car into a personal assistant.It will become a“third livingspace”6 of 52 2025 IEEE International Solid-State Circuits ConferenceSDV-Architecture ImplicationsISSCC 2025-Forum 6:Privacy and Security Research Challenges fo
265、r an Automotive SupplierThe car will be connected and become part of the IoT Fundamental changes in connectivity infrastructure and vehicle architecture will emerge.More flexible models of cooperation with intense softwarereuse from a multitude of sourcesArtificial intelligence and autonomous drivin
266、g,will transform the car into a personal assistant.It will become a“third livingspace”SecurityPrivacyPrivacySecurityPrivacySecurity7 of 52 2025 IEEE International Solid-State Circuits ConferenceSecurity Challenges-CurrentISSCC 2025-Forum 6:Privacy and Security Research Challenges for an Automotive S
267、upplier231Exploiting connectivity interfaceBluetooth PairingWiFi passthru deviceKeyless entryExploiting internal networkMiller,Valasek attack on JeepSpoofing ECUsImmobilizer attacksThe problem is hard enoughExploiting outdated diagnosticsExploitation of OBD-II connectorFlashing softwareEngine tuning
268、8 of 52 2025 IEEE International Solid-State Circuits ConferenceSecurity Challenges For SDVsISSCC 2025-Forum 6:Privacy and Security Research Challenges for an Automotive Supplier231123Larger Software baseAll functionality in softwareFrequent updatesIncreased connectivity interfacesPowerful nodesMulti
269、ple functions on a single nodeLarge scale connectivityCar2car,V2XConnectivity to cloud infrastructureExploiting connectivity interfaceBluetooth PairingWiFi passthru deviceKeyless entryExploiting outdated diagnosticsExploitation of OBD-II connectorFlashing softwareEngine tuning*Tobias,Klein,“Automoti
270、ve Cross-Domain Security”,Escar Europe 20249 of 52 2025 IEEE International Solid-State Circuits ConferenceISSCC 2025-Forum 6:Privacy and Security Research Challenges for an Automotive SupplierInteresting security challenges unique for SDVsbut not the key focus of this talkarea of significant focus b
271、y academic and industry researchers10 of 52 2025 IEEE International Solid-State Circuits ConferenceSecurity Solution LandscapeISSCC 2025-Forum 6:Privacy and Security Research Challenges for an Automotive SupplierPushing security down towards hardwareHardware based isolationStronger roots of trustDef
272、inition of domains strict domain separationE2E protectionVirtual communication channels-protected to end consumer node using strong cryptoSeparation of key material for different ECUsRemote attestation of softwareSecurity process managementImproved vulnerability managementImproved process flows for
273、security designUpdating automotive security standards for enhanced security*Tobias,Klein,“Automotive Cross-Domain Security”,Escar Europe 2024https:/ van Roermund,“Brighter TogetherSecuring the Future”,ESCAR Europe 202411 of 52 2025 IEEE International Solid-State Circuits ConferenceISSCC 2025-Forum 6
274、:Privacy and Security Research Challenges for an Automotive SupplierPrivacyalso importantnot discussed sufficiently12 of 52 2025 IEEE International Solid-State Circuits ConferencePrivacy ChallengesISSCC 2025-Forum 6:Privacy and Security Research Challenges for an Automotive SupplierDesign Phase IP p
275、rotectionCoopetition,use of Software-in-the-Loop systems,collaborative CI/CD pipelines and third-party compute infrastructure requires robust solutions to protect business IP Design Phase GDPR ComplianceData utilized to train/tune machine learning pipelines in autonomous systems contains significant
276、 amounts of PIIDuring Use Personal DataModern vehicles,directly and indirectly,collect large amount of user-data that is essential for next generation personalized servicesService Phase Workshop AnalyticsAnalytics of data collected during service,while useful for workshops,is subject to legal constr
277、aints due to anti-trust lawsEnd-of-Life Phase Secure RemovalData from multiple components handled prior to decommissioning or second life13 of 52 2025 IEEE International Solid-State Circuits ConferenceISSCC 2025-Forum 6:Privacy and Security Research Challenges for an Automotive SupplierPrivacy probl
278、ems are not all unique to SDVs.problems that exist today can become significantly amplified by the new methodologies,services and architectures14 of 52 2025 IEEE International Solid-State Circuits ConferenceAside Examples of Privacy TechnologiesISSCC 2025-Forum 6:Privacy and Security Research Challe
279、nges for an Automotive SupplierIcons from The Noun Project(Birckhead Creative(Server)Guilherme Furtado(Person)and Pixabay(network)No entity can determine anything about the dataData is split(secret shared)between the parties by all contributorsThird party runs analytics on the split data without com
280、bining them learning nothingMPCSecure Multiparty ComputationTrusted Execution EnvironmentsTEESEESEE15 of 52 2025 IEEE International Solid-State Circuits ConferenceAside Examples of Privacy TechnologiesISSCC 2025-Forum 6:Privacy and Security Research Challenges for an Automotive SupplierStatistical D
281、isclosure ControlSDCAddition of controlled noise to the data16 of 52 2025 IEEE International Solid-State Circuits ConferencePrivacy ChallengesISSCC 2025-Forum 6:Privacy and Security Research Challenges for an Automotive SupplierDesign Phase IP protectionCoopetition,use of Software-in-the-Loop system
282、s,collaborative CI/CD pipelines and third-party compute infrastructure requires robust solutions to protect business IP Design Phase GDPR ComplianceData utilized to train/tune machine learning pipelines in autonomous systems contains significant amounts of PIIDuring Use Personal DataModern vehicles,
283、directly and indirectly,collect large amount of user-data that is essential for next generation personalized servicesService Phase Workshop AnalyticsAnalytics of data collected during service,while useful for workshops,is subject to legal constraints due to anti-trust lawsEnd-of-Life Phase Secure Re
284、movalData from multiple components handled prior to decommissioning or second life17 of 52 2025 IEEE International Solid-State Circuits ConferenceNext Generation Automotive Design-SiLISSCC 2025-Forum 6:Privacy and Security Research Challenges for an Automotive SupplierSiL Software in the LoopAll com
285、ponents virtualizedComplex model-based design Virtualized software-based system designMakes test analysis simplerTesting costs and times are reducedBetter analysis toolchainsTesting AdvantageFast parallel development cyclesReduced hardware costIterative design using partial componentsEfficient Desig
286、n18 of 52 2025 IEEE International Solid-State Circuits ConferenceSiL Architecture Perfect Coopetition ScenarioISSCC 2025-Forum 6:Privacy and Security Research Challenges for an Automotive SupplierAttack surface if we do a standard Threat and Risk Analysis Highly distributed environment for simulatio
287、n Coopetition scenario multiple parties Outsourced infrastructure for multiple pipeline stages Increased number of access points for an adversaryCollaboration requires strong privacy guarantees IP protection,test data,design methodologyProtection during transportationProtection at restProtection dur
288、ing use123Required ProtectionsLarge Threat Surface19 of 52 2025 IEEE International Solid-State Circuits ConferenceISSCC 2025-Forum 6:Privacy and Security Research Challenges for an Automotive SupplierHow do you get parties with competing interests to collaboratewithout extensive legal frameworks and
289、 agreements20 of 52 2025 IEEE International Solid-State Circuits ConferenceResearch Direction Using advanced TEEsISSCC 2025-Forum 6:Privacy and Security Research Challenges for an Automotive SupplierWhat happens in a SEE,remains in the SEEWe can perform any operation in the SEEWe can securely transp
290、ort data into the SEEWe can securely transport data out of the SEESEE Secure Execution Environment21 of 52 2025 IEEE International Solid-State Circuits ConferenceResearch Challenges ImplementationISSCC 2025-Forum 6:Privacy and Security Research Challenges for an Automotive SupplierSecure Multiparty
291、ComputationSecure Hardware ExtensionsHardware .BIOS/FirmwarePrivileged Code(Kernel)User CodeCode .SGXNew Intel Processor InstructionsHardware Boundary ProtectionsSimilar support by several vendors,AMD,ARMResearchers have found vulnerabilities all fixed by IntelSupported by cloud vendors like Azure(G
292、en 1 and Gen 2)other cloud support in progressNeed to trust Intel and implementationIntel Processor Runs natively on processor performance overhead 1.1x-10 xTrust established by explicit verification remote attestationSignificant community attention and standardization efforts in CCC22 of 52 2025 IE
293、EE International Solid-State Circuits ConferenceResearch Challenges IntegrationISSCC 2025-Forum 6:Privacy and Security Research Challenges for an Automotive SupplierProtect critical components during ingest,transfer and storageProtect components during runtime using SEEsCreate secure interface with
294、tooling and simulationIdentify the security critical models and components123423 of 52 2025 IEEE International Solid-State Circuits ConferenceResearch Challenges IntegrationISSCC 2025-Forum 6:Privacy and Security Research Challenges for an Automotive SupplierProtect critical components during ingest
295、,transfer and storageProtect components during runtime using SEEsCreate secure interface with tooling and simulationIdentify the security critical models and components1234What about the software models used for simulations?24 of 52 2025 IEEE International Solid-State Circuits ConferenceNext Generat
296、ion vECU Design CI/CDISSCC 2025-Forum 6:Privacy and Security Research Challenges for an Automotive Supplier*CI/CD Continuous Integration/deploymentThe issue of collaboration exists at all levels of the stack Same story different players and different inputspotential for similar solutions25 of 52 202
297、5 IEEE International Solid-State Circuits ConferencePrivacy ChallengesISSCC 2025-Forum 6:Privacy and Security Research Challenges for an Automotive SupplierDesign Phase IP protectionCoopetition,use of Software-in-the-Loop systems,collaborative CI/CD pipelines and third-party compute infrastructure r
298、equires robust solutions to protect business IP Design Phase GDPR ComplianceData utilized to train/tune machine learning pipelines in autonomous systems contains significant amounts of PIIDuring Use Personal DataModern vehicles,directly and indirectly,collect large amount of user-data that is essent
299、ial for next generation personalized servicesService Phase Workshop AnalyticsAnalytics of data collected during service,while useful for workshops,is subject to legal constraints due to anti-trust lawsEnd-of-Life Phase Secure RemovalData from multiple components handled prior to decommissioning or s
300、econd life26 of 52 2025 IEEE International Solid-State Circuits ConferenceVehicle Data Collection for TrainingISSCC 2025-Forum 6:Privacy and Security Research Challenges for an Automotive Supplier*PII=Personal Identifiable InformationGDPR=General Data Protection RegulationIcons from the Noun Project
301、(Nikita Kozinm)Automated Driving(AD)SystemsStorage ProcessingEnvironment DataPersonal Data Lawful basis for processing PII data Consent of subjects Demonstration of legitimate interestLegal RequirementsStrong privacy guarantees are required to open up data for lawful use by minimizing legal risksCha
302、llengingPrivacy Preserving Computing TechnologyLegal assessmentRequired Protections27 of 52 2025 IEEE International Solid-State Circuits ConferenceResearch DirectionISSCC 2025-Forum 6:Privacy and Security Research Challenges for an Automotive SupplierTransmissionStorageSemantic LabelingTrainingAcqui
303、sitionSecure transfer to processing facilityData acquisitionSeparate storage of PII and non-PIIHuman assisted labelling of collected dataTraining with original and labeled footagePPCTExtensionsData LakePPCTExtensionsProcessingSecure Multiparty ComputationSecure Hardware ExtensionsTEEMPCTEEMPCMPC28 o
304、f 52 2025 IEEE International Solid-State Circuits ConferenceResearch Challenges OptimizationISSCC 2025-Forum 6:Privacy and Security Research Challenges for an Automotive SupplierTransmissionStorageSemantic LabelingTrainingAcquisitionSecure transfer to processing facilityData acquisitionSeparate stor
305、age of PII and non-PIIHuman assisted labelling of collected dataTraining with original and labeled footageSeparation/OptimizationStorageSemantic LabelingTrainingSeparation of image into segments with different protection requirementsSeparate storage data based on protection requirementsSemantic labe
306、lling in an environment with protections based on data classTraining with original and labeled footageMPCMPCTEETEEMPCTEEOpen Research:Creating efficient pipeline from Car to cloudOpen Research:Algorithms utilizing privacy technologies29 of 52 2025 IEEE International Solid-State Circuits ConferenceRe
307、search Challenges OptimizationISSCC 2025-Forum 6:Privacy and Security Research Challenges for an Automotive SupplierTransmissionAcquisitionSecure transfer to processing facilityData acquisitionGPUIPUFPGAHardware ExtensionsDL-specific HardwareOpen Research:Supporting security extensions for DL hardwa
308、reSeparation/OptimizationStorageSemantic LabelingTrainingSeparation of image into segments with different protection requirementsSeparate storage data based on protection requirementsSemantic labelling in an environment with protections based on data classTraining with original and labeled footageMP
309、CMPCTEETEEMPCTEEMax acceptable overhead of 10%for security30 of 52 2025 IEEE International Solid-State Circuits ConferencePrivacy ChallengesISSCC 2025-Forum 6:Privacy and Security Research Challenges for an Automotive SupplierDesign Phase IP protectionCoopetition,use of Software-in-the-Loop systems,
310、collaborative CI/CD pipelines and third-party compute infrastructure requires robust solutions to protect business IP Design Phase GDPR ComplianceData utilized to train/tune machine learning pipelines in autonomous systems contains significant amounts of PIIDuring Use Personal DataModern vehicles,di
311、rectly and indirectly,collect large amount of user-data that is essential for next generation personalized servicesService Phase Workshop AnalyticsAnalytics of data collected during service,while useful for workshops,is subject to legal constraints due to anti-trust lawsEnd-of-Life Phase Secure Remo
312、valData from multiple components handled prior to decommissioning or second life31 of 52 2025 IEEE International Solid-State Circuits ConferencePersonal Data Generation and CollectionISSCC 2025-Forum 6:Privacy and Security Research Challenges for an Automotive Supplier New business models personaliz
313、ed services,insurance services Predictive maintenance Legal requirements accidents/intrusion detection Safety collision avoidanceCore Functionality moving remoteFigure source:C2C Communication ConsortiumFor example cooperative awareness and maneuvering32 of 52 2025 IEEE International Solid-State Cir
314、cuits ConferencePersonal Data Generation and CollectionISSCC 2025-Forum 6:Privacy and Security Research Challenges for an Automotive Supplier33 of 16 GPS coordinates/driving paths Driving behaviour direct/indirect Occupancy data Video/Audio analytic data(internal and external)Environment/surrounding
315、s analytic dataSignificant PII DataImage Source:https:/fpf.org/wp-content/uploads/2017/06/2017_0627-FPF-Connected-Car-Infographic-Version-1.0.pdf 2025 IEEE International Solid-State Circuits ConferenceRequirements for DataISSCC 2025-Forum 6:Privacy and Security Research Challenges for an Automotive
316、SupplierControlConfidentialityTransparencyRestricting data access to authorized parties Use Limitation Principle Security Safeguards PrincipleAllowing users control over what is collected and who it is shared with Collection Limitation Principle Data Quality Principle Purpose Specification Principle
317、 Individual Participation PrincipleProviding user knowledge of how the data is processed,how it is stored and who it is shared with Purpose Specification Principle Use Limitation Principle Openness Principle Accountability Principle34 of 52 2025 IEEE International Solid-State Circuits ConferenceRequ
318、irements for DataISSCC 2025-Forum 6:Privacy and Security Research Challenges for an Automotive SupplierProviding user knowledge of how the data is processed,how it is stored and who it is shared withCurrent state:NonexistentBuried deep within the fine print35 of 52 2025 IEEE International Solid-Stat
319、e Circuits ConferenceRequirements for DataISSCC 2025-Forum 6:Privacy and Security Research Challenges for an Automotive SupplierProviding user knowledge of how the data is processed,how it is stored and who it is shared withCurrent state:NonexistentBuried deep within the fine printDark patternIncorr
320、ect incentiveshttps:/ of 52 2025 IEEE International Solid-State Circuits ConferenceRequirements for DataISSCC 2025-Forum 6:Privacy and Security Research Challenges for an Automotive SupplierProviding user knowledge of how the data is processed,how it is stored and who it is shared withhttps:/foundat
321、ion.mozilla.org/en/privacynotincluded/articles/its-official-cars-are-the-worst-product-category-we-have-ever-reviewed-for-privacy/37 of 52 2025 IEEE International Solid-State Circuits ConferenceRequirements for DataISSCC 2025-Forum 6:Privacy and Security Research Challenges for an Automotive Supplie
322、rProviding user knowledge of how the data is processed,how it is stored and who it is shared withOversight/Laws:Legal frameworks from the government mandating disclosuresIncrease user attention:Privacy certification for automotive similar to safety certificationIncreasing user understanding:Similar
323、to nutrition labels for IoT,App store comparison metricsSolution Space38 of 52 2025 IEEE International Solid-State Circuits ConferenceRequirements for DataISSCC 2025-Forum 6:Privacy and Security Research Challenges for an Automotive SupplierControlConfidentialityTransparencyRestricting data access t
324、o authorized parties Use Limitation Principle Security Safeguards PrincipleAllowing users control over what is collected and who it is shared with Collection Limitation Principle Data Quality Principle Purpose Specification Principle Individual Participation PrincipleProviding user knowledge of how
325、the data is processed,how it is stored and who it is shared with Purpose Specification Principle Use Limitation Principle Openness Principle Accountability Principle39 of 52 2025 IEEE International Solid-State Circuits ConferenceRequirements for DataISSCC 2025-Forum 6:Privacy and Security Research C
326、hallenges for an Automotive SupplierAllowing users control over what is collected and who it is shared withBinary choice all shared or no access to servicesNo time restrictions on sharingBuried controls,multiple users -special problems for sharing scenarios 40 of 52 2025 IEEE International Solid-Sta
327、te Circuits ConferenceRequirements for DataISSCC 2025-Forum 6:Privacy and Security Research Challenges for an Automotive SupplierAllowing users control over what is collected and who it is shared withBinary choice all shared or no access to servicesNo time restrictions on sharingBuried controls,mult
328、iple users -special problems for sharing scenarios https:/mycarmydata.eu/docs/FIA_survey_2016.pdf41 of 52 2025 IEEE International Solid-State Circuits ConferenceRequirements for DataISSCC 2025-Forum 6:Privacy and Security Research Challenges for an Automotive SupplierAllowing users control over what
329、 is collected and who it is shared withBinary choice all shared or no access to servicesNo time restrictions on sharingBuried controls,multiple users -special problems for sharing scenarios Utilize trends/evolution/research in cellphone spaceApplication based access controlAutomatic disabling of unu
330、sed accessDifferent granularity of data collectionSimple mechanism for reset/fleet data management42 of 52 2025 IEEE International Solid-State Circuits ConferenceResearch Direction-ControlISSCC 2025-Forum 6:Privacy and Security Research Challenges for an Automotive SupplierSecurity ServicesIDS/IPS/F
331、leet AnalyticsStatistical Disclosure Control(Differential Privacy,etc)SDCSDCRestricting data access to authorized parties43 of 52 2025 IEEE International Solid-State Circuits ConferenceResearch Challenges-ControlISSCC 2025-Forum 6:Privacy and Security Research Challenges for an Automotive SupplierPe
332、rsonalized servicesVSOCSecurity ServicesIDS/IPS/Fleet AnalyticsStatistical Disclosure Control(Differential Privacy,etc)SDCSDCSDCSDCSDCSupport for multiple use-cases44 of 52 2025 IEEE International Solid-State Circuits ConferencePrivacy ChallengesISSCC 2025-Forum 6:Privacy and Security Research Chall
333、enges for an Automotive SupplierDesign Phase IP protectionCoopetition,use of Software-in-the-Loop systems,collaborative CI/CD pipelines and third-party compute infrastructure requires robust solutions to protect business IP Design Phase GDPR ComplianceData utilized to train/tune machine learning pipelines in autonomous systems contains significant amounts of PIIDuring Use Personal DataModern veh
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