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HBM、類CUBE方案、普通DRAM產品定位對比-行業數據

HBM、類CUBE方案、普通DRAM產品定位對比
HBM、類CUBE方案、普通DRAM產品定位對比
此外 25 年端側 AI 有望放量，其對存儲的要求更傾向于低功耗、高帶寬、小容量，有望催化 CUBE 等堆疊 DRAM 需求。兆易創新等國產廠商有望借助定制化服務優勢，深度受益產業趨勢。
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HBM、類CUBE方案、普通DRAM產品定位對比_第1頁
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HBM、類CUBE方案、普通DRAM產品定位對比_第3頁
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HBM、類CUBE方案、普通DRAM產品定位對比_第4頁
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HBM、類CUBE方案、普通DRAM產品定位對比_第5頁
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HBM、類CUBE方案、普通DRAM產品定位對比_第6頁
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HBM、類CUBE方案、普通DRAM產品定位對比_第7頁
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HBM、類CUBE方案、普通DRAM產品定位對比_第10頁
HBM、類CUBE方案、普通DRAM產品定位對比_第11頁
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HBM、類CUBE方案、普通DRAM產品定位對比_第12頁
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所屬報告： 兆易創新-公司研究報告-利基、定制化DRAM大展宏圖國產存儲龍頭再騰飛-250320（16頁）.pdf
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