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微凸點用于HBM及xPU的芯片間、Interposer電氣連接-行業數據

微凸點用于HBM及xPU的芯片間、Interposer電氣連接
微凸點用于HBM及xPU的芯片間、Interposer電氣連接
(dishing)程度：既要充分去除過量銅，又避免過度拋光造成凹陷或破壞周圍介質層。典型流程是在銅上方有一層阻擋金屬(如TaN)，CMP以高選擇性停止在阻擋層上，然后再輕微拋光露出銅。關鍵設備包括CMP拋光機和在線測厚/終點檢測系統。
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微凸點用于HBM及xPU的芯片間、Interposer電氣連接_第1頁
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所屬報告： 電子行業深度報告：HBM訓練側、推理側需求的共同焦點突破存算協同范式下的“存儲墻”困境-250326（36頁）.pdf
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