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（TSV+凸塊）鍵合方式（左）、Cu-Cu混合鍵合方式（右）-行業數據

（TSV+凸塊）鍵合方式（左）、Cu-Cu混合鍵合方式（右）
（TSV+凸塊）鍵合方式（左）、Cu-Cu混合鍵合方式（右）
1000倍的I/O連接。支持3D封裝和先進的存儲立方體更高的互連密度；
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（TSV+凸塊）鍵合方式（左）、Cu-Cu混合鍵合方式（右）_第1頁
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（TSV+凸塊）鍵合方式（左）、Cu-Cu混合鍵合方式（右）_第4頁
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（TSV+凸塊）鍵合方式（左）、Cu-Cu混合鍵合方式（右）_第5頁
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（TSV+凸塊）鍵合方式（左）、Cu-Cu混合鍵合方式（右）_第14頁
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所屬報告： 半導體行業走進“芯”時代系列之七十六~HBM之“設備材料”深度分析：HBM迭代3D混合鍵合成設備材料發力點-240304（79頁）.pdf
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