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圖80晶圓對晶圓（Wafer-to-Wafer）/裸片對晶圓（Die-to-Wafer）混合鍵合的步驟流程-行業數據

圖80晶圓對晶圓（Wafer-to-Wafer）/裸片對晶圓（Die-to-Wafer）混合鍵合的步驟流程
圖80晶圓對晶圓（Wafer-to-Wafer）/裸片對晶圓（Die-to-Wafer）混合鍵合的步驟流程
類似 HBM，混合鍵合在 NAND 堆疊迭代中同樣起到重要作用，美光與Xperi-Adeia 合作鎖定混合鍵合 IP 技術?；旌湘I合（Hybrid Bonding），主要有兩種使用方式。第一種是晶圓到晶圓，用于 CIS 和 NAND，在這些領域混合鍵合已經證明了其效率。另一種是裸片到晶圓混合鍵合，這比晶圓間鍵合更加困難，但這種工藝變化對于邏輯和 HBM 很有意義。目前行業巨頭如臺積電、三星和英特爾正在競相推進 5 納米及更先進制程技術的開發。
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圖80晶圓對晶圓（Wafer-to-Wafer）/裸片對晶圓（Die-to-Wafer）混合鍵合的步驟流程_第1頁
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圖80晶圓對晶圓（Wafer-to-Wafer）/裸片對晶圓（Die-to-Wafer）混合鍵合的步驟流程_第34頁
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圖80晶圓對晶圓（Wafer-to-Wafer）/裸片對晶圓（Die-to-Wafer）混合鍵合的步驟流程_第37頁
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圖80晶圓對晶圓（Wafer-to-Wafer）/裸片對晶圓（Die-to-Wafer）混合鍵合的步驟流程_第39頁
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圖80晶圓對晶圓（Wafer-to-Wafer）/裸片對晶圓（Die-to-Wafer）混合鍵合的步驟流程_第43頁
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圖80晶圓對晶圓（Wafer-to-Wafer）/裸片對晶圓（Die-to-Wafer）混合鍵合的步驟流程_第56頁
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圖80晶圓對晶圓（Wafer-to-Wafer）/裸片對晶圓（Die-to-Wafer）混合鍵合的步驟流程_第60頁
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圖80晶圓對晶圓（Wafer-to-Wafer）/裸片對晶圓（Die-to-Wafer）混合鍵合的步驟流程_第61頁
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圖80晶圓對晶圓（Wafer-to-Wafer）/裸片對晶圓（Die-to-Wafer）混合鍵合的步驟流程_第62頁
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圖80晶圓對晶圓（Wafer-to-Wafer）/裸片對晶圓（Die-to-Wafer）混合鍵合的步驟流程_第63頁
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圖80晶圓對晶圓（Wafer-to-Wafer）/裸片對晶圓（Die-to-Wafer）混合鍵合的步驟流程_第64頁
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圖80晶圓對晶圓（Wafer-to-Wafer）/裸片對晶圓（Die-to-Wafer）混合鍵合的步驟流程_第65頁
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圖80晶圓對晶圓（Wafer-to-Wafer）/裸片對晶圓（Die-to-Wafer）混合鍵合的步驟流程_第66頁
圖80晶圓對晶圓（Wafer-to-Wafer）/裸片對晶圓（Die-to-Wafer）混合鍵合的步驟流程_第67頁
圖80晶圓對晶圓（Wafer-to-Wafer）/裸片對晶圓（Die-to-Wafer）混合鍵合的步驟流程_第68頁
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圖80晶圓對晶圓（Wafer-to-Wafer）/裸片對晶圓（Die-to-Wafer）混合鍵合的步驟流程_第69頁
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圖80晶圓對晶圓（Wafer-to-Wafer）/裸片對晶圓（Die-to-Wafer）混合鍵合的步驟流程_第70頁
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圖80晶圓對晶圓（Wafer-to-Wafer）/裸片對晶圓（Die-to-Wafer）混合鍵合的步驟流程_第71頁
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圖80晶圓對晶圓（Wafer-to-Wafer）/裸片對晶圓（Die-to-Wafer）混合鍵合的步驟流程_第72頁
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圖80晶圓對晶圓（Wafer-to-Wafer）/裸片對晶圓（Die-to-Wafer）混合鍵合的步驟流程_第73頁
圖80晶圓對晶圓（Wafer-to-Wafer）/裸片對晶圓（Die-to-Wafer）混合鍵合的步驟流程_第74頁
圖80晶圓對晶圓（Wafer-to-Wafer）/裸片對晶圓（Die-to-Wafer）混合鍵合的步驟流程_第75頁
圖80晶圓對晶圓（Wafer-to-Wafer）/裸片對晶圓（Die-to-Wafer）混合鍵合的步驟流程_第76頁
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圖80晶圓對晶圓（Wafer-to-Wafer）/裸片對晶圓（Die-to-Wafer）混合鍵合的步驟流程_第77頁
圖80晶圓對晶圓（Wafer-to-Wafer）/裸片對晶圓（Die-to-Wafer）混合鍵合的步驟流程_第78頁
圖80晶圓對晶圓（Wafer-to-Wafer）/裸片對晶圓（Die-to-Wafer）混合鍵合的步驟流程_第79頁
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圖80晶圓對晶圓（Wafer-to-Wafer）/裸片對晶圓（Die-to-Wafer）混合鍵合的步驟流程_第80頁
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圖80晶圓對晶圓（Wafer-to-Wafer）/裸片對晶圓（Die-to-Wafer）混合鍵合的步驟流程_第81頁
圖80晶圓對晶圓（Wafer-to-Wafer）/裸片對晶圓（Die-to-Wafer）混合鍵合的步驟流程_第82頁
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圖80晶圓對晶圓（Wafer-to-Wafer）/裸片對晶圓（Die-to-Wafer）混合鍵合的步驟流程_第83頁
圖80晶圓對晶圓（Wafer-to-Wafer）/裸片對晶圓（Die-to-Wafer）混合鍵合的步驟流程_第84頁
圖80晶圓對晶圓（Wafer-to-Wafer）/裸片對晶圓（Die-to-Wafer）混合鍵合的步驟流程_第85頁
圖80晶圓對晶圓（Wafer-to-Wafer）/裸片對晶圓（Die-to-Wafer）混合鍵合的步驟流程_第86頁
圖80晶圓對晶圓（Wafer-to-Wafer）/裸片對晶圓（Die-to-Wafer）混合鍵合的步驟流程_第87頁
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圖80晶圓對晶圓（Wafer-to-Wafer）/裸片對晶圓（Die-to-Wafer）混合鍵合的步驟流程_第88頁
圖80晶圓對晶圓（Wafer-to-Wafer）/裸片對晶圓（Die-to-Wafer）混合鍵合的步驟流程_第89頁
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圖80晶圓對晶圓（Wafer-to-Wafer）/裸片對晶圓（Die-to-Wafer）混合鍵合的步驟流程_第91頁
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圖80晶圓對晶圓（Wafer-to-Wafer）/裸片對晶圓（Die-to-Wafer）混合鍵合的步驟流程_第93頁
圖80晶圓對晶圓（Wafer-to-Wafer）/裸片對晶圓（Die-to-Wafer）混合鍵合的步驟流程_第94頁
圖80晶圓對晶圓（Wafer-to-Wafer）/裸片對晶圓（Die-to-Wafer）混合鍵合的步驟流程_第95頁
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所屬報告： 美光科技-美股公司首次覆蓋報告：AI超級周期HBM再啟飛躍-240614（53頁）.pdf
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