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圖表37OCS配套光模塊需改動的光芯片與電芯片設計-行業數據

圖表37OCS配套光模塊需改動的光芯片與電芯片設計
圖表37OCS配套光模塊需改動的光芯片與電芯片設計
數據恢復(CDR)方案。使用 DSP 雖然增加了功耗和延遲，但是方案降低了對光器件和模擬電子元件的要求，通過算法降低雙工鏈路固有的多路干擾，應用 FEC 支持更高的鏈路預算，具有更高的魯棒性和可擴展性。
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圖表37OCS配套光模塊需改動的光芯片與電芯片設計_第1頁
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圖表37OCS配套光模塊需改動的光芯片與電芯片設計_第2頁
圖表37OCS配套光模塊需改動的光芯片與電芯片設計_第3頁
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圖表37OCS配套光模塊需改動的光芯片與電芯片設計_第4頁
圖表37OCS配套光模塊需改動的光芯片與電芯片設計_第5頁
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圖表37OCS配套光模塊需改動的光芯片與電芯片設計_第6頁
圖表37OCS配套光模塊需改動的光芯片與電芯片設計_第7頁
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圖表37OCS配套光模塊需改動的光芯片與電芯片設計_第8頁
圖表37OCS配套光模塊需改動的光芯片與電芯片設計_第9頁
圖表37OCS配套光模塊需改動的光芯片與電芯片設計_第10頁
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圖表37OCS配套光模塊需改動的光芯片與電芯片設計_第11頁
圖表37OCS配套光模塊需改動的光芯片與電芯片設計_第12頁
圖表37OCS配套光模塊需改動的光芯片與電芯片設計_第13頁
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圖表37OCS配套光模塊需改動的光芯片與電芯片設計_第14頁
圖表37OCS配套光模塊需改動的光芯片與電芯片設計_第15頁
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圖表37OCS配套光模塊需改動的光芯片與電芯片設計_第16頁
圖表37OCS配套光模塊需改動的光芯片與電芯片設計_第17頁
圖表37OCS配套光模塊需改動的光芯片與電芯片設計_第18頁
圖表37OCS配套光模塊需改動的光芯片與電芯片設計_第19頁
圖表37OCS配套光模塊需改動的光芯片與電芯片設計_第20頁
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圖表37OCS配套光模塊需改動的光芯片與電芯片設計_第21頁
圖表37OCS配套光模塊需改動的光芯片與電芯片設計_第22頁
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圖表37OCS配套光模塊需改動的光芯片與電芯片設計_第23頁
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圖表37OCS配套光模塊需改動的光芯片與電芯片設計_第24頁
圖表37OCS配套光模塊需改動的光芯片與電芯片設計_第25頁
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圖表37OCS配套光模塊需改動的光芯片與電芯片設計_第26頁
圖表37OCS配套光模塊需改動的光芯片與電芯片設計_第27頁
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圖表37OCS配套光模塊需改動的光芯片與電芯片設計_第28頁
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圖表37OCS配套光模塊需改動的光芯片與電芯片設計_第29頁
圖表37OCS配套光模塊需改動的光芯片與電芯片設計_第30頁
圖表37OCS配套光模塊需改動的光芯片與電芯片設計_第31頁
圖表37OCS配套光模塊需改動的光芯片與電芯片設計_第32頁
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圖表37OCS配套光模塊需改動的光芯片與電芯片設計_第33頁
圖表37OCS配套光模塊需改動的光芯片與電芯片設計_第34頁
圖表37OCS配套光模塊需改動的光芯片與電芯片設計_第35頁
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圖表37OCS配套光模塊需改動的光芯片與電芯片設計_第36頁
圖表37OCS配套光模塊需改動的光芯片與電芯片設計_第37頁
圖表37OCS配套光模塊需改動的光芯片與電芯片設計_第38頁
圖表37OCS配套光模塊需改動的光芯片與電芯片設計_第39頁
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圖表37OCS配套光模塊需改動的光芯片與電芯片設計_第40頁
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圖表37OCS配套光模塊需改動的光芯片與電芯片設計_第41頁
圖表37OCS配套光模塊需改動的光芯片與電芯片設計_第42頁
圖表37OCS配套光模塊需改動的光芯片與電芯片設計_第43頁
圖表37OCS配套光模塊需改動的光芯片與電芯片設計_第44頁
圖表37OCS配套光模塊需改動的光芯片與電芯片設計_第45頁
圖表37OCS配套光模塊需改動的光芯片與電芯片設計_第46頁
圖表37OCS配套光模塊需改動的光芯片與電芯片設計_第47頁
所屬報告： 光通信產業系列報告之一新技術巡禮：深度拆解Google OCS及其產業鏈演進的投資機遇-240125（35頁）.pdf
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