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光芯片晶圓制造、芯片加工與測試工藝流程-行業數據

光芯片晶圓制造、芯片加工與測試工藝流程
光芯片晶圓制造、芯片加工與測試工藝流程
光芯片制造工藝流程繁多，晶體外延環節最關鍵。光芯片的工藝流程可分為外延結構設計、晶圓制造（晶圓外延結構生長、光柵制作、波導光刻與金屬化制程）、芯片加工和測試（解理鍍膜、自動化芯片測試、芯片高頻測試、可靠性測試驗證）三大部分。
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光芯片晶圓制造、芯片加工與測試工藝流程_第1頁
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光芯片晶圓制造、芯片加工與測試工藝流程_第6頁
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光芯片晶圓制造、芯片加工與測試工藝流程_第7頁
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光芯片晶圓制造、芯片加工與測試工藝流程_第8頁
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光芯片晶圓制造、芯片加工與測試工藝流程_第17頁
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光芯片晶圓制造、芯片加工與測試工藝流程_第18頁
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光芯片晶圓制造、芯片加工與測試工藝流程_第19頁
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光芯片晶圓制造、芯片加工與測試工藝流程_第20頁
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光芯片晶圓制造、芯片加工與測試工藝流程_第21頁
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光芯片晶圓制造、芯片加工與測試工藝流程_第22頁
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光芯片晶圓制造、芯片加工與測試工藝流程_第23頁
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光芯片晶圓制造、芯片加工與測試工藝流程_第24頁
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光芯片晶圓制造、芯片加工與測試工藝流程_第25頁
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光芯片晶圓制造、芯片加工與測試工藝流程_第26頁
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光芯片晶圓制造、芯片加工與測試工藝流程_第27頁
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光芯片晶圓制造、芯片加工與測試工藝流程_第28頁
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光芯片晶圓制造、芯片加工與測試工藝流程_第29頁
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光芯片晶圓制造、芯片加工與測試工藝流程_第30頁
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光芯片晶圓制造、芯片加工與測試工藝流程_第31頁
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光芯片晶圓制造、芯片加工與測試工藝流程_第32頁
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光芯片晶圓制造、芯片加工與測試工藝流程_第33頁
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光芯片晶圓制造、芯片加工與測試工藝流程_第34頁
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光芯片晶圓制造、芯片加工與測試工藝流程_第35頁
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光芯片晶圓制造、芯片加工與測試工藝流程_第36頁
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光芯片晶圓制造、芯片加工與測試工藝流程_第37頁
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光芯片晶圓制造、芯片加工與測試工藝流程_第38頁
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光芯片晶圓制造、芯片加工與測試工藝流程_第39頁
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光芯片晶圓制造、芯片加工與測試工藝流程_第40頁
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光芯片晶圓制造、芯片加工與測試工藝流程_第43頁
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光芯片晶圓制造、芯片加工與測試工藝流程_第44頁
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光芯片晶圓制造、芯片加工與測試工藝流程_第45頁
光芯片晶圓制造、芯片加工與測試工藝流程_第46頁
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光芯片晶圓制造、芯片加工與測試工藝流程_第48頁
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光芯片晶圓制造、芯片加工與測試工藝流程_第49頁
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光芯片晶圓制造、芯片加工與測試工藝流程_第53頁
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光芯片晶圓制造、芯片加工與測試工藝流程_第54頁
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光芯片晶圓制造、芯片加工與測試工藝流程_第56頁
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光芯片晶圓制造、芯片加工與測試工藝流程_第60頁
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光芯片晶圓制造、芯片加工與測試工藝流程_第61頁
光芯片晶圓制造、芯片加工與測試工藝流程_第62頁
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光芯片晶圓制造、芯片加工與測試工藝流程_第63頁
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光芯片晶圓制造、芯片加工與測試工藝流程_第64頁
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光芯片晶圓制造、芯片加工與測試工藝流程_第66頁
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光芯片晶圓制造、芯片加工與測試工藝流程_第67頁
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所屬報告： 光學光電子行業深度報告：海外觀察系列九景氣向上從II~VI和Lumentum看光芯片國產化-221217（42頁）.pdf
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